公开(公告)号：US09978756B2

公开(公告)日：2018-05-22

申请号：US15412689

申请日：2017-01-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyuk Kim ,  Seung-pil Chung ,  Jae-ho Min

IPC: H01L23/52 ,  H01L27/112 ,  H01L23/528

CPC classification number: H01L27/11286 ,  H01L23/528 ,  H01L27/11565 ,  H01L27/1157 ,  H01L27/11573 ,  H01L27/11575 ,  H01L27/11582

Abstract: Semiconductor chips are provided. A semiconductor chip includes a peripheral circuit region on a substrate. The semiconductor chip includes a semiconductor layer on the peripheral circuit region. The semiconductor chip includes a cell region on the semiconductor layer. Moreover, the semiconductor chip includes a layer/connector that is adjacent the semiconductor layer. Methods of manufacturing semiconductor chips are also provided.

公开(公告)号：US20170330887A1

公开(公告)日：2017-11-16

申请号：US15412689

申请日：2017-01-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyuk Kim ,  Seung-pil Chung ,  Jae-ho Min

IPC: H01L27/112 ,  H01L23/528

CPC classification number: H01L27/11286 ,  H01L23/528 ,  H01L27/11565 ,  H01L27/1157 ,  H01L27/11573 ,  H01L27/11575 ,  H01L27/11582

Abstract: Semiconductor chips are provided. A semiconductor chip includes a peripheral circuit region on a substrate. The semiconductor chip includes a semiconductor layer on the peripheral circuit region. The semiconductor chip includes a cell region on the semiconductor layer. Moreover, the semiconductor chip includes a layer/connector that is adjacent the semiconductor layer. Methods of manufacturing semiconductor chips are also provided.