Abstract:
An electronic module includes an EL section; a first substrate on which the EL section is formed; a second substrate attached to the first substrate; an integrated circuit chip mounted on the second substrate; a plurality of first power supply interconnects formed on the first substrate, extending through a pair of regions located on both sides of the EL section; and a plurality of second power supply interconnects formed on the second substrate, extending through a pair of regions located on both sides of the integrated circuit chip.
Abstract:
An electro-optical device includes a substrate, a plurality of unit circuits that includes a plurality of scanning lines, a plurality of data lines and electro-optical elements provided corresponding to intersecting regions of the scanning lines and the data lines and is formed in a display region of the substrate, a plurality of pixel circuits that includes electro-optical elements and is formed in the display region and a sealing member that seals the electro-optical elements of the plurality of pixel circuits formed in the display region and is attached to the substrate, wherein a test circuit is formed between an attaching region at which the sealing member is attach to the substrate and the display region.
Abstract:
An electro-optic device includes a substrate on which a plurality of electro-optic elements are configured, a plurality of IC chips that drive the electro-optic elements, and a plurality of wiring patterns. Each of the IC chips includes a first power terminal and a second power terminal connected to each other in the IC chip, a third power terminal sandwiching the first power terminal with the second power terminal and placed on a first side opposite to the second power terminal, and a fourth power terminal sandwiching the second power terminal with the first power terminal and placed on a second side opposite to the first power terminal. The wiring patterns include a first power trunk line connecting the second power terminal in a first IC chip among from the IC chips and the first power terminal in a second IC chip placed on the second side of the first IC chip, a second power trunk line connecting the fourth power terminal in the first IC chip and the third power terminal in the second IC chip, a first electric supply line that supplies a first potential for driving the electro-optic elements from a power supply circuit to the first power terminal in the first IC chip, and a second electric supply line that supplies a second potential for driving the electro-optic elements from the power supply circuit to the third power terminal in the first IC chip.