公开(公告)号：US11545463B2

公开(公告)日：2023-01-03

申请号：US17394621

申请日：2021-08-05

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Sheng-Yao Yang ,  Ling-Wei Li ,  Yu-Jui Wu ,  Cheng-Lin Huang ,  Chien-Chen Li ,  Lieh-Chuan Chen ,  Che-Jung Chu ,  Kuo-Chio Liu

IPC分类号： H01L23/00 ,  H01L21/768

摘要： A method for forming a chip package structure is provided. The method includes forming a first conductive bump and a first ring-like structure over a chip. The first ring-like structure surrounds the first conductive bump, the first ring-like structure and the first conductive bump are made of a same first material, the chip includes an interconnect structure, and the first ring-like structure is electrically insulated from the interconnect structure and the first conductive bump. The method includes bonding the chip to a substrate through the first conductive bump.

公开(公告)号：US11848302B2

公开(公告)日：2023-12-19

申请号：US18065156

申请日：2022-12-13

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Sheng-Yao Yang ,  Ling-Wei Li ,  Yu-Jui Wu ,  Cheng-Lin Huang ,  Chien-Chen Li ,  Lieh-Chuan Chen ,  Che-Jung Chu ,  Kuo-Chio Liu

IPC分类号： H01L23/00 ,  H01L21/768

CPC分类号： H01L24/81 ,  H01L21/76816 ,  H01L21/76871 ,  H01L24/09 ,  H01L24/11 ,  H01L24/17 ,  H01L24/30

摘要： A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive bump over and electrically connected to the chip. The chip package structure includes a ring-like structure over and electrically insulated from the chip. The ring-like structure surrounds the conductive bump, and the ring-like structure and the conductive bump are made of a same material.