HEAT DISSIPATION SYSTEM
    11.
    发明申请
    HEAT DISSIPATION SYSTEM 审中-公开
    散热系统

    公开(公告)号:US20110139430A1

    公开(公告)日:2011-06-16

    申请号:US12996983

    申请日:2009-06-10

    IPC分类号: F28F7/00

    摘要: A system for dissipating heat generated by an electronic system, for example an electronic device in an aircraft. The system includes a housing including an external lid covering the electronic system and configured to be in contact with a first cold source, and a second cold source located inside the external lid. The housing includes an internal lid located inside the external lid and covering the electronic system, the second cold source being located between the internal and external lids.

    摘要翻译: 一种用于散发由电子系统(例如飞行器中的电子设备)产生的热量的系统。 该系统包括壳体,该壳体包括覆盖电子系统并被构造成与第一冷源接触的外部盖和位于外部盖内部的第二冷源。 壳体包括位于外部盖内并覆盖电子系统的内部盖,第二冷源位于内盖和外盖之间。

    HEAT FLOW DEVICE
    12.
    发明申请
    HEAT FLOW DEVICE 审中-公开
    热流装置

    公开(公告)号:US20100012311A1

    公开(公告)日:2010-01-21

    申请号:US12373988

    申请日:2007-07-17

    IPC分类号: F28F27/00 F28D15/00

    摘要: A device comprises equipment (101) with a heat source, a cold part (102) relative to the equipment, and a thermal conductor element (103) capable of conducting the heat from the equipment to the cold part. The element (103) is such that, under certain thermal conditions above a given thermal condition, the equipment and the cold part are essentially thermally isolated.

    摘要翻译: 一种装置包括具有热源的设备(101),相对于设备的冷部件(102),以及能够将热量从设备传导到冷部件的热导体元件(103)。 元件(103)使得在高于给定热条件的某些热条件下,设备和冷部件基本上是热隔离的。

    HEAT FLOW DEVICE
    13.
    发明申请
    HEAT FLOW DEVICE 审中-公开
    热流装置

    公开(公告)号:US20090283251A1

    公开(公告)日:2009-11-19

    申请号:US12373975

    申请日:2007-07-17

    IPC分类号: F28F27/00 F28D15/02

    摘要: A device comprises equipment (501) with a heat source having a maximum thermal operation condition, a cold part (502) relative to the equipment and an element (503) capable of transmitting the heat from the equipment to the cold part. The element (503) is capable of causing the transmitted heat to be limited for thermal conditions above a specified threshold below said maximum condition.

    摘要翻译: 设备包括具有最大热操作条件的热源的设备(501),相对于设备的冷部件(502)和能够将热量从设备传递到冷部件的元件(503)。 元件(503)能够使热传导的热量被限制在高于所述最大条件的规定阈值以上的热条件下。