公开(公告)号：US07565925B2

公开(公告)日：2009-07-28

申请号：US11166966

申请日：2005-06-24

申请人： Hsieh-Kun Lee ,  Cheng-Tien Lai ,  Zhi-Bin Tan

发明人： Hsieh-Kun Lee ,  Cheng-Tien Lai ,  Zhi-Bin Tan

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0275 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a heat sink (10) and at least a serpent heat pipe (22). The heat sink (10) comprises a base (12) contacting with an electrical component, a heat dissipation fins group (14) secured to the base (12) and a cover (16) attached to a top of the heat dissipation fins group (14). The heat dissipating fins group (14) defines a notch (148) at one side thereof. Two end portions of the heat pipe (22) are respectively connected to the base (12) and the cover (16), and a middle portion of the heat pipe (22) is accommodated in the notch (148).

摘要翻译： 散热装置包括散热器（10）和至少一个蛇形热管（22）。 散热器（10）包括与电气部件接触的基座（12），固定到基座（12）的散热翅片组（14）和附接到散热翅片组的顶部的盖（16） 14）。 散热翅片组（14）在其一侧限定了凹口（148）。 热管（22）的两个端部分别连接到基座（12）和盖（16）上，并且热管（22）的中间部分容纳在凹口（148）中。

公开(公告)号：US20090166003A1

公开(公告)日：2009-07-02

申请号：US11964912

申请日：2007-12-27

申请人： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

发明人： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

IPC分类号： F28D15/04

CPC分类号： F28D15/0233 ,  F28D15/046 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat spreader for cooling an electronic component includes a lower plate defining a chamber, an upper plate fixed on the lower plate to seal the chamber, a first wick layer and a second wick layer sandwiched between the upper plate, and a working liquid contained in the chamber. The first wick layer and the second wick layer respectively define a plurality of apertures, which include right-angled triangle, acute-angled triangle, and rhomb apertures communicating with each other for containing the working liquid therein.

摘要翻译： 用于冷却电子部件的散热器包括限定室的下板，固定在下板上以密封室的上板，夹在上板之间的第一芯芯层和第二芯芯层，以及包含在其中的工作液体 房间。 第一灯芯层和第二灯芯层分别限定多个孔，其包括彼此连通的直角三角形，锐角三角形和菱形孔，用于在其中容纳工作液体。

公开(公告)号：US20090162225A1

公开(公告)日：2009-06-25

申请号：US11961344

申请日：2007-12-20

申请人： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

发明人： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

IPC分类号： F04D13/08 ,  H02K5/132 ,  F04D7/04 ,  H02K16/04

CPC分类号： F04D13/0673 ,  F04D13/064 ,  F04D29/047 ,  H02K5/132 ,  H02K16/04 ,  H02K21/12

摘要： A pump comprises a base (10), a case (20) fixed on the base, a rotor (30) received between the case and the base, and an inner stator (40) and an outer stator (50) accommodated in the case. The rotor is sandwiched between the inner stator and the outer stator. When the inner stator and the outer stator are energized to generate respective magnetic fields, the rotor is driven to rotate by turning torques that are produced by mutual actions between the rotor and the magnetic fields. Thus, the interior and exterior magnetic fields of the rotor can be utilized sufficiently, and an operation efficiency of the pump is enhanced accordingly.

摘要翻译： 泵包括基座（10），固定在基座上的壳体（20），容纳在壳体和基座之间的转子（30）和容纳在壳体中的内部定子（40）和外部定子（50） 。 转子夹在内定子和外定子之间。 当内部定子和外部定子通电以产生相应的磁场时，通过转子和磁场之间的相互作用产生的转矩来驱动转子旋转。 因此，可以充分利用转子的内部和外部磁场，并且相应地提高泵的运行效率。

公开(公告)号：US20090151905A1

公开(公告)日：2009-06-18

申请号：US11957349

申请日：2007-12-14

申请人： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

发明人： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

IPC分类号： F28D15/02 ,  F28D15/04

CPC分类号： F28D15/04 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink includes a tank and a plate covering on the tank and hermetically engaging with the tank. The tank includes a base for absorbing heat from heat-generating members and a sintered wick layer formed at an inner face of base. The plate has a meshed wick layer formed at an inner face thereof. A chamber is defined between the tank and the plate and contains working fluid therein.

摘要翻译： 散热器包括一个罐和一个覆盖在罐上的板，并与油箱密封接合。 该罐包括用于从发热元件吸收热量的基底和形成在基底内表面处的烧结芯芯层。 该板具有在其内表面形成的网状芯芯层。 在罐和板之间限定一个室，并在其中包含工作流体。

公开(公告)号：US20090147521A1

公开(公告)日：2009-06-11

申请号：US12036300

申请日：2008-02-25

申请人： WEN-XIANG ZHANG ,  GUANG YU ,  CHENG-TIEN LAI

发明人： WEN-XIANG ZHANG ,  GUANG YU ,  CHENG-TIEN LAI

IPC分类号： F21V29/00

CPC分类号： F21V23/02 ,  F21S8/088 ,  F21V7/0008 ,  F21V15/01 ,  F21V27/00 ,  F21V29/75 ,  F21V29/763 ,  F21V31/00 ,  F21V31/005 ,  F21W2131/00 ,  F21W2131/103 ,  F21W2131/105 ,  F21W2131/109 ,  F21Y2115/10

摘要： An LED lamp includes a housing having a base, a frame at a top end of the housing and a plurality of stanchions interconnecting the base and the frame. A heat sink is mounted on the frame. An LED module is received in the housing and attached on a bottom surface of the heat sink. A printed circuit board is arranged on the base of the housing, and a reflector is located on the printed circuit board. A transparent envelope is received in the housing and covers windows defined between the stanchions. A light generated by the LED module is reflected by the reflector to transmit outwardly through the envelope to illuminate a surrounding environment.

摘要翻译： LED灯包括壳体，壳体具有底座，在壳体的顶端处的框架和将底座和框架互连的多个支柱。 散热器安装在框架上。 LED模块被容纳在壳体中并且附接在散热器的底表面上。 印刷电路板布置在外壳的底部，反射器位于印刷电路板上。 透明的信封被容纳在壳体中并且覆盖在支柱之间限定的窗口。 由LED模块产生的光被反射器反射，通过外壳向外透射以照亮周围的环境。

公开(公告)号：US07543630B2

公开(公告)日：2009-06-09

申请号：US11430504

申请日：2006-05-08

申请人： Cheng-Tien Lai ,  Tsung-Lung Lee ,  Shenghua Wang

发明人： Cheng-Tien Lai ,  Tsung-Lung Lee ,  Shenghua Wang

IPC分类号： F28D15/04

CPC分类号： F28D15/0233 ,  F28D15/04

摘要： A heat pipe includes an outer pipe (10), an inner pipe (20), and a hermetic cap (30). The outer pipe has an evaporating end (12) and a condensing end (14). The evaporating end is integrally sealed and receives working fluid. The inner pipe includes an open top and an open bottom. A very narrow gap (40) is defined between the inner pipe and the outer pipe. A plurality of granules is put into the gap to form a porous wicking structure. When the evaporating end is heated by an external heat source, the working fluid is vaporized and flows up along the inner pipe to the condensing end. The working fluid condenses at the condensing end, and flows back down to the evaporating end through the gap. Because the gap is very narrow, surface tension of the working fluid and capillary action of the outer and inner pipes is enhanced.

公开(公告)号：US07537047B2

公开(公告)日：2009-05-26

申请号：US11308426

申请日：2006-03-23

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou

IPC分类号： H05K7/20

CPC分类号： H01L23/4735 ,  F28F3/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： A liquid-cooling heat sink includes a base (10), a heat exchanger (30), a housing (20), an inlet (26) and an outlet (27). The heat exchanger (30) has a hollow (33) formed therein, and is thermally coupled to the base (10). The housing (20) has a chamber (24) formed therein, and is placed over the base (10). The chamber (24) is separated by the heat exchanger (30) into a first sub-chamber (241) and a second sub-chamber (242). The first sub-chamber (241) is in fluid communication with the second sub-chamber (242) through a plurality of microchannels (32) radially formed within the heat exchanger (30). The inlet (26) is fluidly connected to the first sub-chamber (241) so as to impinge liquid coolant to a top surface of the base (10).

摘要翻译： 液体冷却散热器包括基座（10），热交换器（30），壳体（20），入口（26）和出口（27）。 热交换器（30）具有形成在其中的中空部（33），并且热耦合到基座（10）。 壳体（20）具有形成在其中的室（24），并且放置在基座（10）上。 室（24）由热交换器（30）分离成第一子室（241）和第二子室（242）。 第一子室241通过在热交换器30内径向形成的多个微通道32与第二子室242流体连通。 入口（26）流体地连接到第一子室（241），以便将液体冷却剂冲击到基座（10）的顶表面。

公开(公告)号：US20090059604A1

公开(公告)日：2009-03-05

申请号：US11845742

申请日：2007-08-27

申请人： GUANG YU ,  CHENG-TIEN LAI

发明人： GUANG YU ,  CHENG-TIEN LAI

IPC分类号： F21V29/00 ,  H05K7/20

CPC分类号： F21V29/74 ,  F21K9/00 ,  F21V29/75 ,  F21V29/763 ,  F21Y2115/10

摘要： A heat dissipation device for a light emitting diode (LED) module includes a heat sink, a plurality of heat pipes received in the heat sink and a heat-absorbing plate thermally attached to the heat pipes and the LED module and located therebetween. The heat sink includes a base and a plurality of fins mounted on the base. The base defines a plurality of grooves for accommodating the heat pipes therein. Top surfaces of the heat pipes are coplanar with a top face of the base of the heat sink so that the heat-absorbing plate has an intimate contacting with the top face of the base of the heat sink and the top surfaces of the heat pipes, whereby the heat pipes can quickly transfer heat from the LED module to the heat sink via the heat-absorbing plate.

摘要翻译： 用于发光二极管（LED）模块的散热装置包括散热器，容纳在散热器中的多个热管和热连接到热管和LED模块并位于其间的吸热板。 散热器包括底座和安装在基座上的多个翅片。 基座限定多个槽，用于在其中容纳热管。 热管的上表面与散热器底部的顶面共面，使得吸热板与散热器的底部的顶面和热管的顶面紧密接触， 由此热管能够通过吸热板将热量从LED模块快速传递到散热器。

公开(公告)号：US20090059536A1

公开(公告)日：2009-03-05

申请号：US12269858

申请日：2008-11-12

申请人： CHENG-TIEN LAI ,  JIN-SONG FENG

发明人： CHENG-TIEN LAI ,  JIN-SONG FENG

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L23/3672 ,  H01L23/4093 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation assembly includes a heat sink, a retention module surrounding the heat sink, and a pair of wire clips pivotably attached to the retention module to press the heat sink against an electronic component on a printed circuit board. The retention module includes three walls surrounding a rectangular opening through which the heat sink contacts with the electronic component. Two barbs and two supporting members are formed on the three walls. Each clip includes a pivoting section retained in one supporting member, an abutting section pressing the heat sink toward the electronic component, and a locking section locked with one barb, a connecting section connecting the abutting section with the pivoting section, and a handle formed from the locking section. Each clip is entirely located at a corresponding side of the heat sink.

摘要翻译： 散热组件包括散热器，围绕散热器的保持模块以及可枢转地连接到保持模块的一对线夹，以将散热器压靠在印刷电路板上的电子部件上。 保持模块包括围绕矩形开口的三个壁，散热器通过该壁与电子部件接触。 在三面墙上形成两个倒钩和两个支撑构件。 每个夹具包括保持在一个支撑构件中的枢转部分，将热沉朝向电子部件按压的邻接部分，以及一个锁定在一个倒钩上的锁定部分，连接该邻接部分与枢转部分的连接部分以及由 锁定部分。 每个夹子完全位于散热器的相应侧。

公开(公告)号：US20080150126A1

公开(公告)日：2008-06-26

申请号：US11615917

申请日：2006-12-22

申请人： ZHI-YONG ZHOU ,  Cheng-Tien Lai ,  Yi-San Liu

发明人： ZHI-YONG ZHOU ,  Cheng-Tien Lai ,  Yi-San Liu

IPC分类号： H01L23/34

CPC分类号： F21K9/00 ,  F21V29/51 ,  F21V29/763 ,  F21V29/83 ,  F21Y2105/10 ,  F21Y2115/10 ,  F28D15/0275

摘要： A light emitting diode (LED) module with a heat dissipation device includes a plurality of LEDs supported by the heat dissipation device. The heat dissipation device includes a plurality of heat spreaders each supporting at least one LED, a base supporting the heat spreaders, and a heat pipe sandwiched between the base and the heat spreaders. The heat spreaders are thermally connected together via the heat pipe.

摘要翻译： 具有散热装置的发光二极管（LED）模块包括由散热装置支撑的多个LED。 散热装置包括多个散热器，每个散热器支撑至少一个LED，支撑散热器的基座和夹在基座和散热器之间的热管。 散热器通过热管热连接在一起。