公开(公告)号：US20180076024A1

公开(公告)日：2018-03-15

申请号：US15455879

申请日：2017-03-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gyu-hee PARK ,  Jae-soon LIM ,  Youn-joung CHO ,  Myong-woon KIM ,  Sang-ick LEE ,  Sung-duck LEE ,  Sung-woo CHO

IPC: H01L21/02 ,  H01L21/311 ,  H01L27/11582 ,  C09D1/00 ,  C09D5/24 ,  C07F5/06

CPC classification number: H01L21/02178 ,  C07F5/062 ,  C09D1/00 ,  C09D5/24 ,  H01L21/02205 ,  H01L21/0228 ,  H01L21/02321 ,  H01L21/31116 ,  H01L21/31144 ,  H01L27/11582

Abstract: An aluminum compound is represented by Chemical Formula (I) and is used as a source material for forming an aluminum-containing thin film.