公开(公告)号：US20200280785A1

公开(公告)日：2020-09-03

申请号：US16878547

申请日：2020-05-19

Applicant: Apple Inc.

Inventor： Jared M. Kole ,  Daniel R. Bloom ,  Audrey L. Sheng ,  Tian Shi Li ,  Eugene Antony Whang

IPC: H04R1/10

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US20200280784A1

公开(公告)日：2020-09-03

申请号：US16878536

申请日：2020-05-19

Applicant: Apple Inc.

Inventor： Jason J. LeBlanc ,  Daniel R. Bloom ,  Edward Siahaan ,  Phillip Qian ,  Lee M. Panecki ,  Eugene Antony Whang ,  Jared M. Kole ,  Audrey L. Sheng ,  Tian Shi Li

IPC: H04R1/10

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US12063466B2

公开(公告)日：2024-08-13

申请号：US17895028

申请日：2022-08-24

Applicant: APPLE INC.

Inventor： Benjamin A. Cousins ,  Jarrett Lagler ,  Dirk Schmelzer ,  Sebastien D. de Rivaz ,  Tian Shi Li ,  Phillip Qian ,  Rebecca Russell ,  Jeyakkrishnan Chengleput Srinivasan ,  Jue Wang ,  Jerzy S. Guterman ,  Joel C. Yamasaki

IPC: H04R1/10 ,  G06F3/041 ,  G06F3/044 ,  H02J7/00 ,  H04R1/02

CPC classification number: H04R1/1016 ,  G06F3/04144 ,  G06F3/044 ,  H02J7/0044 ,  H04R1/023 ,  H04R1/1025 ,  H04R1/1041 ,  H04R1/1058 ,  H04R1/1075 ,  H04R2420/07 ,  H04R2460/11

Abstract: A charging case for a pair of wireless earphones comprising: a housing having a peripheral wall that defines a shell; a frame insert coupled to the housing and extending into the shell, the frame insert having one or more insert walls that define first and second pockets sized and shaped to accept first and second wireless earphones, respectively, wherein the one or more insert walls cooperate with the housing primary wall to define a sealed chamber within the charging case; a lid coupled to the housing and operable between a closed position in which the lid covers the first and second pockets and an open position in which the first and second pockets are exposed; a speaker module disposed within the sealed chamber, the speaker module comprising an audio driver having a diaphragm that separates a front volume of the audio driver from a back volume of the audio driver and a speaker vent disposed within the back volume; one or more first openings formed through the peripheral wall and opening into the front volume, wherein the audio driver is positioned and aligned to emit sound into the front volume and through the one or more acoustic openings; and one or more second openings formed through the peripheral wall at a location spaced apart from the front volume, wherein at least one of the one or more second openings is an acoustic vent acoustically coupled to the back volume of the audio driver through the speaker vent ear tip.

公开(公告)号：US11665462B1

公开(公告)日：2023-05-30

申请号：US17447895

申请日：2021-09-16

Applicant: Apple Inc.

Inventor： Jason Joseph LeBlanc ,  Rohan Gupta ,  Robert D. Zupke ,  Todd K. Moyer ,  Cuneyt Bakan ,  Brooke L. Bunney ,  Justin T. Ng ,  Jeff A. Kalt ,  Tian Shi Li ,  Lionel B. Barrow

IPC: H04R1/10

CPC classification number: H04R1/1041 ,  H04R1/1066 ,  H04R1/1091

Abstract: A detachable headband for a headphone system can incorporate a headband identification circuit that stores or encodes a headband identification parameter value. When the headband becomes attached to an ear cup, the headband can transmit the headband identification parameter value to the ear cup.

公开(公告)号：US20220085843A1

公开(公告)日：2022-03-17

申请号：US17469001

申请日：2021-09-08

Applicant: Apple Inc.

Inventor： Daniel R. Bloom ,  Chelsea E. Wojeski ,  Edward Siahaan ,  Nathan Morris ,  Ryan S. Haley ,  Tian Shi Li ,  Toni Ristoski

IPC: H04B1/3827

Abstract: An electronic device component including a thermoset composite material is described herein. The electronic device component may be a structural component of the housing and define an exterior surface of the housing. The electronic device component may also be transparent to radio-frequency signals.

公开(公告)号：US11252492B2

公开(公告)日：2022-02-15

申请号：US16878547

申请日：2020-05-19

Applicant: Apple Inc.

Inventor： Jared M. Kole ,  Daniel R. Bloom ,  Audrey L. Sheng ,  Tian Shi Li ,  Eugene Antony Whang

IPC: H04R1/10 ,  H04R5/033 ,  H04R5/04 ,  G10K11/178

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US11134328B2

公开(公告)日：2021-09-28

申请号：US16878556

申请日：2020-05-19

Applicant: Apple Inc.

Inventor： Jared M. Kole ,  Daniel R. Bloom ,  Audrey L. Sheng ,  Tian Shi Li ,  Eugene Antony Whang ,  Edward Siahaan ,  Phillip Qian ,  Alex C. Hellwig ,  Oliver M. Hewitt ,  Yuta Kuboyama ,  Christopher S. Erickson ,  Sneha Kadetotad ,  Edwin J. Corona Aparicio ,  Rajesh Anantharaman ,  Jacob E. Mattingley ,  Tsu-Hui Lin ,  Robert D. Zupke ,  Dustin A. Hatfield ,  Axit H. Patel

IPC: H04R1/10 ,  H04R5/033 ,  H04R5/04 ,  G10K11/178

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US10310157B2

公开(公告)日：2019-06-04

申请号：US15268200

申请日：2016-09-16

Applicant: Apple Inc.

Inventor： Timothy J. Rasmussen ,  Ian P. Colahan ,  Darshan R. Kasar ,  Tian Shi Li

IPC: F21V8/00 ,  H01M10/44 ,  H01M10/48 ,  H02J7/00 ,  H04B1/3888

Abstract: An accessory device is disclosed. The accessory device may include a light guide assembly that directs light from a light source (or sources) through an opening of the accessory device, and in particular, in a base portion of the accessory device. The light guide assembly may be disposed in a compartment of the accessory device and include a light guide body as well as a light guide insert disposed in an opening of the light guide body. To form the opening, a single cutting operation may cut through the base portion and the light guide body so that the respective openings of the base portion and the light guide body are aligned. The light guide body may be designed to receive the light from the light source and direct or focus the light toward the light guide insert. The light guide insert may refract, scatter, and/or diffuse the light.