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公开(公告)号：US20200351593A1
公开(公告)日：2020-11-05
申请号：US16889630
申请日：2020-06-01
Applicant: Apple Inc.
Inventor： Michael B. Nussbaum , Roderick B. Hogan , Todd K. Moyer
IPC: H04R9/06 , H03F3/217 , H03K19/094 , H04R1/10 , H03K5/156
Abstract: A hearable has an audio amplifier circuit coupled to a speaker as a load. The amplifier circuit has current source drive, which attenuates electromagnetically coupled noise of the speaker. In other instances, the amplifier circuit has a first amplifier mode and a second amplifier mode, wherein in the first amplifier mode the amplifier circuit becomes configured to drive the speaker as a voltage source, and in the second amplifier mode the amplifier circuit becomes configured to drive the speaker as a current source. Control logic varies the amplifier circuit between i) the first amplifier mode for larger amplitudes of the audio signal, and ii) the second amplifier mode for smaller amplitudes of the audio signal. Other aspects are also described and claimed.
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公开(公告)号：US10827273B2
公开(公告)日：2020-11-03
申请号：US16698136
申请日：2019-11-27
Applicant: Apple Inc.
Inventor： Michael B. Nussbaum , Jason C. Della Rosa , Glenn K. Trainer
Abstract: Electronics devices according to embodiments of the present technology may include a first loudspeaker and a second loudspeaker disposed in a housing. The housing may define a first internal volume between a first end of the housing and a backside of the first loudspeaker. The housing may define a second internal volume between a second end of the housing and a backside of the second loudspeaker. The first loudspeaker and the second loudspeaker may be positioned within the housing so a front side of the first loudspeaker faces a front side of the second loudspeaker. A duct may be defined by the housing, which may access the first internal volume at a first end and may access the second internal volume at a second end. The electronic device may also include a processor configured to deliver signals to the first loudspeaker and the second loudspeaker.
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公开(公告)号：US20200329559A1
公开(公告)日：2020-10-15
申请号：US16914131
申请日：2020-06-26
Applicant: Apple Inc.
Inventor： Daniel D. Sunshine , David M. Kindlon , Michael B. Nussbaum , Andrew L. Rosenberg , Andrew Sterian , Breton M. Saunders , Christopher A. Schultz , David A. Bolt , Mark J. Beesley , Peter W. Mash , Steven Keating , Chang Liu , Lan Hoang
Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.
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公开(公告)号：US10701802B2
公开(公告)日：2020-06-30
申请号：US16685846
申请日：2019-11-15
Applicant: Apple Inc.
Inventor： Daniel D. Sunshine , David M. Kindlon , Michael B. Nussbaum , Andrew L. Rosenberg , Andrew Sterian , Breton M. Saunders , Christopher A. Schultz , David A. Bolt , Mark J. Beesley , Peter W. Mash , Steven Keating , Chang Liu , Lan Hoang
IPC: H05K1/00 , H05K1/03 , D03D1/00 , H01L23/498 , H05K1/02 , H01L23/31 , H05K1/11 , H05K1/18 , A41D1/00
Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.
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公开(公告)号：US20230096741A1
公开(公告)日：2023-03-30
申请号：US17482287
申请日：2021-09-22
Applicant: Apple Inc.
Inventor： Chongli Cai , Dingkun Du , Michael B. Nussbaum
Abstract: A power converter circuit included in a computer system may include multiple devices and a switch node coupled to a regulated power supply node via an inductor. During a first time period, the power converter charges a capacitor, and the couples the capacitor to the switch node during a second time period. During a third time period the power converter couples the switch node to an input power supply node. To maintain constant charge delivered to the load during each time the switch node is coupled to the input power supply node, the duration of the third time period is adjusted based on a voltage level of the input power supply node, a voltage level of the regulated power supply node, a value of the inductor, and the durations of first and second time periods.
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Patent Agency Ranking
公开(公告)号：US20220346228A1
公开(公告)日：2022-10-27
申请号：US17860839
申请日：2022-07-08
Applicant: Apple Inc.
Inventor： Daniel D. Sunshine , David M. Kindlon , Michael B. Nussbaum , Andrew L. Rosenberg , Andrew Sterian , Breton M. Saunders , Christopher A. Schultz , David A. Bolt , Mark J. Beesley , Peter W. Mash , Steven Keating , Chang Liu , Lan Hoang
Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.
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公开(公告)号：US20210185808A1
公开(公告)日：2021-06-17
申请号：US17184927
申请日：2021-02-25
Applicant: Apple Inc.
Inventor： Daniel D. Sunshine , David M. Kindlon , Michael B. Nussbaum , Andrew L. Rosenberg , Andrew Sterian , Breton M. Saunders , Christopher A. Schultz , David A. Bolt , Mark J. Beesley , Peter W. Mash , Steven Keating , Chang Liu , Lan Hoang
Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.
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公开(公告)号：US20210051411A1
公开(公告)日：2021-02-18
申请号：US17086716
申请日：2020-11-02
Applicant: Apple Inc.
Inventor： Michael B. Nussbaum , Jason C. Della Rosa , Glenn K. Trainer
Abstract: Electronics devices according to embodiments of the present technology may include a first loudspeaker and a second loudspeaker disposed in a housing. The housing may define a first internal volume between a first end of the housing and a backside of the first loudspeaker. The housing may define a second internal volume between a second end of the housing and a backside of the second loudspeaker. The first loudspeaker and the second loudspeaker may be positioned within the housing so a front side of the first loudspeaker faces a front side of the second loudspeaker. A duct may be defined by the housing, which may access the first internal volume at a first end and may access the second internal volume at a second end. The electronic device may also include a processor configured to deliver signals to the first loudspeaker and the second loudspeaker.
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公开(公告)号：US10750268B2
公开(公告)日：2020-08-18
申请号：US16114148
申请日：2018-08-27
Applicant: Apple Inc.
Inventor： Zhigang Dang , Michael B. Nussbaum
Abstract: A case for a pair of earbuds including a housing having first and second cavities formed within the housing, the first cavity configured to receive a first earbud in the pair of earbuds and the second cavity configured to receive a second earbud in the pair of earbuds; a lid attached to the housing; a first pair of electrodes positioned within the housing adjacent to the first cavity; a second pair of electrodes positioned within the housing adjacent to the second cavity; and charging circuitry coupled to the first and second pairs of electrodes, the charging circuitry including a high frequency inverter configured to receive a DC power signal and output a high frequency AC signal to each of the first and second pairs of electrodes.
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公开(公告)号：US20200169812A1
公开(公告)日：2020-05-28
申请号：US16698136
申请日：2019-11-27
Applicant: Apple Inc.
Inventor： Michael B. Nussbaum , Jason C. Della Rosa , Glenn K. Trainer
Abstract: Electronics devices according to embodiments of the present technology may include a first loudspeaker and a second loudspeaker disposed in a housing. The housing may define a first internal volume between a first end of the housing and a backside of the first loudspeaker. The housing may define a second internal volume between a second end of the housing and a backside of the second loudspeaker. The first loudspeaker and the second loudspeaker may be positioned within the housing so a front side of the first loudspeaker faces a front side of the second loudspeaker. A duct may be defined by the housing, which may access the first internal volume at a first end and may access the second internal volume at a second end. The electronic device may also include a processor configured to deliver signals to the first loudspeaker and the second loudspeaker.
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