公开(公告)号：US20180100236A1

公开(公告)日：2018-04-12

申请号：US15837893

申请日：2017-12-11

Applicant: Applied Materials, Inc.

Inventor： Neil Morrison ,  Jose Manuel DIEGUEZ-CAMPO ,  Heike LANDGRAF ,  Tobias STOLLEY ,  Stefan HEIN ,  Florian RIES ,  Wolfgang BUSCHBECK

IPC: C23C16/54 ,  H01J37/32 ,  C23C16/455 ,  C23C16/50

Abstract: An apparatus for depositing a thin film on a substrate is described. The apparatus includes a substrate support having an outer surface for guiding the substrate along a surface of the substrate support through a first vacuum processing region and at least one second vacuum processing region, a first deposition sources corresponding to the first processing region and at least one second deposition source corresponding to the at least one second vacuum processing region. The apparatus further includes one or more vacuum flanges providing at least a further gas outlet between the first deposition source and the at least one second deposition source.

公开(公告)号：US09534294B2

公开(公告)日：2017-01-03

申请号：US13965968

申请日：2013-08-13

Applicant: Applied Materials, Inc.

Inventor： Florian Ries ,  Stefan Hein ,  Stefan Lorenz ,  Neil Morrison ,  Tobias Stolley

IPC: C25F1/00 ,  C23C16/44 ,  H01J37/32

CPC classification number: C23C16/4405 ,  H01J37/3277 ,  H01J37/32862 ,  Y10T428/18 ,  Y10T428/192

Abstract: According to the present disclosure, a method for cleaning the processing chamber of a flexible substrate processing apparatus without breaking the vacuum in the processing chamber is provided. The method for cleaning the processing chamber includes guiding a sacrificial foil into the processing chamber; initiating a first pump process in the processing chamber; plasma cleaning the processing chamber while the sacrificial foil is provided in the processing chamber; initiating a second pump process in the processing chamber; and guiding a flexible substrate into the processing chamber.

Abstract translation: 根据本公开，提供了一种用于清洁柔性基板处理设备的处理室而不破坏处理室中的真空的方法。 用于清洁处理室的方法包括将牺牲箔引导到处理室中; 在处理室中启动第一泵过程; 等离子体清洁处理室，同时牺牲箔设置在处理室中; 在处理室中启动第二泵过程; 并将柔性基板引导到处理室中。