公开(公告)号：US20240233824A1

公开(公告)日：2024-07-11

申请号：US18614908

申请日：2024-03-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myunghun LEE ,  Sangwan NAM ,  Taemin OK

IPC: G11C16/04 ,  G11C16/26 ,  H01L23/528 ,  H10B41/27 ,  H10B41/40 ,  H10B41/50 ,  H10B43/10 ,  H10B43/20 ,  H10B43/27 ,  H10B43/40 ,  H10B43/50

CPC classification number: G11C16/0483 ,  G11C16/26 ,  H01L23/528 ,  H10B41/27 ,  H10B41/40 ,  H10B41/50 ,  H10B43/10 ,  H10B43/20 ,  H10B43/27 ,  H10B43/40 ,  H10B43/50

Abstract: An integrated circuit device includes a peripheral circuit structure including a lower substrate, an arc protection diode in the lower substrate, and a common source line driver connected to the arc protection diode, a conductive plate on the peripheral circuit structure, a cell array structure overlapping the peripheral circuit structure in a vertical direction with the conductive plate therebetween, and a first wiring structure connected between the arc protection diode and the conductive plate.

公开(公告)号：US20210343342A1

公开(公告)日：2021-11-04

申请号：US17096245

申请日：2020-11-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myunghun Lee ,  Sangwan NAM ,  Taemin OK

IPC: G11C16/04 ,  G11C16/26 ,  H01L23/528

Abstract: An integrated circuit device includes a peripheral circuit structure including a lower substrate, an arc protection diode in the lower substrate, and a common source line driver connected to the arc protection diode, a conductive plate on the peripheral circuit structure, a cell array structure overlapping the peripheral circuit structure in a vertical direction with the conductive plate therebetween, and a first wiring structure connected between the arc protection diode and the conductive plate.