公开(公告)号：US09029689B2

公开(公告)日：2015-05-12

申请号：US12978259

申请日：2010-12-23

申请人： Thomas Phu ,  Shashwat Kumaria ,  Briccio deLeon

发明人： Thomas Phu ,  Shashwat Kumaria ,  Briccio deLeon

IPC分类号： H01L31/02 ,  H01L31/05 ,  H01L31/18

CPC分类号： H01L31/188 ,  H01L31/0508 ,  Y02E10/50 ,  Y10T29/532

摘要： A method of connecting two solar cells is disclosed. In one embodiment, the method comprises gripping an interconnect with a head of positioning device, heating the interconnect with the head of the positioning device to between two predetermined temperatures, where one is higher than the other, positioning the interconnect so as to overlay two adjacent solar cells, coupling the interconnect to each of the two adjacent solar cells, and releasing the interconnect from the head.

摘要翻译： 公开了一种连接两个太阳能电池的方法。 在一个实施例中，该方法包括夹持与定位装置的头部的互连，将与定位装置的头部的互连加热到两个预定温度之间，其中一个高于另一个预定温度，定位互连以覆盖两个相邻 太阳能电池，将互连件耦合到两个相邻太阳能电池中的每一个，并且从头部释放互连。

公开(公告)号：US20130228906A1

公开(公告)日：2013-09-05

申请号：US13854607

申请日：2013-04-01

申请人： Ryan Linderman ,  Keith Johnston ,  Thomas Phu ,  Matthew Dawson

发明人： Ryan Linderman ,  Keith Johnston ,  Thomas Phu ,  Matthew Dawson

IPC分类号： H01L23/495

CPC分类号： H01L31/05 ,  H01L23/49503 ,  H01L31/024 ,  H01L31/044 ,  H01L31/048 ,  H01L31/0504 ,  H01L31/0508 ,  H01L31/0516 ,  H01L31/052 ,  H01L33/62 ,  H01L33/64 ,  H01L2924/0002 ,  Y02E10/50 ,  H01L2924/00

摘要： Interconnects for optoelectronic devices are described. For example, an interconnect for an optoelectronic device includes an interconnect body having an inner surface, an outer surface, a first end, and a second end. A plurality of bond pads is coupled to the inner surface of the interconnect body, between the first and second ends. A stress relief feature is disposed in the interconnect body. The stress relief feature includes a slot disposed entirely within the interconnect body without extending through to the inner surface, without extending through to the outer surface, without extending through to the first end, and without extending through to the second end of the interconnect body.

摘要翻译： 描述了用于光电子器件的互连。 例如，用于光电子器件的互连件包括具有内表面，外表面，第一端和第二端的互连体。 多个接合焊盘在第一和第二端之间耦合到互连体的内表面。 应力释放特征设置在互连体中。 应力消除特征包括完全设置在互连体内部的槽，而不延伸穿过内表面，而不延伸穿过外表面，而不延伸穿过第一端，并且不延伸通过互连体的第二端。

公开(公告)号：US20050061665A1

公开(公告)日：2005-03-24

申请号：US10912348

申请日：2004-08-04

申请人： Luca Pavani ,  Neil Kaminar ,  Pongsthorn Uralwong ,  Thomas Phu ,  Douglas Rose ,  Thomas Pass

发明人： Luca Pavani ,  Neil Kaminar ,  Pongsthorn Uralwong ,  Thomas Phu ,  Douglas Rose ,  Thomas Pass

IPC分类号： C25D17/06 ,  C25D17/08 ,  H01L20060101 ,  H01L21/288

CPC分类号： C25D17/08 ,  H01L21/2885 ,  Y10S269/90

摘要： A carrier for use in processing of a plurality of wafers or other substrates includes a support frame on which the wafers are mounted and in one embodiment at least one auxiliary frame for holding the substrates on the support frame. A plurality of clips extend from the auxiliary frame and engage the substrates in pressure engagement, and fasteners retain the auxiliary frame in position with respect to the support frame. In one embodiment two auxiliary frames can be employed for holding wafers on opposing surfaces of the support frame. The support frame has electrically non-conducting surfaces whereby the processing does not affect the support frame, and the auxiliary frame is made of electrically non- conductive material. The clips are electrically conductive and bridge current from the support frame to the wafers during plating operations. In another embodiment, auxiliary frame are not used and the wafer retention clips are mounted on the support frame. In use, the carrier can support a high number of units for processing with no significant mechanical stress being transferred to the wafers during loading and unloading from the carrier. The carriers and wafers can be transferred easily for different chemical baths and can be handled safely during rinsing and drying steps.

摘要翻译： 用于处理多个晶片或其它基板的载体包括其上安装晶片的支撑框架，并且在一个实施例中，至少一个用于将基板保持在支撑框架上的辅助框架。 多个夹子从辅助框架延伸并且以压力接合方式接合基板，并且紧固件将辅助框架相对于支撑框架保持在适当的位置。 在一个实施例中，可以使用两个辅助框架来将晶片保持在支撑框架的相对表面上。 支撑框架具有非导电表面，由此处理不影响支撑框架，辅助框架由非导电材料制成。 在电镀操作期间，夹子是导电的并且桥接电流从支撑框架到晶片。 在另一个实施例中，不使用辅助框架，并且将晶片固定夹安装在支撑框架上。 在使用中，载体可以支撑大量用于加工的单元，在从载体装载和卸载期间，没有明显的机械应力转移到晶片。 载体和晶片可以容易地转移到不同的化学浴中，并且可以在漂洗和干燥步骤期间安全地处理。