THREE-DIMENSIONAL SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

    公开(公告)号:US20250072106A1

    公开(公告)日:2025-02-27

    申请号:US18435305

    申请日:2024-02-07

    Abstract: A three-dimensional semiconductor device may include a back-side metal layer, a lower channel pattern on the back-side metal layer, first and second lower source/drain patterns, which are spaced apart from each other in a first direction with the lower channel pattern interposed therebetween, the first lower source/drain pattern being connected to the lower channel pattern, an upper channel pattern on the lower channel pattern, a first upper source/drain pattern on the first lower source/drain pattern, the first upper source/drain pattern being connected to the upper channel pattern, a second upper source/drain pattern on the second lower source/drain pattern, and a wide via electrically connecting the first upper source/drain pattern to the second lower source/drain pattern. The wide via may include first and second via portions having first and second top surfaces, and here, the second top surface may be located at a level lower than the first top surface.

    SEMICONDUCTOR DEVICE
    2.
    发明公开

    公开(公告)号:US20240120393A1

    公开(公告)日:2024-04-11

    申请号:US18334849

    申请日:2023-06-14

    Abstract: A semiconductor device includes a substrate, a first sheet pattern on the substrate, a gate electrode on the substrate and surrounding the first sheet pattern, a first source/drain pattern and a second source/drain pattern respectively connected to a first end and a second end of the first sheet pattern, a contact blocking pattern on a lower side of the second source/drain pattern, a first source/drain contact extending in a first direction and connected to the first source/drain pattern, and a second source/drain contact connected to the second source/drain pattern and extending in the first direction to contact an upper surface of the contact blocking pattern. A depth from an upper surface of the gate electrode to a lowermost portion of the first source/drain contact may be greater than a depth from the upper surface of the gate electrode to the upper surface of the contact blocking pattern.

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