公开(公告)号：US12055738B2

公开(公告)日：2024-08-06

申请号：US17934710

申请日：2022-09-23

申请人： II-VI Delaware, Inc.

发明人： Christoph M. Greiner ,  Jianji Yang ,  Dmitri Iazikov

IPC分类号： G02B5/18

CPC分类号： G02B5/1861 ,  G02B5/1871

摘要： An optical element includes a substrate, an intermediate layer, a topmost layer, and a contiguous multitude of recessed and non-recessed areal regions. The intermediate layer is formed over a top surface of the substrate and has a refractive index nI. The topmost layer is formed directly on the intermediate layer and has a refractive index nT where nT≠nI. The intermediate and topmost layers are substantially transparent over an operational wavelength range that includes a design wavelength λ0. A subset of areal regions has a largest transverse dimension less than about λ0. Each non-recessed areal region includes corresponding portions of the intermediate and topmost layers. Each recessed areal region extends entirely through the topmost layer and at least partly through the intermediate layer. A fill medium fills the recessed areal regions. The areal regions are variously sized and distributed transversely across the optical element.

公开(公告)号：US20240243548A1

公开(公告)日：2024-07-18

申请号：US18406480

申请日：2024-01-08

申请人： II-VI Delaware, Inc.

发明人： Philipp Staudinger ,  Franz Eberhard ,  Jürgen Müller

IPC分类号： H01S5/0687 ,  H01S5/028 ,  H01S5/14 ,  H01S5/40

CPC分类号： H01S5/0687 ,  H01S5/0287 ,  H01S5/141 ,  H01S5/4031

摘要： This disclosure describes a multi-junction laser diode with improved wavelength stability. The multi-junction laser diode is found in an edge emitting laser (EEL). The disclosed system and method are suited for improving the wavelength stability of multi-junction EEL without coupling the laser modes of the individual junctions and without using any external elements such as Fiber Bragg Gratings (FBR), Volume Bragg Gratings (VBG) or Thermoelectric Cooling (TEC).

公开(公告)号：US12021499B2

公开(公告)日：2024-06-25

申请号：US18298221

申请日：2023-04-10

申请人： II-VI Delaware, Inc

发明人： Di Lan ,  Wen-Qing Xu ,  Giovanni Barbarossa

IPC分类号： H03H9/05 ,  H03H9/02 ,  H03H9/13 ,  H03H9/17

CPC分类号： H03H9/0547 ,  H03H9/02102 ,  H03H9/02228 ,  H03H9/13 ,  H03H9/176

摘要： A bulk acoustic resonator operable in a bulk acoustic mode includes a resonator body mounted to a separate carrier that is not part of the resonator body. The resonator body includes a piezoelectric layer, a device layer, and a top conductive layer on the piezoelectric layer opposite the device layer. A surface of the device layer opposite the piezoelectric layer is for mounting the resonator body to the carrier.

公开(公告)号：US20240201507A1

公开(公告)日：2024-06-20

申请号：US18427704

申请日：2024-01-30

申请人： II-VI Delaware, Inc.

发明人： Yasuhiro MATSUI ,  Shiyun LIN ,  David ADAMS

IPC分类号： G02B27/09 ,  G02B6/10 ,  G02B6/122 ,  H01S5/026 ,  H01S5/042 ,  H01S5/12 ,  H01S5/22

CPC分类号： G02B27/095 ,  G02B6/10 ,  G02B6/1228 ,  H01S5/026 ,  H01S5/12 ,  H01S5/22 ,  H01S5/2206 ,  H01S5/0424

摘要： A spot-size converter includes first and second waveguide structures. The first waveguide structure extends longitudinally along a waveguide axis from a first end to a second end and is configured to support a first optical mode at the first end. The second waveguide structure is formed within the first waveguide structure. The second waveguide structure extends longitudinally between the first end and the second end. The second waveguide structure is configured to support a second optical mode at the second end. The second optical mode has a different diameter than the first optical mode. The second waveguide structure includes a waveguide core that has a first cross-sectional area in a first plane normal to the waveguide axis at the first end and a second cross-sectional area in a second plane normal to the waveguide axis at the second end. The second cross-sectional area is larger than the first cross-sectional area.

公开(公告)号：US12015245B2

公开(公告)日：2024-06-18

申请号：US18110120

申请日：2023-02-15

申请人： II-VI Delaware, Inc.

发明人： Giuseppe Tandoi ,  Norbert Lichtenstein ,  Lukas Mutter ,  Andre Bisig

IPC分类号： H01S5/0683 ,  H01S5/183 ,  H01S5/42

CPC分类号： H01S5/0683 ,  H01S5/18311 ,  H01S5/423

摘要： Modification of the topology of selected regions of individual VCSEL devices during fabrication is utilized to provide an array output beam with specific characteristics (e.g., “uniform” output power across the array). These physical features include at least the width of the metal aperture, the width of the oxide aperture, and/or the geometry of the contact ring structure on the top of the VCSEL device. The modifications may also function to adjust the numerical apertures (NAs) of the devices, the beam waist, wallplug efficiency, and the like.

公开(公告)号：US20240195146A1

公开(公告)日：2024-06-13

申请号：US18080319

申请日：2022-12-13

申请人： II-VI Delaware, Inc.

发明人： Tao Feng ,  Tsurugi Sudo

IPC分类号： H01S5/024 ,  H01S5/026 ,  H01S5/40

CPC分类号： H01S5/02461 ,  H01S5/026 ,  H01S5/4025

摘要： Monolithic laser arrays having non-uniform lasers are disclosed. Example monolithic laser arrays provide a substantially uniform temperature distribution and include a substrate, a first set of lasers arranged on the substrate and separated by a first distance, and a second set of lasers arranged on the substrate and separated by a second distance greater than the first distance. The disclosed monolithic laser arrays yield an output with a substantially narrow optical spectral width.

公开(公告)号：US20240176172A1

公开(公告)日：2024-05-30

申请号：US18434059

申请日：2024-02-06

申请人： II-VI Delaware, Inc.

发明人： Andrei Kaikkonen ,  David Adams ,  Robert Lewen ,  Nicolae Chitica

IPC分类号： G02F1/025 ,  G02F1/015 ,  H01S5/06

CPC分类号： G02F1/025 ,  H01S5/0601 ,  G02F1/0157 ,  G02F2202/101 ,  G02F2202/102 ,  G02F2202/108

摘要： An electro-absorption modulator (EAM) is configured to include an on-chip AC ground plane that is used to terminate the high frequency RF input signal within the chip itself. This on-chip ground termination of the modulation input signal improves the frequency response of the EAM, which is an important feature when the EAM needs to support data rates in excess of 50 Gbd. By virtue of using an on-chip ground for the very high frequency signal content, it is possible to use less expensive off-chip components to address the lower frequency range of the data signal (i.e., for frequencies less than about 1 GHz).

公开(公告)号：US20240159946A1

公开(公告)日：2024-05-16

申请号：US18421112

申请日：2024-01-24

申请人： II-VI Delaware, Inc.

发明人： Thomas W. MOSSBERG ,  Jianji YANG ,  Dmitri IAZIKOV ,  Christoph M. GREINER

IPC分类号： G02B5/18 ,  G02B27/48

CPC分类号： G02B5/1819 ,  G02B5/1847 ,  G02B27/48 ,  G02B2005/1804

摘要： An incident optical beam illuminates a subset of contiguous array of diffraction gratings on a substrate and produces one or more diffracted output beams. The grating array can be arranged so that (i) multiple incident beams result in a contiguous composite solid angle of far-field illumination, (ii) multiple output beams arising from any one incident beam do not overlap in the far field, or (iii) both. The gratings of the array can be arranged to produce a desired far-field illumination intensity profile. The grating array can be arranged so as to suppress or eliminate laser speckle arising from the output beams.

公开(公告)号：US20240121001A1

公开(公告)日：2024-04-11

申请号：US17962751

申请日：2022-10-10

申请人： II-VI Delaware, Inc.

发明人： Ramesh Sundaram

IPC分类号： H04B10/2507

CPC分类号： H04B10/2507

摘要： An optical isolator includes a polarizer for receiving and passing an optical signal received from an optical signal source to a garnet which rotates a polarization of the optical signal by an angle of 45°−θ1°, where 5°≤θ1°

公开(公告)号：US20240118506A1

公开(公告)日：2024-04-11

申请号：US18543648

申请日：2023-12-18

申请人： II-VI Delaware, Inc.

发明人： Gilles P. Denoyer ,  Daniel MAHGEREFTEH ,  Vipul Bhatt ,  Shiyun LIN ,  Brian Kim

IPC分类号： G02B6/42 ,  H01L23/00 ,  H01L23/498

CPC分类号： G02B6/423 ,  G02B6/4202 ,  G02B6/4249 ,  H01L23/49844 ,  H01L24/81

摘要： In one example, an optoelectronic module may include a stack assembly including an electrical integrated circuit and an optical integrated circuit electrically and mechanically coupled to one another, an interposer electrically and mechanically coupled to the stack assembly, and an optical connector to optically couple the optical integrated circuit with an array of optical fibers.