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    Audio jack connector integrated into enclosure
    11.
    发明授权
    Audio jack connector integrated into enclosure 有权
    音频插孔连接器集成到外壳中

    公开(公告)号：US09363343B2

    公开(公告)日：2016-06-07

    申请号：US14473781

    申请日：2014-08-29

    Applicant: Apple Inc.

    Inventor： Matthew P. Rao ,  Stefan C. Mag ,  Trent K. Do

    IPC: H01R13/502 ,  H01R13/514 ,  H04M1/02 ,  H04B1/3888 ,  H04B1/38

    CPC classification number: H04M1/0274 ,  H04B1/3888 ,  H04B2001/3894

    Abstract: An electronic device enclosure that includes a housing and a frame and an integrally formed connector shell. The connector shell includes a first portion integrally formed with the housing and a second portion integrally formed with the frame. The first and second portions of the connector shell are joined at first and second mating surfaces, respectively, forming a cavity therebetween in which a plurality of receptacle connector contacts are positioned.

    Abstract translation: 一种包括壳体和框架以及整体形成的连接器壳体的电子设备外壳。 连接器壳体包括与壳体一体形成的第一部分和与框架一体形成的第二部分。 连接器壳体的第一和第二部分分别在第一和第二配合表面处连接，在其间形成有多个插座连接器触点的腔室。

    CONNECTOR CONTACTS WITH THERMALLY CONDUCTIVE POLYMER
    12.
    发明申请
    CONNECTOR CONTACTS WITH THERMALLY CONDUCTIVE POLYMER 有权
    连接器与导热聚合物接触

    公开(公告)号：US20140141647A1

    公开(公告)日：2014-05-22

    申请号：US13679036

    申请日：2012-11-16

    Applicant: APPLE INC.

    Inventor： Trent K. Do

    IPC: H01R13/405 ,  H01R43/20

    CPC classification number: H01R13/405 ,  H01R13/6594 ,  H01R43/24 ,  Y10T29/49222

    Abstract: An improved electronic receptacle connector employs contacts that are partially encapsulated with a thermally conductive polymer. The thermally conductive polymer aids in the distribution of heat within the contact and may further form heat transfer features to conduct heat to other connector components such as the shell. The thermally conductive polymer may be used to encapsulate multiple contacts within a substantially unitary block.

    Abstract translation: 改进的电子插座连接器采用部分被导热聚合物包封的触点。 导热聚合物有助于接触中的热量分布，并且可以进一步形成传热特征以将热量传导到诸如壳体的其它连接器部件。 导热聚合物可以用于将多个接触件封装在基本上单一的块内。

    SIM CARD CONNECTOR WITH INTEGRATED EJECTION MECHANISM
    14.
    发明申请
    SIM CARD CONNECTOR WITH INTEGRATED EJECTION MECHANISM 审中-公开
    具有集成喷射机构的SIM卡连接器

    公开(公告)号：US20170070002A1

    公开(公告)日：2017-03-09

    申请号：US15009767

    申请日：2016-01-28

    Applicant: APPLE INC.

    Inventor： Trent K. Do ,  Jason S. Sloey

    IPC: H01R13/635 ,  H04B1/3818

    CPC classification number: H01R13/635 ,  G06K13/0818 ,  G06K13/0831 ,  H04B1/3818 ,  H04B2001/3894

    Abstract: A SIM card connector has an integrated SIM card tray ejection mechanism. The ejection mechanism is contained within the connector and includes a pushrod that is disposed in a slot adjacent a SIM card tray cavity. The pushrod is configured to apply a force against an ejector arm when the ejection mechanism is activated. In response, the ejector arm rotates about a pivot and applies an ejection force to the SIM card tray causing the tray to eject from the cavity.

    Abstract translation: SIM卡连接器具有集成的SIM卡托盘弹出机构。 弹出机构包含在连接器内，并且包括设置在与SIM卡盘腔相邻的槽中的推杆。 推杆被构造成当弹出机构被启动时向推杆施加力。 作为响应，推出器臂围绕枢轴旋转并且向SIM卡托盘施加弹出力，导致托盘从空腔中弹出。

    SURFACE CONNECTOR WITH SILICONE SPRING MEMBER
    15.
    发明申请
    SURFACE CONNECTOR WITH SILICONE SPRING MEMBER 有权
    表面连接器与硅胶弹簧会员

    公开(公告)号：US20170069995A1

    公开(公告)日：2017-03-09

    申请号：US14845084

    申请日：2015-09-03

    Applicant: APPLE INC.

    Inventor： Trent K. Do

    IPC: H01R13/42

    CPC classification number: H01R13/42 ,  H01R13/08 ,  H01R13/2428 ,  H01R13/521

    Abstract: Contact structures for devices, where contacts in the contact structures provide a proper normal force while consuming a minimal amount of surface area, depth, and volume in a device and where the contact structures prevent or limit the ingress of fluid or debris into the device. On example may provide a contact structure having a frame. The frame may be arranged to be placed in an opening in a device enclosure for an electronic device or the frame may be part of the electronic device. The frame may include a number of passages, each passage for a contact of the contact structure. Each contact may be held to the frame by a pliable membrane. Each contact may connect to a board in the electronic device via a compliant conductive path.

    Abstract translation: 用于装置的接触结构，其中接触结构中的触点提供适当的法向力，同时消耗装置中的最小量的表面积，深度和体积，并且其中接触结构防止或限制流体或碎屑进入装置。 例如，可提供具有框架的接触结构。 框架可以布置成放置在用于电子设备的设备外壳的开口中，或者框架可以是电子设备的一部分。 框架可以包括多个通道，每个通道用于接触结构的接触。 每个接触可以通过柔韧的膜保持在框架上。 每个触点可以经由柔性导电路径连接到电子设备中的板。

    PRINTED CIRCUIT BOARD CONNECTOR FOR NON-PLANAR CONFIGURATIONS
    18.
    发明申请
    PRINTED CIRCUIT BOARD CONNECTOR FOR NON-PLANAR CONFIGURATIONS 有权
    用于非平面配置的印刷电路板连接器

    公开(公告)号：US20160028173A1

    公开(公告)日：2016-01-28

    申请号：US14444424

    申请日：2014-07-28

    Applicant: Apple Inc.

    Inventor： Nathan P. Bosscher ,  Craig M. Stanley ,  Trent K. Do ,  John J. Baker ,  Phillip M. Hobson ,  Brad G. Boozer

    IPC: H01R12/73 ,  H05K3/36 ,  H01R12/72

    CPC classification number: H01R12/732 ,  H01R12/722 ,  H01R35/04 ,  H05K1/038 ,  H05K1/14 ,  H05K1/148 ,  H05K3/36 ,  H05K2201/09027 ,  H05K2201/10189

    Abstract: A mesh network of printed circuit boards (PCBs) including a first PCB coupled to a second rigid PCB by way of an interlocking connection is provided. The interlocking connection has a degree of freedom that allows the first and second PCBs to form a twist angle between each other; the interlocking connector configured to provide electrical coupling between active components disposed in each of the first and second PCBs. A method of forming a substrate fabric including a mesh network as above is also provided. Further provided is a method of activating the mesh network of printed circuit boards as above.

    Abstract translation: 提供了包括通过互锁连接耦合到第二刚性PCB的第一PCB的印刷电路板（PCB）的网状网络。 互锁连接具有允许第一和第二PCB彼此之间形成扭转角度的自由度; 所述互锁连接器被配置为在布置在所述第一和第二PCB中的每一个中的有源部件之间提供电耦合。 还提供了如上所述形成包括网状网络的基底织物的方法。 还提供如上所述的激活印刷电路板的网状网络的方法。

    SURFACE CONNECTOR WITH SILICONE SPRING MEMBER
    20.
    发明申请
    SURFACE CONNECTOR WITH SILICONE SPRING MEMBER 有权

    公开(公告)号：US20170133785A1

    公开(公告)日：2017-05-11

    申请号：US15274176

    申请日：2016-09-23

    Applicant: Apple Inc.

    Inventor： Daniel C. Wagman ,  Eric S. Jol ,  Trent K. Do

    IPC: H01R13/52 ,  H01R13/24 ,  H01R13/15 ,  H01R12/53 ,  H01R4/02

    CPC classification number: H01R13/521 ,  H01R4/02 ,  H01R12/53 ,  H01R12/714 ,  H01R13/08 ,  H01R13/15 ,  H01R13/2428 ,  H01R13/2478

    Abstract: Contact structures for devices, where contacts in the contact structures may provide a sufficient normal force to provide a good electrical connection with corresponding contacts while consuming a minimal amount of surface area, depth, and volume in a device, and where the contact structures may prevent or limit the ingress of fluid or debris into the device. On example may provide a contact structure having a frame. The frame may be arranged to be placed in an opening in a device enclosure for an electronic device or the frame may be part of the electronic device. The frame may include a number of passages, each passage for a contact of the contact structure. Each contact may be held to the frame by a pliable membrane. Each contact may connect to a board in the electronic device via a compliant conductive path.

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