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    Multi-frequency uniformization carrier wave slope random distribution pulse width modulation method
    2.
    发明授权
    Multi-frequency uniformization carrier wave slope random distribution pulse width modulation method 有权

    公开(公告)号：US11418176B2

    公开(公告)日：2022-08-16

    申请号：US17313038

    申请日：2021-05-06

    申请人： Naval University of Engineering

    发明人： Jie Xu ,  Ziling Nie ,  Junjie Zhu ,  Tinghao Wu ,  Weiwei Ye ,  Yi Han ,  Xingfa Sun ,  Wenkai Xu ,  Jingxin Yuan

    IPC分类号： H03K3/84 ,  H02M7/5387

    摘要： A multi-frequency uniformization carrier wave slope random distribution pulse width modulation method, includes: (1) selecting a required random carrier wave sequence and a modulating wave, and after the two are compared, generating a switch device drive signal for pulse width modulation; (2) determining a multiple n of an equivalent carrier frequency f of the random carrier wave sequence, and selecting a main circuit topology; and (3) inputting the switch device drive signal generated in (1) into the main circuit topology of (2) to perform multi-frequency uniformization carrier wave slope random distribution pulse width modulation. The disclosure can improve a frequency domain distribution bandwidth of a harmonic wave without changing the mean and variance of a random carrier wave sequence, and realizes uniform distribution of carrier waves and multiple harmonic peaks near a doubled frequency of the carrier waves in a wider frequency domain.

    MULTI-FREQUENCY UNIFORMIZATION CARRIER WAVE SLOPE RANDOM DISTRIBUTION PULSE WIDTH MODULATION METHOD
    3.
    发明申请
    MULTI-FREQUENCY UNIFORMIZATION CARRIER WAVE SLOPE RANDOM DISTRIBUTION PULSE WIDTH MODULATION METHOD 有权

    公开(公告)号：US20210258000A1

    公开(公告)日：2021-08-19

    申请号：US17313038

    申请日：2021-05-06

    申请人： Naval University of Engineering

    发明人： Jie XU ,  Ziling NIE ,  Junjie ZHU ,  Tinghao WU ,  Weiwei YE ,  Yi HAN ,  Xingfa SUN ,  Wenkai XU ,  Jingxin YUAN

    IPC分类号： H03K3/84 ,  H02M7/5387

    摘要： A multi-frequency uniformization carrier wave slope random distribution pulse width modulation method, includes: (1) selecting a required random carrier wave sequence and a modulating wave, and after the two are compared, generating a switch device drive signal for pulse width modulation; (2) determining a multiple n of an equivalent carrier frequency f of the random carrier wave sequence, and selecting a main circuit topology; and (3) inputting the switch device drive signal generated in (1) into the main circuit topology of (2) to perform multi-frequency uniformization carrier wave slope random distribution pulse width modulation. The disclosure can improve a frequency domain distribution bandwidth of a harmonic wave without changing the mean and variance of a random carrier wave sequence, and realizes uniform distribution of carrier waves and multiple harmonic peaks near a doubled frequency of the carrier waves in a wider frequency domain.

    Hot repair material of refractory materials
    4.
    发明授权
    Hot repair material of refractory materials 有权

    公开(公告)号：US11384026B1

    公开(公告)日：2022-07-12

    申请号：US17684703

    申请日：2022-03-02

    申请人： Naval University of Engineering

    发明人： Zichun Yang ,  Guobing Chen ,  Feiyue Yang ,  Shuang Zhao ,  Zhifang Fei ,  Jun Chen ,  Jun Li ,  Lei Zhang ,  Kunfeng Li ,  Wencai Sun

    IPC分类号： C04B35/66 ,  C04B35/565 ,  C04B35/634 ,  C04B41/00 ,  C04B41/50 ,  C04B41/87 ,  C04B35/622

    摘要： A hot repair material of refractory materials is provided and includes main materials and binding agents. The main materials include silicon carbide powders with six different particle sizes and a mass ratio according to particle sizes from large to small is 8:5:8:15:8:10. The binding agents include silicon nitride powders, a sodium silicate powder, an aluminum phosphate powder, a furfuryl alcohol, a silicone resin powder, a silica sol powder, an aluminum sol powder, a silicon oxide micronized powder, a vanadium oxide powder, a silicon powder, a borax and a rare earth oxide micronized powder, and a corresponding mass ratio is 20:10:4:1:5:1:1:2:0.5:0.5:0.5:0.5. The silicon carbide powders in the main materials have a good synergistic effect to improve strength of the repair material. The binding agents include low-, medium- and high-temperature binding agents for a full range of temperatures, so the repair material could gain strength continuously without a collapse temperature.