公开(公告)号：US20140102765A1

公开(公告)日：2014-04-17

申请号：US13652122

申请日：2012-10-15

申请人： ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBST

发明人： Dror Hurwitz ,  Alex Huang

IPC分类号： H05K1/02 ,  H05K3/00

CPC分类号： H05K1/0298 ,  H05K3/0061 ,  H05K3/4647 ,  H05K2201/10378 ,  Y10T29/49126 ,  Y10T29/49158 ,  Y10T29/49163

摘要： A method of fabricating a multilayer electronic support structure comprising electroplating copper substructures, laying a dielectric pre-preg comprising a polymer resin over the copper substructures, and pressing to pressures of 200 to 600 PSI against a release film having a higher hardness than the resin of the prepreg but a lower hardness than the cured resin, and heating through a curing cycle whilst maintaining pressure.

摘要翻译： 一种制造多层电子支撑结构的方法，包括电镀铜底层结构，将包含聚合物树脂的电介质预浸料铺设在铜基底结构上，并压制200至600PSI的压力，以抵抗具有比 预浸料，但硬度低于固化树脂，并且通过固化循环加热同时保持压力。