Abstract:
Embodiments are directed to a low profile key for a keyboard having an overmolded support structure. In one aspect, an embodiment includes a key cap having an illuminable symbol. A support structure having a pair of overmolded wings may pivotally couple to the key cap. A switch housing may surround the support structure and connect each of the first and second wings. A tactile dome may be at least partially positioned within the switch housing and configured to bias the key cap upward. A sensing membrane may be positioned along an underside surface of the tactile dome and configured to trigger a switch event in response to a collapsing of the tactile dome caused by a depression of the key cap. A feature plate may be positioned below the sensing membrane. A light guide panel may define at least one light extraction feature that may be configured to propagate light toward the key cap and cause illumination of the illuminable symbol.
Abstract:
Embodiments are directed to a low profile key for a keyboard having an overmolded support structure. In one aspect, an embodiment includes a key cap having an illuminable symbol. A support structure having a pair of overmolded wings may pivotally couple to the key cap. A switch housing may surround the support structure and connect each of the first and second wings. A tactile dome may be at least partially positioned within the switch housing and configured to bias the key cap upward. A sensing membrane may be positioned along an underside surface of the tactile dome and configured to trigger a switch event in response to a collapsing of the tactile dome caused by a depression of the key cap. A feature plate may be positioned below the sensing membrane. A light guide panel may define at least one light extraction feature that may be configured to propagate light toward the key cap and cause illumination of the illuminable symbol.
Abstract:
Embodiments are directed to a low profile key for a keyboard having an overmolded support structure. In one aspect, an embodiment includes a key cap having an illuminable symbol. A support structure having a pair of overmolded wings may pivotally couple to the key cap. A switch housing may surround the support structure and connect each of the first and second wings. A tactile dome may be at least partially positioned within the switch housing and configured to bias the key cap upward. A sensing membrane may be positioned along an underside surface of the tactile dome and configured to trigger a switch event in response to a collapsing of the tactile dome caused by a depression of the key cap. A feature plate may be positioned below the sensing membrane. A light guide panel may define at least one light extraction feature that may be configured to propagate light toward the key cap and cause illumination of the illuminable symbol.
Abstract:
Devices and techniques for improving the fit between multiple components of a part are described. In particular embodiments, the techniques involve providing features that allow for offset adjustments of components during an assembly process after the components have been already been machined to final dimension. The features can protrude from a mating or datum surface of one or both of the components. The heights of the features can be modified so as to modify a dimension of the mating surface, providing minor offset control for critical dimensions during an assembly process. In some cases, the features are provided on a separate insert piece that can be easily modified and replaced if necessary.
Abstract:
One embodiment of a power supply input routing apparatus can include a multilayer printed circuit board configured to accept only an alternating current (AC) line voltage, return and ground signals. The AC power jumper board can advantageously route AC power from one section of the power supply to another without burdening the power supply design with extra layer requirements or negatively increasing power supply area. Embodiments including an electronic device having a power supply as above are also disclosed.
Abstract:
The described embodiments relate generally to methods of assembly of electronic devices. In particular, a rotationally induced pressure is used to activate a securing mechanism positioned between a component and an enclosure. The component and the securing mechanism may be located in an inaccessible region of the enclosure such that traditional, direct, assembly processes may not be feasible. The securing mechanism may take the form of a layer of pressure sensitive adhesive or a fastener between the component and an interior surface of the enclosure.
Abstract:
Examples of tooling fixtures and methods for manufacturing computing devices are described. According to some examples, a computer component may be shaped using successive steps of forging after deep drawing. In some examples, certain components may be assembled to form sub-assemblies of computer components and the sub-assembly may then be machined to drive closer tolerances. According to other examples, a work holding tool is described which may include a first plurality of individually movable pins for supporting a first surface of a work piece, the tool also having a second plurality of individually movable pins for applying a restraining force over a second opposite surface of the work piece to retain the work piece in position while maintaining it in its natural state.