公开(公告)号：US20150237757A1

公开(公告)日：2015-08-20

申请号：US14181518

申请日：2014-02-14

Applicant: Apple Inc.

Inventor： Jason Lor ,  Siddharth Nangia

IPC: H05K7/02

CPC classification number: G06F1/16 ,  G06F1/182

Abstract: An electronic device has an electronic device housing containing electrical components such as integrated circuits and other components. The electronic device housing may be provided with an interconnect stack that has layers of dielectric and metal traces forming signal paths. Electrical components may be mounted on printed circuits. Coupling structures such as screws or other fasteners, washers, standoffs, nuts, springs, and spring-loaded pins may be used in forming signal paths that couple the signal paths of the interconnect stack to components such as buttons, batteries, printed circuits with integrated circuits, displays, and other circuitry.

Abstract translation: 电子设备具有包含集成电路和其它组件等电气部件的电子设备外壳。 电子设备外壳可以设置有互连堆叠，其具有形成信号路径的电介质层和金属迹线层。 电气部件可以安装在印刷电路上。 耦合结构例如螺钉或其他紧固件，垫圈，支座，螺母，弹簧和弹簧加载销可以用于形成将互连堆叠的信号路径耦合到诸如按钮，电池，具有集成的印刷电路的组件的组件的信号路径 电路，显示器和其他电路。

公开(公告)号：US11744476B2

公开(公告)日：2023-09-05

申请号：US16998902

申请日：2020-08-20

Applicant: Apple Inc.

Inventor： Wegene H. Tadele ,  Makiko K. Brzezinski ,  Riley E. Brandt ,  Siddharth Nangia

IPC: A61B5/025 ,  A61B5/022 ,  A61B5/021 ,  A61B5/00 ,  A61B5/024

CPC classification number: A61B5/025 ,  A61B5/02108 ,  A61B5/02141 ,  A61B5/02225 ,  A61B5/02233 ,  A61B5/02405 ,  A61B5/7225

Abstract: A blood pressure measurement device may include one or more piezoelectric sensors (e.g., differential piezoelectric sensors) for detecting blood flow through a limb of a user as part of determining blood pressure measurements. The piezoelectric sensor(s) may additionally or alternatively be used to determine one or more biological parameters of users (e.g., a ballistocardiogram, a heart rate, a heart rate variability, and a pulse wave velocity). The blood pressure measurement device may additionally or alternatively include a capacitive sensor for determining a pressure applied to the limb of the user by the blood pressure measurement device and/or operational states of the blood pressure measurement devices (off-arm, on-arm, inflating, deflating, tightness, and the like).

公开(公告)号：US20180069588A1

公开(公告)日：2018-03-08

申请号：US15257521

申请日：2016-09-06

Applicant: Apple Inc.

Inventor： Yi Jiang ,  Jiangfeng Wu ,  Lijun Zhang ,  Siwen Yong ,  Jiaxiao Niu ,  Mattia Pascolini ,  Jayesh Nath ,  Carlo Di Nallo ,  Zheyu Wang ,  Mario Martinis ,  Eduardo Jorge Da Costa Bras Lima ,  Steven P. Cardinali ,  Rex Tyler Ehman ,  James G. Horiuchi ,  Trevor J. Ness ,  Scott D. Morrison ,  Siddharth Nangia ,  Mushtaq A. Sarwar

IPC: H04B1/40 ,  H05K5/00 ,  H05K5/04 ,  H03K17/96

CPC classification number: H04B1/40 ,  G06F1/1626 ,  G06F1/163 ,  G06F1/1637 ,  G06F1/1658 ,  G06F1/1698 ,  H01Q9/30 ,  H04B1/3888 ,  H04M1/0202

Abstract: An electronic device may have a display cover layer mounted to a metal housing. Electrical component layers such as a display layer, touch sensor layer, and near-field communications antenna layer may be mounted under the display cover layer. An antenna feed may have a positive feed terminal coupled to the electrical component layers and a ground feed terminal coupled to the metal housing. The electrical component layers may serve as an antenna resonating element for an antenna. The antenna may cover cellular telephone bands and may receive satellite navigation system signals. A system-in-package device may be mounted to the metal housing. A flexible printed circuit may extend between the electrical component layers and the system-in-package device. A mounting bracket for the system-in-package device may be provided with electrical isolation to enhance antenna performance in bands such as a satellite navigation system band.

公开(公告)号：US20160270213A1

公开(公告)日：2016-09-15

申请号：US15041033

申请日：2016-02-11

Applicant: APPLE INC.

Inventor： Amir Salehi ,  Vu T. Vo ,  Wyeman Chen ,  Chang Liu ,  Dennis R. Pyper ,  Steven Patrick Cardinali ,  Lan Hoang ,  Siddharth Nangia ,  Meng Chi Lee ,  Takayoshi Katahira

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K3/284 ,  B33Y80/00 ,  H05K1/0224 ,  H05K2201/0141 ,  H05K2201/0715 ,  H05K2201/10242 ,  H05K2201/10318 ,  H05K2201/10969 ,  H05K2201/2036

Abstract: Readily manufactured structures for sealing or encapsulating devices in system-in-a-package modules, such that the modules are easily assembled, have a low-profile, and are space efficient. One example may provide readily manufactured covers for SIP modules. These modules may be easily assembled by attaching the cover to a top side of a substrate. These SIP modules may have a low-profile, for example when their height is reduced using one or more recesses in a bottom surface of a top of the recess, where the one or more recesses are arranged to accept one or more components. These SIP modules may be made space efficient by placing an edge of a cover near an edge of the substrate and connecting the plating of the cover using side plating on, or vias through, the substrate.

Abstract translation: 易于制造的结构，用于将封装或封装在系统级封装模块中，使得模块易于组装，具有薄型，并且具有空间效率。 一个示例可以提供用于SIP模块的容易制造的盖。 这些模块可以通过将盖附接到基板的顶侧来容易地组装。 这些SIP模块可以具有低轮廓，例如当使用凹部的顶部的底部表面中的一个或多个凹部来减小其高度时，其中一个或多个凹部布置成接受一个或多个部件。 这些SIP模块可以通过将盖的边缘放置在基板的边缘附近并且使用侧板或通孔穿过基板来连接盖的镀层来实现空间效率。