Abstract:
A photodetector for power monitoring purposes may be positioned directly on a planar light circuit. The photodetector may be protected by hermetically sealing a localized region over the planar light circuit corresponding to the position of the photodetector. The remainder of the planar light circuit may remain unsealed.
Abstract:
A covering for apertures of reaction receptacles formed in a microtitration plate, including a hermetic, elastically deforming mat or foil, a frame, and connecting elements. The mat or foil, upon planar deposition on the microtitration plate and following compression, seals the apertures. The connecting elements are fitted onto at least one of the mat or foil and frame and detachably secure the mat or foil to the frame while creating a tension in the mat or foil implementing the connection. The frame (11, 110) is dimensioned so as to permit the frame to be deposited on the microtitration plate (13), such-that the mat (12, 120) or foil rests in a planar manner on the microtitration plate, and such that the frame is accessible from above to a pressure and/or heat applying device.
Abstract:
This invention relates to a fluorescent lamp with a discharge vessel enclosing a discharge path and containing a gas fill. The gas fill may be by excited by a discharge arc. The discharge vessel has at least two sections located adjacent to each other. There are bypass means for providing a bypass path for the gas discharge during a startup of the lamp between the two adjacent sections of the discharge vessel. The bypass path results in a short-cut across the impedance of a portion of the discharge path. A method for starting a discharge arc of the fluorescent lamp is also disclosed. In the method, a voltage is applied between two electrodes across the discharge path, and a bypass path is provided between two ends of a bypassed part of the discharge path. The discharge path is divided into a bypassed part and a remaining part. The combined impedance of the bypass path and the associated bypassed part is selected to be lower than the impedance of the associated bypassed part, and thereby a relatively increased voltage is provided across the remaining part. The gas fill is excited in the remaining part of the discharge path with the help of the increased voltage. Thereafter the impedance of the remaining part is lowered and the voltage across the bypassed part is increased. Finally, the gas fill is excited in the bypassed part by the relatively increased voltage across the bypassed part.
Abstract:
A vehicle interior rearview mirror assembly comprises a housing having a front end releasably attached to the interior surface of the vehicle windshield and a rear end having a ball and socket joint for a rearview mirror unit. An internal wall subdivides the interior of the housing into first and second compartments. The first compartment contains a rain sensor which is preferably biased into contact with the windshield, and the second compartment contains a further electrical component such as a compass sensor accessible through a side opening. A removable cover mates with the housing around the opening and extends along the windshield towards the vehicle header. Electrical leads for the rain sensor and the component are routed under the cover to the header.
Abstract:
A method and apparatus are provided for adhesive bonding of a backing plate for a sensor assembly to a vehicle window, especially a windscreen of a passenger car or truck. The backing plate has an adhesive layer and is heated at least in the area of the adhesive layer by a heating device until the adhesive layer is softened sufficiently to carry out adhesive bonding. The backing plate is transferred into a contact pressure device and the contact pressure device presses the backing plate with the adhesive layer on to the vehicle window for a predetermined length of time. In order to improve the usability of such a method in the context of mass production, it is provided that the heating device emits infrared radiation, heating of the adhesive layer being carried out until it has softened sufficiently by positioning the backing plate with the adhesive layer facing the heating device at a close spacing for a predetermined length of time.
Abstract:
A rectangular field emission display has a front member with a glass anode support, and a first sidewall section; the display also has a cathode substrate containing an embedded cathode; the display has a rear member with a planar section and a sidewall section; and the display has an evacuated space. The front member and the rear member enclose at least a portion of the cathode substrate. The evacuated space separates the entire anode support section and the cathode substrate.
Abstract:
An image sensor package (10) includes a housing (34) defining a top opening, an image sensor (14) received in the housing, and a converging lens (36) covering the opening to hermetically seal the housing and form a window for light to pass through into the housing. The image sensor has an active area which faces the converging lens and which is responsive to light. The converging lens not only provides hermetic sealing for the housing, but also converges light before the light strikes the active area of the image sensor. Accordingly, a focal length F is reduced, and a size of the image sensor package and the image sensor system can be reduced.
Abstract:
An image sensor having improved functions. The image sensor includes a plurality of metal sheets arranged in a matrix, an insulation layer, a photosensitive chip, a plurality of wires, a glue layer, and a transparent layer. Each metal sheet has a first board and a second board. The insulation layer is adhered to the first boards to fix the first boards. The photosensitive chip is arranged on the first boards. The wires electrically connect the photosensitive chip to the first boards. The glue layer encapsulates the metal sheets with the first boards and second boards exposed from the glue layer, and the glue layer is formed with a projection edge. The transparent layer is placed on the projection edge to cover the photosensitive chip.
Abstract:
A digital CMOS sensor including a chip. A periphery of the chip has a lead frame connecting with the lead of the chip. A color filtering layer is directly vapor deposited on the chip and the lead frame for filtering specific frequency of optical wave and comparing the optical wave.
Abstract:
A device for sensing currency comprises means for deriving a signal from a currency item and means for deriving values representative of a characteristic or characteristics of the currency item from said signal using an inverse representation of part of the sensing device.