Packaging method for organic semiconductor device

    公开(公告)号:US10205123B2

    公开(公告)日:2019-02-12

    申请号:US15328387

    申请日:2016-12-26

    Inventor: Jiangjiang Jin

    Abstract: A packaging method for organic semiconductor device is disclosed, and comprising steps of manufacturing an organic semiconductor device on a flexible base; forming a photoresist block having a predetermined interval with respect to the organic semiconductor device and located at two sides of the organic semiconductor device on the flexible base; depositing an inorganic layer on the photoresist block, the organic semiconductor device and the flexible base; removing the photoresist block and inorganic layer on the photoresist block; and depositing an organic layer on the inorganic layer disposed on the organic semiconductor device. The present invention can form an inorganic/organic flexible OLED packaging structure. The packaging structure cannot only omit a deposition mask used in depositing an inorganic layer in the conventional thin-film packaging art, but also effectively increase a blocking property of moisture and oxygen of OLED device in order to increase the life of the OLED device.

    OLED PACKAGING METHOD AND OLED PACKAGE STRUCTURE

    公开(公告)号:US20180219178A1

    公开(公告)日:2018-08-02

    申请号:US15505116

    申请日:2016-12-29

    CPC classification number: H01L51/5253 H01L51/0003 H01L51/56 H01L2251/303

    Abstract: The present invention provides an OLED packaging method and an OLED package structure. The OLED packaging method according to the present invention is such that a first outer bound confinement layer is first formed and then, a first organic layer is formed on the first inorganic layer in an area enclosed by the first outer bound confinement layer so that facilities for forming the first organic layer can be diversified and an organic material used to form the first organic layer is not subjected to constraint in respect of viscosity thereof, whereby using an organic material with a reduced viscosity allows for better homogeneity of the first organic layer, the thickness reduced, and thus helping reduce a curving radius of the OLED package structure to realize rollable displaying with a reduced curving radius. Further, the first outer bound confinement layer helps block external moisture and oxygen from corroding the first organic layer in a sideway direction so that the OLED package structure so manufactured exhibits better capability for blocking moisture and oxygen and extended service life. The OLED package structure according to the present invention allows for realization of rollable displaying with a reduced curving radius and also exhibits better capability for blocking moisture and oxygen and extended service life.

    OLED package structure
    3.
    发明授权

    公开(公告)号:US10547029B2

    公开(公告)日:2020-01-28

    申请号:US16285126

    申请日:2019-02-25

    Abstract: An OLED package structure includes a first outer bound confinement layer formed on an OLED device, a first outer bound confinement layer arranged on the first inorganic layer and enclosing and delimiting a confinement space, a first organic layer formed on the first inorganic layer in the confinement space, and a second inorganic layer arranged on the first organic layer and the first outer bound confinement layer, such that a peripheral portion of the second inorganic layer is positioned on and supported by the first outer bound confinement layer and a central portion of the second inorganic layer is partly received in the confinement space to have a bottom of the second inorganic layer positioned on and contacting a top of the first organic layer.

    Flexible display panels and manufacturing methods thereof

    公开(公告)号:US10468630B2

    公开(公告)日:2019-11-05

    申请号:US15567566

    申请日:2017-05-03

    Abstract: The present disclosure relates to the field of liquid crystal display technology, and more particularly, to the flexible display panel and the manufacturing method thereof. The method includes forming the polymer on the anode layer from vapor of the organic dimer as the micro-cavity adjusting layer by the chemical vapor deposition method at the controlled temperature between 650° C. to 750° C. The structural formula of the organic dimer is as shown in Formula 1, wherein R is selected from one of H, F, Cl, and Br. The cathodic protective layer and the encapsulation layer can be formed by the same material and processes. The present disclosure discloses preparing the micro-cavity adjustment layer, the cathodic protective layer, and the encapsulation layer of the flexible OLED with the same material, which can simplify the preparation processes.

    OLED PACKAGE METHOD AND OLED PACKAGE STRUCTURE

    公开(公告)号:US20190157616A1

    公开(公告)日:2019-05-23

    申请号:US15505101

    申请日:2016-12-28

    Abstract: The present invention provides an OLED package method and an OLED package structure. By introducing the Ti-doped diamond-like carbon film layer into the OLED thin film package layers and utilizing the higher transmission rate, the better flexibility, the high heat conductivity and lower water and oxygen permeation rate of the Ti-doped diamond-like carbon film layer, it can promote the transmission rate, the bendable property, the high heat conductivity and the water and oxygen resistant property of the OLED thin film package layers, and thus to promote the usage performance and usage lifetime of the flexible OLED display panel.

    OLED packaging method
    8.
    发明授权

    公开(公告)号:US10693105B2

    公开(公告)日:2020-06-23

    申请号:US16238493

    申请日:2019-01-02

    Abstract: An OLED packaging method is provided, in which a first outer bound confinement layer is first formed and then, a first organic layer is formed on the first inorganic layer in an area enclosed by the first outer bound confinement layer so that facilities for forming the first organic layer can be diversified and an organic material used to form the first organic layer is not subjected to constraint in respect of viscosity thereof, whereby using an organic material with a reduced viscosity allows for better homogeneity of the first organic layer, the thickness reduced, and thus helping reduce a curving radius of the OLED package structure to realize rollable displaying with a reduced curving radius. Further, the first outer bound confinement layer helps block external moisture and oxygen from corroding the first organic layer in a sideway direction.

    OLED PACKAGING METHOD
    9.
    发明申请

    公开(公告)号:US20190140213A1

    公开(公告)日:2019-05-09

    申请号:US16238493

    申请日:2019-01-02

    Abstract: An OLED packaging method is provided, in which a first outer bound confinement layer is first formed and then, a first organic layer is formed on the first inorganic layer in an area enclosed by the first outer bound confinement layer so that facilities for forming the first organic layer can be diversified and an organic material used to form the first organic layer is not subjected to constraint in respect of viscosity thereof, whereby using an organic material with a reduced viscosity allows for better homogeneity of the first organic layer, the thickness reduced, and thus helping reduce a curving radius of the OLED package structure to realize rollable displaying with a reduced curving radius. Further, the first outer bound confinement layer helps block external moisture and oxygen from corroding the first organic layer in a sideway direction.

    OLED PACKAGING METHOD AND OLED PACKAGE STRUCTURE

    公开(公告)号:US20180226614A1

    公开(公告)日:2018-08-09

    申请号:US15505119

    申请日:2016-12-28

    Abstract: The present invention provides an OLED packaging method and an OLED package structure. The OLED packaging method of the present invention is such that a silicon-doped diamond-like carbon layer and a diamond-like carbon scattering layer are both provided in an OLED package structure so that the silicon-doped diamond-like carbon layer may provide an effect of blocking external moisture and oxygen and the diamond-like carbon scattering layer is used to provide an effect of increasing light transmission rate, whereby it is possible to greatly extend the service life of the OLED device and also to ensure a relatively high light output efficiency of the OLED device. The OLED package structure of the present invention is such that a silicon-doped diamond-like carbon layer and a diamond-like carbon scattering layer are both provided, so that the silicon-doped diamond-like carbon layer may provide an effect of blocking external moisture and oxygen and the diamond-like carbon scattering layer is used to provide an effect of increasing light transmission rate, whereby it is possible to greatly extend the service life of the OLED device and also to ensure a relatively high light output efficiency of the OLED device.

Patent Agency Ranking