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公开(公告)号：US20210399529A1
公开(公告)日：2021-12-23
申请号：US17291541
申请日：2019-11-05
发明人： Jörg Erich SORG , Jan MARFELD , Stefan MORGOTT
摘要： A semiconductor laser includes an edge-emitting laser diode, which has an active zone for generating laser radiation and a facet having a radiation exit region, and at least one photodiode. The facet is arranged on a main emission side of the laser diode. The photodiode is arranged in such a way that at least part of the laser radiation exiting at the facet reaches the photodiode. The laser diode and the photodiode are not connected to each other in a non-destructively detachable manner, and a non-destructively detachable connection is formed with a joining partner
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102.发明申请公开(公告)号：US20210399169A1
公开(公告)日：2021-12-23
申请号：US17288569
申请日：2019-10-02
摘要： An optoelectronic semiconductor chip may have or include an x-doped region, a y-doped region, an active region arranged between the x-doped region and the y-doped region, and an x-contact region. The x-contact region may be arranged to the side of the x-doped region facing away from the active region. The x-contact region may include at least one first region and at least one second region. The x-contact region may be designed such that, during operation of the optoelectronic semiconductor chip, more charge carriers are injected into the x-doped region via the second region than via the first region.
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103.发明申请公开(公告)号：US20210391506A1
公开(公告)日：2021-12-16
申请号：US17279632
申请日：2019-09-26
摘要： An optoelectronic device includes an optoelectronic semiconductor chip having a first and a second semiconductor layer having a first and second conductivity type, respectively; a first and a second current spreading layer; a dielectric reflective layer; and a plurality of first electrical connecting elements. The first semiconductor layer and the second semiconductor layer are stacked. The first current spreading layer and the second current spreading layer are arranged on a side of the first semiconductor layer facing away from the second semiconductor layer. The dielectric reflective layer is arranged between the first semiconductor layer and the first current spreading layer. The plurality of first electrical connecting elements extends through the dielectric reflective layer and is suitable to electrically connect the first semiconductor layer to the first current spreading layer. The second current spreading layer is electrically connected to the second semiconductor layer.
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公开(公告)号：US11199756B2
公开(公告)日：2021-12-14
申请号：US16488213
申请日：2018-02-22
发明人： Désirée Queren , Mikko Perälä , Marco Antretter
摘要： A lighting device and a method for operating a lighting device are disclosed. In an embodiment, a lighting device includes at least one semiconductor component comprising a plurality of pixels and configured to generate light illuminating a field of view and a drive circuit, wherein the field of view is divided into a plurality of regions, wherein each pixel is configured to illuminate a region of the field of view, wherein each pixel comprises at least a first type subpixel and a second type subpixel, and wherein the first type subpixel is configured to emit light of a white color location and the second type subpixel is configured to emit light of a non-white color location.
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公开(公告)号：US20210384051A1
公开(公告)日：2021-12-09
申请号：US17284280
申请日：2019-10-04
发明人： Simeon Katz , Andreas Weimar
IPC分类号： H01L21/67 , H01L21/683 , B65G47/90
摘要： In an embodiment, an adhesive stamp includes a plurality of variable-length stamp bodies arranged in an array, wherein each stamp body has an adhesive surface on a head portion of the stamp body, the adhesive surface configured to hold a semiconductor chip, wherein a first electrode is arranged in the head portion, wherein the first electrode is chargeable and whose polarity is changeable, wherein a second electrode is arranged in a foot portion of the stamp body, wherein the second electrode is chargeable and whose polarity is changeable, wherein a length of the stamp body is variable depending on charges applied to the first electrode and the second electrode, and wherein the adhesive stamp is configured to transfer semiconductor chips.
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公开(公告)号：US20210359169A1
公开(公告)日：2021-11-18
申请号：US17283896
申请日：2019-10-07
发明人： Wim Hertog
摘要： In an embodiment a radiation emitting component includes a radiation emitting semiconductor chip having a top surface and at least one side surface, wherein the radiation emitting semiconductor chip is configured to emit primary radiation, a carrier including a recess, a first conversion element and a second conversion element, wherein the first conversion element is arranged on the top surface of the radiation emitting semiconductor chip, wherein the second conversion element is arranged on the at least one side surface of the radiation emitting semiconductor chip, wherein the second conversion element does not project beyond a bottom surface of the first conversion element in a vertical direction, wherein the recess surrounds a first region on a top surface of the carrier, and wherein the radiation emitting semiconductor chip with the first conversion element and the second conversion element is arranged in the first region on the carrier.
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公开(公告)号：US20210352249A1
公开(公告)日：2021-11-11
申请号：US17286163
申请日：2019-10-14
发明人： Klaus FLOCK , Hubert HALBRITTER
摘要： An optical display device includes a plurality of emitters configured to emit electromagnetic radiation in a main emission direction and at least one optical modulation unit which has an adjustable focal length. The emitters are arranged in a main plane and are separately controllable from one another. The optical modulation unit is arranged downstream of the emitters in the main emission direction. Images of the emitters are generated by means of the optical modulation unit, the images of the emitters each having a distance from the main plane which can be predetermined by means of the adjustable focal length. Methods of operating an optical display device are also disclosed.
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公开(公告)号：US11171129B2
公开(公告)日：2021-11-09
申请号：US16498996
申请日：2018-04-10
发明人： Britta Göötz
摘要： A method for producing an optoelectronic component and an optoelectronic component are disclosed. In an embodiment a method includes providing a semiconductor layer sequence comprising a plurality of pixels and an active layer, wherein the active layer is configured to emit a primary radiation in a blue region of an electromagnetic spectrum with a peak wavelength of between 420 nm inclusive and 480 nm inclusive, applying a first photoresist and a first converter material on the semiconductor layer sequence, exposing the first photoresist with radiation having the peak wavelength longer than the peak wavelength of the primary radiation, curing the first photoresist by polymerization in order to form a first converter layer comprising a matrix material and the first converter material and structuring the first converter layer.
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109.发明授权公开(公告)号：US11171123B2
公开(公告)日：2021-11-09
申请号：US16069204
申请日：2017-01-12
发明人： Ivar Tangring
IPC分类号： H01L33/54 , H01L25/075 , H01L33/50 , H01L33/58 , H01L33/60
摘要： A method produces an optoelectronic lighting device. The device efficiently increases a decoupling of electromagnetic radiation from a volume emitter LED chip. This is achieved in that, a frame made of an optical material is provided on side surfaces of the volume emitter LED chip, wherein the frame has a curved section. Light decoupled via the side surfaces of the volume emitter LED chip is thereby coupled into the frame, and can be decoupled again via same or reflected, for example, on a reflective material applied to the frame.
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公开(公告)号：US11169393B2
公开(公告)日：2021-11-09
申请号：US16492093
申请日：2018-03-07
发明人： Peter Brick , Hubert Halbritter , Mikko Perälä
IPC分类号： G02F1/1335 , G02B30/27
摘要： A 3D display element is disclosed. In an embodiment a 3D display element includes a light-emitting component configured to emit light and an optical arrangement, wherein the light-emitting component includes a plurality of triplets, each triplet including a first, a second and a third light-emitting region, wherein the triplets are arranged side by side in a first lateral plane, wherein the regions are arranged side by side in the first lateral plane, wherein the optical arrangement is configured to diverge light of adjacent triplets passing through the optical arrangement, and wherein light of a triplet passing through the optical arrangement is mixed.
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