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公开(公告)号:US20220388276A1
公开(公告)日:2022-12-08
申请号:US17716911
申请日:2022-04-08
Applicant: Apple Inc.
Inventor: Xiaowei Wu , Hoon Sik Kim , Yuxi Zhao , Terry C Lam , Yasmin F Afsar , Chang-Chia Huang , Bhadrinarayana Lalgudi Visweswaran , Supriya Goyal , Paul S Drzaic
Abstract: In devices with flexible displays, multilayer adhesive stacks may be included. A multilayer adhesive may attach a flexible display panel to the display cover layer in an electronic device. Including multiple layers of adhesive in the adhesive stack (as opposed to a single layer) provides more degrees of freedom for the tuning and optimization of the properties of the adhesive stack. The multilayer adhesive stack therefore has better performance than if only a single layer of adhesive is used. The multilayer adhesive stack may include one or more layers of soft adhesive, hard adhesive, hard elastomer, hard polymer, and/or glass to optimize the mechanical and optical performance of the multilayer adhesive stack. Soft adhesive layers may be included to optimize lateral decoupling (e.g., during folding and unfolding) of the adhesive stack. Harder layers may be included to provide rigidity and prevent denting during impact events.
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公开(公告)号:US20210096595A1
公开(公告)日:2021-04-01
申请号:US17078578
申请日:2020-10-23
Applicant: Apple Inc.
Inventor: Hoon Sik Kim , Chang-Chia Huang , Christopher D. Jones , Masato Kuwabara , Nikhil D. Kalyankar , Terry C. Shyu , Yasmin F. Afsar , Paul S. Drzaic
Abstract: Protective cover layers for electronic devices are described. In an embodiment, an electronic device includes a display panel and a protective cover layer over the display panel. The protective cover layer includes a transparent support substrate and a hardcoat layer covering an exterior facing surface of the transparent support substrate. The display panel may be a flexible display panel and the protective cover layer may flex with the flexible display panel.
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公开(公告)号:US20200350253A1
公开(公告)日:2020-11-05
申请号:US16935088
申请日:2020-07-21
Applicant: Apple Inc.
Inventor: Daniel D. Sunshine , Paul S. Drzaic , Daniel A. Podhajny , David M. Kindlon , Hoon Sik Kim , Kathryn P. Crews , Yung-Yu Hsu
IPC: H01L23/538 , H05K1/18 , H05K1/03 , D02G3/44 , G01D11/30 , H01L23/31 , H01L25/075 , H01L33/56
Abstract: A fabric-based item may include fabric layers and other layers of material. An array of electrical components may be mounted in the fabric-based item. The electrical components may be mounted to a support structure such as a flexible printed circuit. The flexible printed circuit may have a mesh shape formed from an array of openings. Serpentine flexible printed circuit segments may extend between the openings. The electrical components may be light-emitting diodes or other electrical devices. Polymer with light-scattering particles or other materials may cover the electrical components. The flexible printed circuit may be laminated between fabric layers or other layers of material in the fabric-based item.
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公开(公告)号:US10817016B2
公开(公告)日:2020-10-27
申请号:US16528271
申请日:2019-07-31
Applicant: Apple Inc.
Inventor: Hoon Sik Kim , Chang-Chia Huang , Christopher D. Jones , Masato Kuwabara , Nikhil D. Kalyankar , Terry C. Shyu , Yasmin F. Afsar , Paul S. Drzaic
Abstract: Protective cover layers for electronic devices are described. In an embodiment, an electronic device includes a display panel and a protective cover layer over the display panel. The protective cover layer includes a transparent support substrate and a hardcoat layer covering an exterior facing surface of the transparent support substrate. The display panel may be a flexible display panel and the protective cover layer may flex with the flexible display panel.
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公开(公告)号:US10553540B2
公开(公告)日:2020-02-04
申请号:US15752480
申请日:2016-08-17
Applicant: Apple Inc.
Inventor: Daniel D. Sunshine , Paul S. Drzaic , Daniel A. Podhajny , David M. Kindlon , Hoon Sik Kim , Kathryn P. Crews , Yung-Yu Hsu
IPC: H01L29/18 , H01L23/538 , H05K1/18 , H05K1/03 , D02G3/44 , G01D11/30 , H01L23/31 , H01L25/075 , H01L33/56 , A41D1/00 , H05K1/02 , H05K3/28 , F21Y115/10 , H01L21/48 , H01L23/00 , H01L33/62
Abstract: A fabric-based item may include fabric layers and other layers of material. An array of electrical components may be mounted in the fabric-based item. The electrical components may be mounted to a support structure such as a flexible printed circuit. The flexible printed circuit may have a mesh shape formed from an array of openings. Serpentine flexible printed circuit segments may extend between the openings. The electrical components may be light-emitting diodes or other electrical devices. Polymer with light-scattering particles or other materials may cover the electrical components. The flexible printed circuit may be laminated between fabric layers or other layers of material in the fabric-based item.
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公开(公告)号:US20200020639A1
公开(公告)日:2020-01-16
申请号:US16584537
申请日:2019-09-26
Applicant: Apple Inc.
Inventor: Daniel D. Sunshine , Paul S. Drzaic , Daniel A. Podhajny , David M. Kindlon , Hoon Sik Kim , Kathryn P. Crews , Yung-Yu Hsu
IPC: H01L23/538 , H05K1/18 , H05K1/03 , D02G3/44 , G01D11/30 , H01L23/31 , H01L25/075 , H01L33/56
Abstract: A fabric-based item may include fabric layers and other layers of material. An array of electrical components may be mounted in the fabric-based item. The electrical components may be mounted to a support structure such as a flexible printed circuit. The flexible printed circuit may have a mesh shape formed from an array of openings. Serpentine flexible printed circuit segments may extend between the openings. The electrical components may be light-emitting diodes or other electrical devices. Polymer with light-scattering particles or other materials may cover the electrical components. The flexible printed circuit may be laminated between fabric layers or other layers of material in the fabric-based item.
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公开(公告)号:US10199323B2
公开(公告)日:2019-02-05
申请号:US15415496
申请日:2017-01-25
Applicant: Apple Inc.
Inventor: Yung-Yu Hsu , Hoon Sik Kim , Christopher A. Schultz , David M. Kindlon , Daniel D. Sunshine , Paul S. Drzaic , Sinan Alousi , Terry C. Shyu
IPC: H01L23/498 , H01L25/075 , H01L33/62 , H05K1/02 , H05K1/14 , G06F3/041
Abstract: An item may have a flexible support structure and may include a flexible component. The flexible component may have electrical components mounted on component mounting regions in a flexible circuit substrate. The component mounting regions may be interconnected by serpentine interconnect paths or other flexible interconnect paths. The flexible circuit substrate and component mounting regions may extend along a longitudinal axis of the flexible component or may form a two-dimensional array. Two-dimensional mesh-shaped flexible circuit substrates may be used in forming displays. The mesh-shaped flexible circuit substrates may be auxetic substrates that widen when stretched (e.g., structures with a negative Poisson's ratio that become thicker perpendicular to applied force when stretched) and that therefore reduce image distortion. Temporary tethers may help hold flexible circuit substrates together until intentionally broken following assembly of a flexible component into the flexible support structure.
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公开(公告)号:US20250040329A1
公开(公告)日:2025-01-30
申请号:US18911125
申请日:2024-10-09
Applicant: Apple Inc.
Inventor: Que Anh S. Nguyen , Christian Weddeling , Hoon Sik Kim , Terry C. Lam
Abstract: A foldable electronic device may bend about a bend axis. A foldable display panel may be configured to bend along the bend axis as the foldable device is folded. A display cover layer may overlap the display panel. The display panel may have an array of pixels configured to display an image viewable through the display cover layer. The display cover layer may be formed from a layer of glass. A recess may be formed in the layer of glass that runs parallel to the bend axis and that overlaps the bend axis. The recess forms a flexible locally thinned portion in the glass that allows the display cover layer to bend. A rough surface texture and polymer coating may be provided in the recess. The recess may have shallowly sloping walls.
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公开(公告)号:US20230345655A1
公开(公告)日:2023-10-26
申请号:US18301911
申请日:2023-04-17
Applicant: Apple Inc.
Inventor: Tatsuya Sano , Michael B. Wittenberg , Hoon Sik Kim
IPC: H05K5/02
CPC classification number: H05K5/0217
Abstract: An electronic device may have a housing, an expandable display mounted to the housing, and a frame for supporting the expandable display. The housing, display, and frame may be operable in expanded and retracted states. In the retracted state, an exposed portion of the display is viewable on the outside of the device, while a retractable portion of the display is enclosed within the housing and hidden behind the exposed portion of the display. As the device transitions from the retracted state to the expanded state, the retractable portion of the display may roll around an axis onto the front of the device to increase the size of the viewable display area. The frame may have a rigid portion that is mostly solid metal supporting the exposed portion of the display and a flexible portion formed from parallel strips of metal supporting the retractable portion of the display.
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公开(公告)号:US20230317626A1
公开(公告)日:2023-10-05
申请号:US18330276
申请日:2023-06-06
Applicant: Apple Inc.
Inventor: Daniel D. Sunshine , Paul S. Drzaic , Daniel A. Podhajny , David M. Kindlon , Hoon Sik Kim , Kathryn P. Crews , Yung-Yu Hsu
IPC: H05K1/03 , G01D11/30 , H01L23/538 , H01L33/56 , H05K1/18 , D02G3/44 , H01L23/31 , H01L25/075
CPC classification number: H01L23/5387 , D02G3/441 , G01D11/30 , H01L23/3121 , H01L23/5386 , H01L25/0753 , H01L33/56 , H05K1/038 , H05K1/189 , A41D1/005 , H05K2201/10106
Abstract: A fabric-based item may include fabric layers and other layers of material. An array of electrical components may be mounted in the fabric-based item. The electrical components may be mounted to a support structure such as a flexible printed circuit. The flexible printed circuit may have a mesh shape formed from an array of openings. Serpentine flexible printed circuit segments may extend between the openings. The electrical components may be light-emitting diodes or other electrical devices. Polymer with light-scattering particles or other materials may cover the electrical components. The flexible printed circuit may be laminated between fabric layers or other layers of material in the fabric-based item.
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