公开(公告)号：US12301336B2

公开(公告)日：2025-05-13

申请号：US17504834

申请日：2021-10-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwonyeol Park ,  Hwanmin Kang ,  Daecheol Kwon ,  Hyungjong Kim ,  Haejoon Kim

IPC: H04J11/00 ,  H04W72/541

Abstract: An operating method of a wireless communication device performing an interference whitening operation includes obtaining first channel state information of the wireless communication device, selecting a selected mode from among a plurality of modes related to the interference whitening operation, the selected mode corresponding to the first channel state information, obtaining channel performance information according to the selected mode, and updating a value function expected value based on the first channel state information, the selected mode, and the channel performance information.

公开(公告)号：US10349352B2

公开(公告)日：2019-07-09

申请号：US15121537

申请日：2015-02-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongwook Song ,  Hyungjong Kim ,  Jonghan Lim

IPC: H04W52/02 ,  H04W76/14

Abstract: The present invention relates to a method and a device for reducing the power of a device in a wireless communication system supporting direct device to device (D2D) communication. A method, for transmitting a signal of a device in a wireless communication system supporting direct D2D communication according to the present invention, comprises the steps of: entering sleep mode in direct D2D communication between a device and an opponent device; if data to be transmitted to the opponent device is generated, transmitting a paging signal for the opponent device to a base station connected to the device, thereby requesting transmission of the paging signal to the opponent device; and resuming the D2D communication with the opponent device that has received the paging signal through the base station.

公开(公告)号：US11315817B2

公开(公告)日：2022-04-26

申请号：US16906820

申请日：2020-06-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Euijin Kim ,  Hyungjong Kim ,  Juno Park ,  Seok Heo

IPC: H01L21/67 ,  H01L21/677 ,  H01L23/544 ,  G01B11/14

Abstract: An apparatus for transferring a wafer includes a main body, a first support installed in the main body, a sensor support fixed to the first support, a finger member slidably installed along the first support to transfer the wafer and positioned at a lower level than the sensor support, three sensors each including a light emitter installed on the first support and a light receiver installed on the sensor support, the three sensors respectively configured to detect three points of an edge of the wafer seated on the finger member, and a controller connected to the three sensors, wherein the controller is configured to determine whether any of the three points of the edge of the wafer is detected from a notch of the wafer based on signals received from the sensors.

公开(公告)号：US20210098274A1

公开(公告)日：2021-04-01

申请号：US16906820

申请日：2020-06-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Euijin Kim ,  Hyungjong Kim ,  Juno Park ,  Seok Heo

IPC: H01L21/677 ,  H01L21/67 ,  H01L23/544

Abstract: An apparatus for transferring a wafer according to the present disclosure includes a main body, a first support installed in the main body, a sensor support fixed to the first support, a finger member slidably installed along the first support to transfer the wafer and positioned at a lower level than the sensor support, three sensors each including a light emitter installed on the first support and a light receiver installed on the sensor support, the three sensors respectively configured to detect three points of an edge of the wafer seated on the finger member, and a controller connected to the three sensors, wherein the controller is configured to determine whether any of the three points of the edge of the wafer is detected from a notch of the wafer based on signals received from the sensors.