公开(公告)号：US20210323118A1

公开(公告)日：2021-10-21

申请号：US16871588

申请日：2020-05-11

Applicant: Applied Materials, Inc.

Inventor： Jagan RANGARAJAN ,  Edward GOLUBOVSKY ,  Jay GURUSAMY ,  Steven M. ZUNIGA

IPC: B24B37/34 ,  B24B37/04 ,  H01L21/67 ,  H01L21/677 ,  H01L21/306 ,  B24B37/30

Abstract: Embodiments herein include high throughput density chemical mechanical polishing (CMP) modules and customizable modular CMP systems formed thereof. In one embodiment, a polishing module features a carrier support module, a carrier loading station, and a polishing station. The carrier support module features a carrier platform and one or more carrier assemblies. The one or more carrier assemblies each comprise a corresponding carrier head suspended from the carrier platform. The carrier loading station is used to transfer substrates to and from the carrier heads. The polishing station comprises a polishing platen. The carrier support module, the substrate loading station, and the polishing station comprise a one-to-one-to-one relationship within each of the polishing modules. The carrier support module is positioned to move the one or more carrier assemblies between a substrate polishing position disposed above the polishing platen and a substrate transfer position disposed above the substrate loading station.

公开(公告)号：US20200043756A1

公开(公告)日：2020-02-06

申请号：US16532730

申请日：2019-08-06

Applicant: Applied Materials, Inc.

Inventor： Jagan RANGARAJAN ,  Adrian BLANK ,  Edward GOLUBOVSKY ,  Balasubramaniam Coimbatore JAGANATHAN ,  Steven M. ZUNIGA ,  Ekaterina MIKHAYLICHENKO ,  Michael A. ANDERSON ,  Jonathan P. DOMIN

IPC: H01L21/67 ,  B08B3/02 ,  B08B5/02 ,  H01L21/687 ,  H01L21/02

Abstract: A cleaning module for cleaning a wafer comprises a wafer gripping device configured to support a wafer in a vertical orientation and comprises a catch cup and a gripper assembly. The catch cup comprises a wall that has an annular inner surface that defines a processing region and has an angled portion that is symmetric about a central axis of the wafer gripping device. The gripper assembly comprises a first plate assembly, a second plate assembly, a plurality of gripping pin, and a plurality of loading pin. The gripping pins are configured to grip a wafer during a cleaning process and the loading pins are configured to grip the wafer during a loading and unloading process. The cleaning module further comprises a sweep arm coupled to a nozzle mechanism configured to deliver liquids to the front and back side of the wafer.