Abstract:
A microelectromechanical systems (MEMS) element and a MEMS optical switch are described. The MEMS element comprises a crystalline and moveable element is moveably attached to the substrate. The moveable element includes a perpendicular portion oriented substantially perpendicular to a plane of the substrate. The crystal structure of the perpendicular portion and substrate are substantially similar. The moveable element is capable of motion substantially constrained to a plane oriented substantially perpendicular to a plane of the substrate. In at least one position, a part of a perpendicular portion of the moveable element projects beyond a surface of the substrate. The moveable element may be retained in place by a latch. An array of such structures can be implemented to work as an optical switch. The optical switch may comprise a crystalline substrate and one or more moveable elements moveably attached to the substrate. The various embodiments provide for a robust and reliable MEMS elements that may be simply fabricated and densely packed.
Abstract:
The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a structure on a single crystal silicon layer separated by an insulator layer from a substrate layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilcon forming mechanical or optical elements of the structure; exposing a selected area of the single crystal silicon layer; and releasing the formed structure.
Abstract:
A sensor device that includes an integrated sensor assembly having a surface acoustic wave (SAW) sensor disposed on a piezoelectric substrate. The SAW sensor is adapted to measure an environmental condition of an environment in response to an RF signal. The SAW sensor includes an interdigitated transducer (IDT) formed on a substrate having at least a layer of a piezoelectric material. The SAW sensor includes either one or more SAW reflectors of a second IDT formed on the piezoelectric material. The SAW sensor further includes an RF antenna formed on the piezoelectric material. The SAW sensor and the RF antenna are integrated with one another on the piezoelectric material.
Abstract:
The invention provides a sensor for determining when a latch for securing an engine cowl on an aircraft is secured by detecting the proximity of a latch hook and a latch pin. The sensor includes a resonant circuit configured and adapted to transmit a status signal when the latch is in a secured state. The sensor also includes a means for conveying status information of the latch to a location remote from the latch based on the status signal, the conveying means being operably connected to the resonant circuit. The invention also provides a method of determining when a latch is open or secured by detecting the proximity of a latch hook and a latch pin.
Abstract:
The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a structure on a single crystal silicon layer separated by an insulator layer from a substrate layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilicon forming mechanical or optical elements of the structure; exposing a selected area of the single crystal silicon layer; and releasing the formed structure.
Abstract:
A semiconductor structure includes a substrate, a sacrificial layer formed on or over the substrate, and a structural layer formed on or over the sacrificial layer. At least one opening is formed in the structural layer. At least one opening is formed in the sacrificial layer below the at least one opening in the structural layer. The at least one opening in the structural layer and the at least one opening in the sacrificial layer are at least partially filled with a filler material. At least one portion of the structural layer is removed to define at least one microstructure. The sacrificial layer is removed such that the at least one microstructure is released from the substrate and the filler material forms one or more protrusions on the at least one microstructure, and/or one or more anchors anchoring the at least one microstructure to the substrate.
Abstract:
Health and usage monitoring systems for aircraft hoist systems are described herein. In some embodiments, a health and usage monitoring system comprises a capacitive load cell and a processing unit for communication with the capacitive load cell, the capacitive load cell comprising a load receiving surface and a capacitive assembly coupled to the load receiving surface, the capacitive assembly comprising parallel electrically conductive plates separated by a reversibly deformable spacer construction wherein the parallel plates comprise aligned apertures providing a passageway through the capacitive assembly for the hoist system cable.
Abstract:
A strain sensor device for measuring loads on aircraft landing gear. This is done by measuring strains in the lower end of the strut, by which we infer the loading in the entire landing gear structure. These strains can be very large (as high as 10,000 microstrain) and can be imposed in numerous random directions and levels. The present invention includes a removable sensor assembly. An electromechanical means is presented that can accommodate large strains, be firmly attached to the strut, and provide good accuracy and resolution.
Abstract:
A strain sensor device for measuring loads on aircraft landing gear. This is done by measuring strains in the lower end of the strut, by which we infer the loading in the entire landing gear structure. These strains can be very large (as high as 10,000 microstrain) and can be imposed in numerous random directions and levels. The present invention includes a removable sensor assembly. An electromechanical means is presented that can accommodate large strains, be firmly attached to the strut, and provide good accuracy and resolution.
Abstract:
A microelectromechanical (MEMS) apparatus has a base and a flap with a portion coupled to the base so that the flap may move out of the plane of the base between first and second position. The base may have a cavity with largely vertical sidewalls that contact a portion of the flap when the flap is in the second position Electrodes may be placed on the vertical sidewalls and electrically isolated from the base to provide electrostatic clamping of the flap to the sidewall. The base may be made from a substrate portion of a silicon-on-insulator (SOI) wafer and the flap defined from a device layer of the SOI wafer. The flap may be connected to the base by one or more flexures such as torsional beams. An array of one or more of such structures may be used to form an optical switch.