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公开(公告)号：US09913045B2
公开(公告)日：2018-03-06
申请号：US15132136
申请日：2016-04-18
Applicant: APPLE INC.
Inventor： Lee E. Hooton , Robert F. Meyer
CPC classification number: H04R17/005 , H04R1/227 , H04R7/04 , H04R7/045 , H04R7/18 , H04R7/20 , H04R2307/201 , H04R2499/11 , H04R2499/15
Abstract: An electronic device has an exterior housing with a piezoelectric speaker disposed in an opening formed within the housing. The piezoelectric speaker includes a speaker diaphragm that is secured within the opening with a vibration isolator. The vibration isolator allows the diaphragm to vibrate independently from the housing.
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公开(公告)号：US20230421677A1
公开(公告)日：2023-12-28
申请号：US18243448
申请日：2023-09-07
Applicant: Apple Inc.
Inventor： Jon F. Housour , Macey E. Dade , Benjamin R. Gray , Reema Shalan , Daniel W. Jarvis , Jason P. Shannon , Marwan Rammah , Robert F. Meyer , Richard H. Koch , Lee E. Hooton , Christopher S. Tomasetta
IPC: H04M1/02
CPC classification number: H04M1/0266
Abstract: A mobile phone may include a housing. The housing may include a first housing component including a cladding portion formed from a first metal and defining a first portion of a side exterior surface of the mobile phone, and a core portion coupled to the cladding portion, the core portion defining a portion of an interior surface of the mobile phone and formed from a second metal different from the first metal, a second housing component defining a second portion of the side exterior surface of the mobile phone, and a joint structure coupled to the first housing component and the second housing component and defining a third portion of the side exterior surface of the mobile phone between the first portion of the side exterior surface and the second portion of the side exterior surface. The cladding portion may be bonded directly to the core portion.
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公开(公告)号：USD947853S1
公开(公告)日：2022-04-05
申请号：US29802000
申请日：2021-08-02
Applicant: Apple Inc.
Designer： Jody Akana , Molly Anderson , Bartley K. Andre , Shota Aoyagi , Anthony Michael Ashcroft , Marine C. Bataille , Jeremy Bataiilou , Daniele De Iuliis , Markus Diebel , M. Evans Hankey , Julian Hoenig , Lee E. Hooton , Richard P. Howarth , Jonathan P. Ive , Julian Jaede , Daniel W. Jarvis , Duncan Robert Kerr , Robert F. Meyer , David A. Pakula , Michael D. Quinones , Marwan Rammah , Peter Russell-Clarke , Benjamin Andrew Shaffer , Mikael Silvanto , Ian Spraggs , Christopher J. Stringer , Joe Sung Ho Tan , Tang Yew Tan , Clement Tissandier , Eugene Antony Whang , Rico Zörkendörfer
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公开(公告)号：USD926768S1
公开(公告)日：2021-08-03
申请号：US29749438
申请日：2020-09-04
Applicant: Apple Inc.
Designer： Jody Akana , Molly Anderson , Bartley K. Andre , Shota Aoyagi , Anthony Michael Ashcroft , Marine C. Bataille , Jeremy Bataillou , Daniele De Iuliis , Markus Diebel , M. Evans Hankey , Julian Hoenig , Lee E. Hooton , Richard P. Howarth , Jonathan P. Ive , Julian Jaede , Daniel W. Jarvis , Duncan Robert Kerr , Robert F. Meyer , David A. Pakula , Michael D. Quinones , Marwan Rammah , Peter Russell-Clarke , Benjamin Andrew Shaffer , Mikael Silvanto , Ian Spraggs , Christopher J. Stringer , Joe Sung Ho Tan , Tang Yew Tan , Clement Tissandier , Eugene Antony Whang , Rico Zörkendörfer
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公开(公告)号：USD856338S1
公开(公告)日：2019-08-13
申请号：US29668230
申请日：2018-10-29
Applicant: Apple Inc.
Designer： Jody Akana , Molly Anderson , Bartley K. Andre , Shota Aoyagi , Anthony Michael Ashcroft , Marine C. Bataille , Jeremy Bataillou , Daniele De Iuliis , Markus Diebel , Douglas G. Fournier , M. Evans Hankey , Julian Hoenig , Richard P. Howarth , Jonathan P. Ive , Julian Jaede , Daniel W. Jarvis , Duncan Robert Kerr , Robert F. Meyer , David A. Pakula , Peter Russell-Clarke , Benjamin Andrew Shaffer , Mikael Silvanto , Ian Spraggs , Christopher J. Stringer , Joe Sung Ho Tan , Tang Yew Tan , Clement Tissandier , Eugene Antony Whang , Rico Zörkendörfer
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Patent Agency Ranking
公开(公告)号：USD832267S1
公开(公告)日：2018-10-30
申请号：US29612834
申请日：2017-08-04
Applicant: Apple Inc.
Designer： Jody Akana , Molly Anderson , Bartley K. Andre , Shota Aoyagi , Anthony Michael Ashcroft , Marine C. Bataille , Jeremy Bataillou , Daniele De Iuliis , Markus Diebel , Ashley E. Fletcher , Douglas G. Fournier , M. Evans Hankey , Julian Hoenig , Richard P. Howarth , Jonathan P. Ive , Julian Jaede , Daniel W. Jarvis , Duncan Robert Kerr , Robert F. Meyer , David A. Pakula , Peter Russell-Clarke , Benjamin Andrew Shaffer , Mikael Silvanto , Christopher J. Stringer , Joe Sung Ho Tan , Tang Yew Tan , Clement Tissandier , Eugene Antony Whang , Rico Zörkendörfer
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公开(公告)号：USD895626S1
公开(公告)日：2020-09-08
申请号：US29686166
申请日：2019-04-02
Applicant: Apple Inc.
Designer： Jody Akana , Molly Anderson , Bartley K. Andre , Shota Aoyagi , Anthony Michael Ashcroft , Marine C. Bataille , Jeremy Bataillou , Markus Diebel , M. Evans Hankey , Julian Hoenig , Richard P. Howarth , Jonathan P. Ive , Julian Jaede , Daniel W. Jarvis , Duncan Robert Kerr , Richard H. Koch , Robert F. Meyer , Michael D. Quinones , Peter Russell-Clarke , Benjamin Andrew Shaffer , Mikael Silvanto , Ian Spraggs , Sung-Ho Tan , Christopher S. Tomasetta , Clement Tissandier , Eugene Antony Whang , Rico Zörkendörfer
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公开(公告)号：USD893490S1
公开(公告)日：2020-08-18
申请号：US29648093
申请日：2018-05-18
Applicant: Apple Inc.
Designer： Jody Akana , Molly Anderson , Bartley K. Andre , Shota Aoyagi , Anthony Michael Ashcroft , Marine C. Bataille , Jeremy Bataillou , Daniele De Iuliis , Markus Diebel , Ashley E. Fletcher , Douglas G. Fournier , M. Evans Hankey , Julian Hoenig , Richard P. Howarth , Jonathan P. Ive , Julian Jaede , Daniel W. Jarvis , Duncan Robert Kerr , Robert F. Meyer , David A. Pakula , Peter Russell-Clarke , Benjamin Andrew Shaffer , Mikael Silvanto , Christopher J. Stringer , Joe Sung Ho Tan , Tang Yew Tan , Clement Tissandier , Eugene Antony Whang , Rico Zörkendörfer
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公开(公告)号：USD849010S1
公开(公告)日：2019-05-21
申请号：US29655032
申请日：2018-06-29
Applicant: Apple Inc.
Designer： Jody Akana , Molly Anderson , Bartley K. Andre , Shota Aoyagi , Anthony Michael Ashcroft , Marine C. Bataille , Jeremy Bataillou , Daniele De Iuliis , Markus Diebel , M. Evans Hankey , Julian Hoenig , Lee E. Hooton , Richard P. Howarth , Jonathan P. Ive , Julian Jaede , Daniel W. Jarvis , Duncan Robert Kerr , Robert F. Meyer , David A. Pakula , Michael D. Quinones , Marwan Rammah , Peter Russell-Clarke , Benjamin Andrew Shaffer , Mikael Silvanto , Ian Spraggs , Christopher J. Stringer , Joe Sung Ho Tan , Tang Yew Tan , Clement Tissandier , Eugene Antony Whang , Rico Zörkendörfer
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公开(公告)号：US10244659B2
公开(公告)日：2019-03-26
申请号：US15712069
申请日：2017-09-21
Applicant: Apple Inc.
Inventor： Daniel W. Jarvis , David A. Pakula , David J. Dunsmoor , Ian A. Spraggs , Lee E. Hooton , Marwan Rammah , Matthew D. Hill , Robert F. Meyer , James A. Bertin , Eric M. Bennett , Simon C. Helmore , Melissa A. Wah , Jon F. Housour , Douglas G. Fournier , Christopher S. Tomasetta
IPC: H05K7/20 , H05K1/02 , G06F3/041 , H01M2/10 , H05K1/14 , G06F1/16 , H01M2/08 , H02J7/00 , G06F3/044
Abstract: A thermal distribution assembly for an electronic device is disclosed. The electronic device includes an enclosure defined by a metal band and a non-metal bottom wall formed by glass, sapphire, or plastic. In this regard, the enclosure may include a relatively low thermal conductivity. However, the thermal distribution assembly provides heat transfer capabilities that offset thermal conductivity losses by using a non-metal bottom wall, and also provides added structural support. The thermal distribution assembly may include a first layer, a second layer, and a third layer. The first and third layers provide structural support, while the second layer provides a relatively high thermally conductive layer. The thermal distribution assembly includes sidewalls engaging and thermally coupling to the metal band, allowing the thermal distribution assembly to draw heat from a heat-generating component, and pass the heat to the metal band while minimizing or preventing temperature increases along the non-metal bottom wall.
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