公开(公告)号：US20240139972A1

公开(公告)日：2024-05-02

申请号：US18206635

申请日：2023-06-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daeho Min ,  Minwoo Rhee ,  Juno Kim ,  Kazuya ONO ,  Kangsan Lee ,  Kyeongbin Lim

IPC: B25J15/06 ,  B25J11/00

CPC classification number: B25J15/0658 ,  B25J11/0095

Abstract: A non-contact type gripper may include a gripping plate, a plurality of blowing holes, a plurality of suction holes and a cavity. The blowing holes may be formed at the gripping plate to inject a gas to an object. The suction holes may be formed at the gripping plate to suck the gas. The cavity may be extended from at least one of the blowing holes to suppress a pressure drop of the gas. The gas flowing through the cavities extended from the corner suction hole and the blowing holes between the adjacent suction holes may receive a low flow resistance. Thus, a pressure drop of the gas injected from the blowing holes may be suppressed by the cavities to maintain a pressure of the gas, thereby preventing a deflection of the corner portion of the object such as the semiconductor chip by a strong suction force. As a result, the non-contact type gripper may grip the object in the non-contact manner to prevent a contamination of the object.

公开(公告)号：US20240186282A1

公开(公告)日：2024-06-06

申请号：US18239454

申请日：2023-08-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sumin Kim ,  Minwoo Rhee ,  Ilyoung Han ,  Sujie Kang ,  Juno Kim ,  Daeho Min ,  Kyeongbin Lim

IPC: H01L23/00

CPC classification number: H01L24/75 ,  H01L2224/75252 ,  H01L2224/75735 ,  H01L2224/75745 ,  H01L2224/75804 ,  H01L2224/75841 ,  H01L2924/2064

Abstract: A die bonding apparatus comprising a stage configured to support a first die, a pickup head configured to pick up a second die, regions of magnetic materials arranged on the first die and the second die, an electromagnet arranged on a surface of the pickup head or the stage; and a controller configured to apply a current to the electromagnet to generate a magnetic field when the first die and the second die are disposed at a predetermined distance from each other in a vertical direction. As a result of the magnetic field generated by the electromagnet, the regions of magnetic material arranged on first die and the second die are aligned with one another in the vertical direction.

公开(公告)号：US20240170445A1

公开(公告)日：2024-05-23

申请号：US18379956

申请日：2023-10-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Juno Kim ,  Minwoo Rhee ,  Ilyoung Han ,  Juhyung Lee ,  Kyeongbin Lim

IPC: H01L23/00 ,  H01L21/66

CPC classification number: H01L24/80 ,  H01L22/12 ,  H01L2224/80224 ,  H01L2224/8023 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/80908

Abstract: Provided is a method of manufacturing a semiconductor package, the method including: providing a first semiconductor die on a stage; bonding a second semiconductor die to the first semiconductor die to each other; applying heat to a surface of the second semiconductor die, which is opposite to a bonding interface of the first semiconductor die and the second semiconductor die; and measuring a temperature change on the surface of the second semiconductor die to which the heat is applied to inspect a state of the bonding interface.