公开(公告)号：US11976980B2

公开(公告)日：2024-05-07

申请号：US17979925

申请日：2022-11-03

Applicant: Samsung Electronics Co., Ltd. ,  INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY

Inventor： Jin-woo Park ,  Seung-Rok Kim ,  Soyeon Lee ,  Ey-In Lee

IPC: G01J5/35 ,  G01J5/04

CPC classification number: G01J5/35 ,  G01J5/046

Abstract: A temperature sensor includes a first electrode, second electrode, and a pyroelectric layer between the first electrode and the second electrode. The pyroelectric layer includes a ferroelectric polymer and an ionogel.

公开(公告)号：USD862407S1

公开(公告)日：2019-10-08

申请号：US29670508

申请日：2018-11-16

Applicant: Samsung Electronics Co., Ltd.

Designer： Ji Young Lee ,  Kuk Hwan Kim ,  Jae Ho Baik ,  Jung Hee Yeo ,  Dong Kyun Kim ,  Sung Jin Yum ,  Jinie Ryu ,  Soyeon Lee

公开(公告)号：USD835597S1

公开(公告)日：2018-12-11

申请号：US29619124

申请日：2017-09-27

Applicant: Samsung Electronics Co., Ltd.

Designer： Ji Young Lee ,  Kuk Hwan Kim ,  Jae Ho Baik ,  Jung Hee Yeo ,  Dong Kyun Kim ,  Sung Jin Yum ,  Jinie Ryu ,  Soyeon Lee

公开(公告)号：US20240256724A1

公开(公告)日：2024-08-01

申请号：US18424345

申请日：2024-01-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gyuduck BAE ,  Pilsung Koh ,  Sangsu Kim ,  Kyuman Yeon ,  Soyeon Lee ,  Bora Jeong ,  Boseok Hong ,  Jisan Kwak ,  Haegeun Park ,  Yonghwan Baek ,  Chulho Song ,  Seungyong Lee

IPC: G06F30/13 ,  G06F111/20

CPC classification number: G06F30/13 ,  G06F2111/20

Abstract: A method of determining a facility layout of a semiconductor factory including a main floor including processing zones, a clean sub-FAB (CSF) floor under the main floor, and a facility sub-FAB (FSF) floor under the CSF floor includes receiving data related to main facilities to be placed on the main floor, CSF subsidiary facilities to be placed on the CSF floor, and FSF subsidiary facilities to be placed on the FSF floor, and determining the facility layout including a layout of the main facilities for the main floor, a layout of the CSF subsidiary facilities for the CSF floor, and a layout of the FSF subsidiary facilities for the FSF floor.

公开(公告)号：US11716603B2

公开(公告)日：2023-08-01

申请号：US17536698

申请日：2021-11-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyundo Lee ,  Hyunkyoung Kim ,  Younghak Oh ,  Kyusang Ryu ,  Sooah Park ,  Soyeon Lee

IPC: H04W4/80 ,  H04W76/10

CPC classification number: H04W4/80 ,  H04W76/10

Abstract: An electronic device is provided. The device includes a first communication circuit configured to support first wireless communication, a second communication circuit configured to support second wireless communication, a display, and a processor, wherein the processor is configured to perform the first wireless communication with a first external electronic device using the first communication circuit, display a first screen including first information indicating a connection of the first wireless communication with the first external electronic device using the display, perform the second wireless communication with a second external electronic device using the second communication circuit while performing the first wireless communication with the first external electronic device, display a second screen including second information indicating that at least a portion of the first external electronic device is operable by the second external electronic device using the display, receive first data related to the operation of the at least a portion of the first external electronic device from the second external electronic device based on the second wireless communication, generate second data based on the first data, and transmit the second data to the first external electronic device based on the first wireless communication.

公开(公告)号：US11190923B2

公开(公告)日：2021-11-30

申请号：US17082857

申请日：2020-10-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyundo Lee ,  Hyunkyoung Kim ,  Younghak Oh ,  Kyusang Ryu ,  Sooah Park ,  Soyeon Lee

IPC: H04W76/10 ,  H04W4/80

Abstract: An electronic device is provided. The device includes a first communication circuit configured to support first wireless communication, a second communication circuit configured to support second wireless communication, a display, and a processor, wherein the processor is configured to perform the first wireless communication with a first external electronic device using the first communication circuit, display a first screen including first information indicating a connection of the first wireless communication with the first external electronic device using the display, perform the second wireless communication with a second external electronic device using the second communication circuit while performing the first wireless communication with the first external electronic device, display a second screen including second information indicating that at least a portion of the first external electronic device is operable by the second external electronic device using the display, receive first data related to the operation of the at least a portion of the first external electronic device from the second external electronic device based on the second wireless communication, generate second data based on the first data, and transmit the second data to the first external electronic device based on the first wireless communication.