公开(公告)号：US20140335634A1

公开(公告)日：2014-11-13

申请号：US14445663

申请日：2014-07-29

Applicant: ASAHI GLASS COMPANY, LIMITED

Inventor： Wataru KASAI ,  Yoshiaki HIGUCHI ,  Masakazu ATAKU ,  Daisuke TAGUCHI ,  Satoshi OTSUGU

IPC: H01L33/56 ,  B29C43/50 ,  H01L33/58 ,  C08F214/26 ,  C08F10/06 ,  B29C43/18 ,  B29C37/00

CPC classification number: H01L33/56 ,  B29C33/56 ,  B29C33/68 ,  B29C37/0075 ,  B29C43/021 ,  B29C43/18 ,  B29C43/50 ,  B29C45/14655 ,  B29C2043/182 ,  B29C2043/3444 ,  B29C2045/14663 ,  B29K2083/00 ,  B29K2827/12 ,  B29L2011/0016 ,  B29L2031/3406 ,  B29L2031/3481 ,  C08F10/06 ,  C08F214/265 ,  C08J5/18 ,  C08J2327/18 ,  H01L21/566 ,  H01L24/97 ,  H01L33/58 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2924/00

Abstract: A mold release film, which is adapted to be disposed on the cavity surface of a mold to form a resin-encapsulated portion by encapsulating a semiconductor element of a semiconductor device with a curable encapsulation resin, has a tensile modulus of elasticity of from 10 to 24 MPa at 132° C. as measured in accordance with JIS K 7127, and a peak peel resistance of at most 0.8 N/25 mm.

Abstract translation: 适于通过用可固化密封树脂封装半导体器件的半导体元件而适于设置在模具的空腔表面上以形成树脂封装部分的脱模膜的拉伸弹性模量为10至 根据JIS K 7127测定，在132℃下为24MPa，峰值剥离阻力为0.8N / 25mm以下。