摘要:
Silicon single crystal wafers for semiconductor devices of high quality are obtained with high productivity by effectively reducing or eliminating grown-in defects in surface layers of silicon single crystal wafers produced by the CZ method. The present invention provides a method for producing a silicon single crystal wafer, which comprises growing a silicon single crystal ingot by the Czochralski method, slicing the single crystal ingot into a wafer, subjecting the wafer to a heat treatment at a temperature of 1100-1300° C. for 1 minute or more under a non-oxidative atmosphere, and successively subjecting the wafer to a heat treatment at a temperature of 700-1300° C. for 1 minute or more under an oxidative atmosphere without cooling the wafer to a temperature lower than 700° C. The present invention also provides a CZ silicon single crystal wafer, wherein density of COPs having a size of 0.09 &mgr;m or more in a surface layer having a thickness of up to 5 &mgr;m from a surface is 1.3 COPs/cm2 or less, and density of COPs having a size of 0.09 &mgr;m or more in a bulk portion other than the surface layer is larger than the density of COPs of the surface layer.
摘要翻译:通过有效地减少或消除由CZ方法生产的硅单晶晶片的表面层中的生长缺陷,以高生产率获得高质量的半导体器件的硅单晶晶片。 本发明提供了一种硅单晶晶片的制造方法,其包括通过切克劳斯基法(Czochralski method)生长硅单晶锭,将单晶锭切割成晶片,使晶片在1100-1300℃的温度下进行热处理 在非氧化性气氛下保持1分钟以上,并且在氧化气氛下依次使晶片在700-1300℃的温度下进行1分钟以上的热处理,而不将晶片冷却至温度 本发明还提供了一种CZ硅单晶晶片,其中表面层中具有0.09μm或更大的厚度的COP的密度从表面至多为5μm的浓度为1.3个COPs / cm 2 在表面层以外的本体部分中,具有0.09μm以上的尺寸的COP的密度大于表层的COP的密度。
摘要:
A method is provided for making carbon-steel blind slats and products thereof by slitting the carbon-steel sheet into pieces of desired width, trimming the edges, quenching, speedy cooling, tempering, and painting and baking. The blind product made by this method is merited in resilience, lifetime, easy maintenance, heat-resistance, fad-resistance, and is retrievable and reusable to conform to the environment protection conditions.
摘要:
Disclosed is an elongated metallic article having a curved section therein which has a first part formed on an outside part of the curved section, and a second part formed on an inside part of the curved section. The first part was initially deformed beyond a region of twin boundary deformation, but was thereafter returned to the region of twin boundary deformation. The second part was left deformed beyond the region of twin boundary deformation. When a compressive load is applied to the thus prepared article, and the first part and the second part are both compressed, the first part can deform more readily than the second part so that the article deforms into a more straight shape as its deformation progresses. Thus, the article may be made resistant to buckling in spite of the presence of the curved section.
摘要:
A manufacturing method for a shaped light metal article includes the steps of forming a plastic worked article by plastic working an article for plastic working made of light metal material, and subjecting the plastic worked article to a post-plastic working heat treatment for between 20 minutes and 10 hours at a temperature in a range of 250 to 400° C. As a result, a shaped light metal article is produced with sufficient ductility.
摘要:
A method is disclosed for preheating a metal strip in at least one direct fired preheating section of a furnace for limiting the oxidation of the metal strip. The method includes installing burners in the preheating section along its length for establishing a plurality of preheating sub-zones of unit length corresponding to one burner. The air and fuel settings for each burner are adjusted in accordance with a desired heat demand. Subsequent steps include operating a variable number of downstream burners at full power to establish a preheating zone of variable length to produce the desired heat demand, and extinguishing a second variable number of upstream burners to establish a corresponding variable recovery zone.
摘要:
A device and a process for tempering at least parts of the cross section of sequentially produced profiled rolling stock from the rolling heat and for the subsequent cooling thereof to room temperature. The device comprises a hardening device comprising at least to liquid cooling devices arranged next to each other and a transport device having rests for the rolling stock that can be moved across the entire hardening device. Thereby the liquid cooling devices can simultaneously and independently be supplied with rolling stock to be hardened.
摘要:
A tungsten powder having a powder specific surface of 0.4 m2/g or more is hot-pressed at a temperature of 1,600° C. or more and then subjected to HIP at a temperature of 1,700° C. or more without capsuling, whereby a tungsten target for sputtering is manufactured that has a relative density of 99% or more and an average crystal grain size of 100 &mgr;m or less. This manufacturing method can manufacture, stably at a low cost, a tungsten target having such a high density and fine crystal structure as cannot be attained by the conventional pressure sintering method, and can greatly decrease the number of particle defects on a film produced by using such a target.
摘要:
A hydrogen storage alloy of TiaMnbVcZrd (one of two kinds or more of Fe, Co, Cu, Zn, Ca, Al, Mo and Ni)x (herein, a is 10 to 40 atomic %, b is 40 to 60 atomic %, c is 5 to 30 atomic %, d is 15 atomic % or less, and x is 0 to 10 atomic %) is obtained by the rapid solidification (solidification at the cooling rate of desirably 103° C./sec or higher).
摘要:
A method for creep cavity shrinkage and/or porosity reduction without applied stress. The thermal treatment is found to increase the rate of densification relative to isothermal annealing, allowing for more rapid recovery of desired theoretical density in a shorter time.