公开(公告)号：US11862603B2

公开(公告)日：2024-01-02

申请号：US17001978

申请日：2020-08-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taewook Kim ,  Jongho Lee ,  Jeongjoon Oh ,  Hyeon Hwang

IPC: H01L21/768 ,  H01L23/522 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L23/528 ,  H01L23/532 ,  H01L25/065

CPC classification number: H01L25/0652 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2225/06589

Abstract: A semiconductor package includes a package substrate; a plurality of lower chip structures on the package substrate; an upper chip structure on the plurality of lower chip structures and covering portions of upper surfaces of the plurality of lower chip structures; a non-conductive adhesive layer on a lower surface of the upper chip structure and receiving upper portions of the plurality of lower chip structures; and a molded member on the plurality of lower chip structures and the upper chip structure.

公开(公告)号：US20210159213A1

公开(公告)日：2021-05-27

申请号：US17001978

申请日：2020-08-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taewook Kim ,  Jongho Lee ,  Jeongjoon Oh ,  Hyeon Hwang

IPC: H01L25/065

Abstract: A semiconductor package includes a package substrate; a plurality of lower chip structures on the package substrate; an upper chip structure on the plurality of lower chip structures and covering portions of upper surfaces of the plurality of lower chip structures; a non-conductive adhesive layer on a lower surface of the upper chip structure and receiving upper portions of the plurality of lower chip structures; and a molded member on the plurality of lower chip structures and the upper chip structure.

公开(公告)号：US20250014963A1

公开(公告)日：2025-01-09

申请号：US18763599

申请日：2024-07-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongkwan Lee ,  Kundae Yeom ,  Hyeon Hwang

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/31 ,  H01L25/18

Abstract: A semiconductor package includes a substrate, a first semiconductor chip on the substrate, a heat-dissipating structure on the first semiconductor chip, an adhesive layer between the first semiconductor chip and the heat-dissipating structure, a second semiconductor chip on the heat-dissipating structure, a molding film on the substrate and covering at least portions of the first semiconductor chip, the heat-dissipating structure, and the second semiconductor chip, and a shield layer on an upper surface and sidewalls of the molding film, wherein the shield layer includes a first portion extending into a first hole and contacting an upper surface of the first semiconductor chip, and the first hole may penetrate the molding film, the heat-dissipating structure, and the adhesive layer.

公开(公告)号：US20250118689A1

公开(公告)日：2025-04-10

申请号：US18782386

申请日：2024-07-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongkwan Lee ,  Hyunki Kim ,  Youngmin Lee ,  Hyeon Hwang

IPC: H01L23/00 ,  H01L25/18 ,  H10B80/00

Abstract: A semiconductor package includes a substrate having first and second sides, pads disposed on the substrate and including first and second bonding pads adjacent to the first and second sides, respectively, and upper pads between the first and second bonding pads, a passivation layer disposed on the substrate and exposing the first and second bonding pads, a solder resist layer disposed on the passivation layer, a first chip structure on the solder resist layer, adjacent to the first side and electrically connected to the first bonding pads, a second chip structure on the solder resist layer, adjacent to the second side and electrically connected to the second bonding pads, a controller on the solder resist layer between the first and the second chip structure, and a connection structure penetrating the passivation layer and the solder resist layer and electrically connecting the controller and the upper pads.

公开(公告)号：US20250089179A1

公开(公告)日：2025-03-13

申请号：US18601190

申请日：2024-03-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyeon Hwang ,  Sangwon Lee

IPC: H05K3/34

Abstract: A ball attach tool may include a housing a valve module. The housing may include a plurality of pick-up holes configured to pick up balls when a reduced pressure is applied thereto. The valve module may control a reduced pressure applied to the pick-up holes.