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公开(公告)号：US08934201B1
公开(公告)日：2015-01-13
申请号：US14143002
申请日：2013-12-30
发明人： Xian Wen Feng , Tan Tian
IPC分类号： G11B5/127
CPC分类号： G11B5/4846 , H05K1/056 , H05K1/111 , H05K1/118 , H05K2201/09381
摘要： A flexure includes a substrate layer, a dielectric layer formed thereon, and a conducting layer formed on the dielectric layer, the conducting layer includes multiple conductive traces and multiple bonding pads arranged in a first direction and adapted for connecting with a PCB, each bonding pad includes a first portion and a second portion, a first window is opened on the substrate layer, and a second window is opened on the dielectric layer to expose the bonding pads, wherein the substrate layer includes multiple first protuberances extending from at least one side wall of the first window along a second direction which is perpendicular to the first direction to cover the first portion of each bonding pad, and the second portion of each bonding pad includes at least one notch or hole. The flexure is applicable to connected with a PCB by soldering jetting process or hot bar process.
摘要翻译： 弯曲部包括基底层，形成在其上的电介质层和形成在电介质层上的导电层，导电层包括多个导电迹线和沿第一方向布置并适于与PCB连接的多个接合焊盘，每个接合焊盘 包括第一部分和第二部分，在基底层上打开第一窗口，并且在介电层上打开第二窗口以暴露接合垫，其中基底层包括从至少一个侧壁延伸的多个第一突起 所述第一窗口沿着垂直于所述第一方向的第二方向覆盖每个接合焊盘的第一部分，并且每个接合焊盘的第二部分包括至少一个凹口或孔。 该弯曲适用于通过焊接喷射工艺或热棒工艺与PCB连接。
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公开(公告)号：US08888380B2
公开(公告)日：2014-11-18
申请号：US13845095
申请日：2013-03-18
CPC分类号： G02B6/43 , G02B6/4214 , G02B6/423 , G02B6/4239 , G02B6/4243 , G02B6/4246 , G02B6/4284
摘要： An optoelectronic assembly includes a substrate subassembly and a cable subassembly. The substrate assembly includes a substrate, a holder disposed on the substrate, an optoelectronic interface IC, and a plurality of optoelectronic components. The cable subassembly includes a lens cover and a plurality of fiber cables bonded to the lens cover. The optoelectronic interface IC and the optoelectronic components are disposed in a cavity formed by side walls of the holder. The optoelectronic components include at least one laser source and a plurality of photodiodes. The lens cover is inserted into the cavity and thereby fixedly engaged with the holder.
摘要翻译： 光电组件包括衬底子组件和电缆子组件。 衬底组件包括衬底，设置在衬底上的保持器，光电接口IC和多个光电子部件。 电缆子组件包括透镜盖和结合到透镜盖的多根光缆。 光电接口IC和光电子部件设置在由保持器的侧壁形成的空腔中。 光电子部件包括至少一个激光源和多个光电二极管。 透镜盖插入空腔中，从而与支架固定接合。
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公开(公告)号：US08811130B1
公开(公告)日：2014-08-19
申请号：US14038160
申请日：2013-09-26
发明人： Seiichi Takayama , Ryuji Fujii , Osamu Harakawa , Hideki Tanzawa , Tadatoshi Koba , Takashi Honda
CPC分类号： G11B5/314 , G11B5/6088 , G11B2005/0021
摘要： A method of manufacturing a thermally-assisted magnetic head includes aligning the light source unit to the thermally-assisted magnetic head section on the slider body; and performing a bonding between the unit substrate and the slider body with a bonding layer in between. And process of the bonding includes irradiating the bonding layer with a first laser shot, pausing for a time interval after the first laser shot, and then irradiating a second laser shot, wherein a first irradiating power of the first laser shot is weaker than a second irradiating power of the second laser shot, and a first irradiating time of the first laser shot is shorter than a second irradiating time of the second laser shot. The method can keep an accurate alignment of the unit substrate with respect to the slider after a bonding process and, in turns improve performance of the thermally-assisted magnetic head.
摘要翻译： 制造热辅助磁头的方法包括将光源单元与滑块体上的热辅助磁头部对准; 以及在所述单元基板和所述滑块体之间进行接合，其间具有接合层。 并且所述接合处理包括用第一激光射击照射所述接合层，在所述第一激光射击之后暂停一段时间间隔，然后照射第二激光照射，其中所述第一激光照射的第一照射光强弱于第二激光照射 所述第二激光照射的照射功率和所述第一激光照射的第一照射时间比所述第二激光照射的第二照射时间短。 该方法可以在接合过程之后保持单元基板相对于滑块的精确对准，并且进而改善热辅助磁头的性能。
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94.发明授权Magnetic head, head gimbal assembly and disk drive unit with the same, and manufacturing method thereof 有权磁头，磁头万向架组件和磁盘驱动单元及其制造方法公开(公告)号：US08810965B2
公开(公告)日：2014-08-19
申请号：US13770245
申请日：2013-02-19
发明人： Li ping Peng , Shen kuang Sidney Chou , Chi hung Yuen , Yan bin Wang , Lu Xiao
CPC分类号： G11B5/4853 , G11B5/4826
摘要： A magnetic head includes a slider substrate having a trailing edge and multiple bonding pads arranged on the trailing edge in a row. Each of the bonding pads includes a seed layer adhered to the trailing edge and electrically connected with the slider substrate, a soldering layer formed on the seed layer and adapted for connecting with a suspension, and at least one solder nonwettable layer adhered to the trailing edge and connected with at least one side of the seed layer. The structure of the magnetic head is simple and stable, which can prevent the bonding pads bridging and shorting-circuit. An HGA and a disk drive unit with the same, a manufacturing method for the magnetic head are also disclosed.
摘要翻译： 磁头包括具有后缘的滑块基板和排列在后缘上的多个键合焊盘。 每个接合焊盘包括粘附到后缘并与滑块基板电连接的种子层，形成在籽晶层上并适于与悬浮液连接的焊接层，以及粘附到后缘的至少一个不可焊焊膏层 并与种子层的至少一侧连接。 磁头的结构简单稳定，可防止焊盘桥接和短路。 还公开了一种HGA和具有该磁盘驱动单元的磁盘驱动单元，该磁头的制造方法也被公开。
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95.发明授权公开(公告)号：US08801945B2
公开(公告)日：2014-08-12
申请号：US14145329
申请日：2013-12-31
发明人： Natsuo Nishijima , Ryuji Fujii , Hong Tao Ma , Jian Hui Huang , Huan Chao Liang , Zhong Xian Wei
CPC分类号： G11B5/1272 , G11B5/3136 , G11B5/314 , G11B2005/0021
摘要： A write element for a thermally assisted magnetic head slider includes an air bearing surface facing to a magnetic recording medium; a first magnetic pole, a second magnetic pole, and coils sandwiched between the first and the second magnetic poles; a waveguide for guiding light generated by a light source module mounted on a substrate; and a plasmon unit provided around the first magnetic pole and the waveguide, which has a near-field light generating surface for propagating near-field light to the air bearing surface. The near-field light generating surface of the plasmon unit is apart from the air bearing surface with a first predetermined distance to form a first recess, and the first recess is filled in with a protective layer. The thermally assisted magnetic head slider can prevent the plasmon unit from protruding over the air bearing surface, thereby improving the performance of thermally assisted magnetic head.
摘要翻译： 用于热辅助磁头滑块的写元件包括面向磁记录介质的空气轴承表面; 第一磁极，第二磁极和夹在第一和第二磁极之间的线圈; 用于引导由安装在基板上的光源模块产生的光的波导; 以及设置在第一磁极和波导周围的等离子体元件单元，其具有用于将近场光传播到空气轴承表面的近场光产生表面。 等离子体激元单元的近场光产生表面与第一预定距离的空气轴承表面分开以形成第一凹部，并且第一凹部填充有保护层。 热辅助磁头滑块可以防止等离子体单元在空气轴承表面上突出，从而提高热辅助磁头的性能。
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公开(公告)号：US20140185638A1
公开(公告)日：2014-07-03
申请号：US14200826
申请日：2014-03-07
发明人： Takemasa TAMANUKI
IPC分类号： H01S5/026
CPC分类号： H01S5/0261 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48137 , H01L2224/48195 , H01L2224/4918 , H01L2924/00014 , H01L2924/12042 , H01L2924/19105 , H01S5/02248 , H01S5/02276 , H01S5/02415 , H01S5/0428 , H01S5/4025 , H04B10/503 , H01L2224/45099 , H01L2224/05599 , H01L2924/00
摘要： There are provided an optical module including a semiconductor laser including a P-side electrode and an N-side electrode, and a semiconductor laser driver circuit that drives the semiconductor laser so as to output an optical signal from the semiconductor laser according to a pattern of a differentially transmitted digital electric signal, and the semiconductor laser driver circuit includes a positive-side terminal and a negative-side terminal for differentially transmitted non-inverted data, and a positive-side terminal and a negative-side terminal for differentially transmitted inverted data, and one terminal for the non-inverted data is electrically connected to one electrode of the semiconductor laser, and the other terminal for the non-inverted data, one terminal for the inverted data and the other terminal for the inverted data each are connected to the other electrode of the semiconductor laser.
摘要翻译： 提供了一种包括具有P侧电极和N侧电极的半导体激光器的光学模块，以及半导体激光驱动电路，其驱动半导体激光器，以便根据半导体激光器的图案输出来自半导体激光器的光信号 差分发送的数字电信号，并且半导体激光驱动电路包括用于差分发送的非反相数据的正侧端子和负侧端子，以及用于差分发送的反相数据的正侧端子和负极侧端子 并且用于非反转数据的一个端子电连接到半导体激光器的一个电极，并且用于非反转数据的另一个端子，用于反相数据的一个端子和用于反相数据的另一个端子连接到 半导体激光器的另一个电极。
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97.发明授权公开(公告)号：US08743665B2
公开(公告)日：2014-06-03
申请号：US13904675
申请日：2013-05-29
发明人： Ryuji Fujii , Tai Boon Lee , Hideki Tanzawa , Yasuhiro Konakawa
IPC分类号： G11B11/00
CPC分类号： G11B13/04 , G11B5/102 , G11B2005/0021 , Y10T29/49032 , Y10T428/23 , Y10T428/24612 , Y10T428/24942
摘要： A manufacturing method of a light source chip for a thermally assisted head comprises steps of (a) providing a light source bar with a surface coating formed thereon; (b) forming several blind holes on the predetermined positions of the light source bar by etching, the blind hole having a top hollowed on the surface coating and a bottom hollowed on the light source bar, and the blind hole having a first biggest width at its top; (c) cutting the light source bar along every two adjacent blind holes by a cutting machine. The cutting machine has a cutting means with a second biggest width that is smaller than the first biggest width of the blind hole, thereby cutting down an individual light source chip without contacting the side edges of the blind hole. Thus a light source chip with a smooth edge and without cracks on the surface can be obtained; and the surface coating formed thereon is hard to be peeled off.
摘要翻译： 一种用于热辅助头的光源芯片的制造方法，包括以下步骤：（a）提供其上形成有表面涂层的光源棒; （b）通过蚀刻在光源棒的预定位置上形成若干个盲孔，盲孔具有在表面涂层上挖空的顶部和在光源棒上挖空的底部，盲孔具有第一最大宽度 其顶部 （c）通过切割机沿着每两个相邻的盲孔切割光源棒。 切割机具有第二最大宽度小于盲孔的第一最大宽度的切割装置，从而在不接触盲孔的侧边缘的情况下切割单独的光源芯片。 因此，可以获得具有光滑边缘并且在表面上没有裂纹的光源芯片; 并且其上形成的表面涂层难以剥离。
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98.发明申请MEMORY DEVICE, LAMINATED SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 审中-公开存储器件，层压半导体基板及其制造方法公开(公告)号：US20140124959A1
公开(公告)日：2014-05-08
申请号：US14152534
申请日：2014-01-10
发明人： Yoshitaka SASAKI , Hiroyuki ITO , Atsushi IIJIMA
IPC分类号： H01L25/065 , H01L23/00
CPC分类号： H01L25/0657 , H01L21/76232 , H01L24/24 , H01L24/82 , H01L24/95 , H01L25/18 , H01L25/50 , H01L2224/03 , H01L2224/05554 , H01L2224/0556 , H01L2224/24101 , H01L2224/24145 , H01L2224/25175 , H01L2224/8385 , H01L2224/94 , H01L2225/06513 , H01L2225/06517 , H01L2225/06551 , H01L2924/00014 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/00 , H01L2224/05552
摘要： A memory device has a laminated chip package and a controller chip. In the laminated chip package, a plurality of memory chips are laminated. An interposed chip is laminated between the laminated chip package and the controller chip. The memory chips have a plurality of first wiring electrodes. The interposed chip has a plurality of second wiring electrodes. The second wiring electrodes are formed with a common arrangement pattern common with an arrangement pattern of a plurality of wiring electrodes for controller which are formed in the controller chip. The controller chip is laid on the interposed chip.
摘要翻译： 存储器件具有层叠芯片封装和控制器芯片。 在层叠芯片封装中，层叠多个存储芯片。 在层压芯片封装和控制器芯片之间层压插入的芯片。 存储芯片具有多个第一布线电极。 插入的芯片具有多个第二布线电极。 第二布线电极形成有与形成在控制器芯片中的多个用于控制器的布线电极的布置图案相同的共同布置图案。 控制器芯片放置在插入的芯片上。
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公开(公告)号：US20140097327A1
公开(公告)日：2014-04-10
申请号：US13648257
申请日：2012-10-09
CPC分类号： G06F3/03547 , G01J1/4204 , G01J1/4228 , G06F3/0425
摘要： An optical finger navigation module includes a light source configured for emitting light in a first spectrum; a cover housing disposed above the light source, the cover housing including a window plate that is configured to transmit light in at least the first spectrum, and a light guiding structure that is configured to transmit light in at least a second spectrum; a first light sensor configured to sense light in the first spectrum originally emitted by the light source, reflected by an object, and then transmitted through the window plate; a second light sensor configured to sense light in the second spectrum transmitted through the light guiding structure or the window plate; and a substrate. The light source, the cover housing, the first light sensor and the second light sensor are coupled and mounted to the substrate.
摘要翻译： 光学手指导航模块包括被配置为发射第一光谱的光的光源; 设置在所述光源上方的盖壳体，所述盖壳体包括构造成在至少所述第一光谱中透射光的窗板，以及被配置为在至少第二光谱中透射光的导光结构; 第一光传感器，被配置为感测由光源原始发射的第一光谱中的光，被物体反射，然后透过窗板; 第二光传感器，被配置为感测透过所述导光结构或所述窗板的第二光谱中的光; 和基材。 光源，盖壳体，第一光传感器和第二光传感器耦合并安装到基板。
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100.发明授权Method for manufacturing an electronic device including a light absorption layer 有权包括光吸收层的电子器件的制造方法公开(公告)号：US08687469B1
公开(公告)日：2014-04-01
申请号：US13708593
申请日：2012-12-07
发明人： Seiichi Takayama , Yasuhiro Ito , Nobuyuki Mori , Koji Shimazawa , Kazuaki Takanuki , Youichi Ando
IPC分类号： G11B11/00
CPC分类号： G11B5/105 , G11B2005/0021
摘要： A method of manufacturing an electronic device includes a first bonding step of bonding an electronic component and a first member together via a first bonding layer and a second bonding step of bonding the first member and a second member together via a second bonding layer after the first bonding step. The second bonding layer includes a bonding material layer made of a bonding material. In the second bonding step, with the bonding material interposed between the first and second members before being bonded together, the bonding material is heated and melted using light traveling through the first member. The first member is made of Si. The light has a wavelength in the range of 1100 to 15000 nm.
摘要翻译： 一种制造电子器件的方法包括：第一接合步骤，通过第一接合层将电子部件和第一部件接合在一起;以及第二接合步骤，通过第二接合层在第一接合层之后将第一部件和第二部件接合在一起 结合步骤。 第二接合层包括由接合材料制成的接合材料层。 在第二接合步骤中，在接合材料在被接合在一起之前介于第一和第二构件之间的接合材料中，使用通过第一构件的光进行接合材料的加热和熔化。 第一个成员是由Si制成。 光的波长在1100〜15000nm的范围内。
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