公开(公告)号：US20220262759A1

公开(公告)日：2022-08-18

申请号：US17427759

申请日：2020-02-03

Applicant: Sony Interactive Entertainment Inc.

Inventor： Shinya Tsuchida ,  Nils Sabelstrom ,  Mitsuharu Morishita ,  Kenji Hirose ,  Masanori Hayashibara ,  Tetsuji Tamura ,  Sei Oonishi ,  Nobuyuki Sugawara

IPC: H01L23/00 ,  H01L23/10 ,  H01L25/16

Abstract: In a structure using a metal having fluidity as a thermally conductive material, the thermally conductive material is prevented from entering an unintended region even in a case where a change in attitude of a semiconductor device or vibration occurs. An electronic apparatus has a thermally conductive material (31) formed between a radiator (50) and a semiconductor chip (11). The thermally conductive material (31) has fluidity at least at a time of operation of the semiconductor chip (11). In addition, the thermally conductive material (31) has electric conductivity. The thermally conductive material (31) is surrounded by a seal member (33). A capacitor (16) is covered by an insulating portion (15).

公开(公告)号：US20230345665A1

公开(公告)日：2023-10-26

申请号：US18249573

申请日：2021-11-01

Applicant: Sony Interactive Entertainment Inc.

Inventor： Shinya Tsuchida ,  Nils Sabelstrom ,  Mitsuharu Morishita ,  Masanori Hayashibara ,  Yasuhiro Ootori ,  Keiichi Aoki

IPC: G06F1/20 ,  H05K7/20

CPC classification number: H05K7/20209 ,  G06F1/206 ,  H05K7/20136

Abstract: Provided is an electronic apparatus that acquires an ambient temperature of the electronic apparatus and operates a cooling device to cool a component that generates heat during an operation. When the ambient temperature is lower than a predetermined reference temperature, the electronic apparatus exercises control to increase an output of the cooling device to a value higher than that obtained when the ambient temperature is equal to or higher than the reference temperature.