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    3D TOUCH
    91.
    发明申请
    3D TOUCH 有权

    公开(公告)号：US20210072857A1

    公开(公告)日：2021-03-11

    申请号：US16708350

    申请日：2019-12-09

    Applicant: Apple Inc.

    Inventor： Xiao Ying Zhao ,  Ian A. Spraggs ,  David A. Pakula ,  Tang Y. Tan

    IPC: G06F3/041 ,  G06F3/044

    Abstract: An electronic device can include a housing and an interface component. The interface component can at least partially define an interface surface, and the interface component and the housing can define an internal volume. A force sensor assembly can be disposed in the internal volume to detect an amount of force applied to the interface surface. The force sensor assembly can include a pressure decay sensor and a gap distance sensor disposed opposite a surface of the interface component.

    Component shielding structures with magnetic shielding
    95.
    发明授权
    Component shielding structures with magnetic shielding 有权

    公开(公告)号：US10225964B2

    公开(公告)日：2019-03-05

    申请号：US15250066

    申请日：2016-08-29

    Applicant: Apple Inc.

    Inventor： James B. Smith ,  Daniel W. Jarvis ,  David A. Pakula ,  Gregory N. Stephens ,  Nicholas G. L. Merz ,  Shayan Malek ,  Sina Bigdeli

    IPC: H05K9/00 ,  H05K1/18 ,  H01L23/552

    Abstract: Electrical components may be shielded using a shielding can or other shielding structure that covers the electrical components. The electrical components and the shielding structure may be mounted on a substrate such as a printed circuit board using solder or other conductive material. The shielding structure may have one or more shielding layers. The shielding layers may include high conductivity material for providing shielding for radio-frequency electromagnetic interference and magnetic material for blocking magnetic flux. Shielding structures may be formed from materials such as ferritic stainless steel, coatings that enhance solderability, corrosion resistance, and conductivity, magnetic materials printed or otherwise formed on metal layers, and other shielding structures.

    Battery for routing signals
    98.
    发明授权
    Battery for routing signals 有权

    公开(公告)号：US09966587B2

    公开(公告)日：2018-05-08

    申请号：US14832989

    申请日：2015-08-21

    Applicant: Apple Inc.

    Inventor： Richard A. Besen ,  David A. Pakula ,  Gregory N. Stephens

    IPC: H01M10/02 ,  H01M2/30 ,  G06F1/26 ,  H01M2/10 ,  H01M10/42

    CPC classification number: H01M2/30 ,  G06F1/26 ,  H01M2/1016 ,  H01M2/1066 ,  H01M10/4257

    Abstract: This application relates to batteries that are capable of routing signals that are separate from the charge supplied by the batteries. In some embodiments, a battery can incorporate a conductive trace that extends through a portion of the battery to allow for signals to be routed through the battery, as opposed to around the battery. The conductive trace can be a single wire, multiple wires, a coaxial trace, optical cable, or any other mechanism for allowing a signal to be transmitted between one or more components. By providing the conductive trace within the battery, shorter pathways to components can be created thereby reducing signal or power loss over the pathways.

    Thermal gap pad
    99.
    发明授权
    Thermal gap pad 有权
    热间隙垫

    公开(公告)号：US09445528B2

    公开(公告)日：2016-09-13

    申请号：US14323874

    申请日：2014-07-03

    Applicant: Apple Inc.

    Inventor： Sawyer I. Cohen ,  David A. Pakula ,  Tseng-Mau Yang ,  Tyler B. Cater ,  Ashutosh Y. Shukla

    IPC: H05K7/20 ,  F28F21/02 ,  G06F1/20 ,  F28F21/06

    CPC classification number: H05K7/20454 ,  F28F21/02 ,  F28F2013/006 ,  F28F2255/02 ,  G06F1/20 ,  H05K7/20481

    Abstract: This application relates to efficiently distributing heat within a portable computing device. More specifically an apparatus for conducting heat between internal components of the portable computing device is disclosed. The apparatus, referred to as a thermal gap pad, is configured to bridge a variably sized gap between internal components. This is accomplished by wrapping a resilient core in a layer of highly thermally conductive material. The resilient core allows a shape of the thermal gap pad to vary in accordance with a size of the gap. A resilience of the thermal gap pad can be adjusted to account for an amount of variance in the gap. In some embodiments, an electrically conductive layer can be added to facilitate the passage of electrical current through the thermal gap pad.

    Abstract translation: 本申请涉及在便携式计算设备内有效地分配热量。 更具体地，公开了一种用于在便携式计算设备的内部部件之间传导热量的装置。 被称为热间隙垫的装置构造成在内部部件之间桥接可变尺寸的间隙。 这通过将弹性芯包裹在高导热材料层中来实现。 弹性芯允许热间隙垫的形状根据间隙的大小而变化。 可以调节热间隙垫的弹性以考虑间隙中的变化量。 在一些实施例中，可以添加导电层以促进电流通过热间隙垫。

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