公开(公告)号：US11646179B2

公开(公告)日：2023-05-09

申请号：US17335659

申请日：2021-06-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jang-Yeob Lee ,  Sungyeol Kim ,  Jinyeong Yun ,  Minsung Kim ,  HoSun Yoo

IPC: H01J37/32

CPC classification number: H01J37/32642 ,  H01J37/32541 ,  H01J37/32568 ,  H01J37/32715

Abstract: A plasma processing apparatus includes a chamber providing a space for processing a substrate, a substrate stage configured to support the substrate within the chamber and including a lower electrode, an upper electrode facing the lower electrode, a focus ring in or on an upper peripheral region of the substrate stage to surround the substrate, and a plasma adjustment assembly in at least one of a first position between the upper electrode and the lower electrode and a second position between the focus ring and the lower electrode, the plasma adjustment assembly including a photoreactive material layer and a plurality of light sources configured to irradiate light onto a local region of the photoreactive material layer. A capacitance of the local region is changed as the light is irradiated to the local region.

公开(公告)号：US20230230815A1

公开(公告)日：2023-07-20

申请号：US18188095

申请日：2023-03-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jang-Yeob Lee ,  Sungyeol Kim ,  Jinyeong Yun ,  Minsung Kim ,  HoSun Yoo

IPC: H01J37/32

CPC classification number: H01J37/32568 ,  H01J37/32458 ,  H01J37/32642 ,  H01J37/32743 ,  H01J37/32715 ,  H01J37/3244 ,  H01J37/32798

Abstract: A plasma processing apparatus includes a chamber providing a space for processing a substrate, a substrate stage configured to support the substrate within the chamber and including a lower electrode, an upper electrode facing the lower electrode, a focus ring in or on an upper peripheral region of the substrate stage to surround the substrate, and a plasma adjustment assembly in at least one of a first position between the upper electrode and the lower electrode and a second position between the focus ring and the lower electrode, the plasma adjustment assembly including a photoreactive material layer and a plurality of light sources configured to irradiate light onto a local region of the photoreactive material layer. A capacitance of the local region is changed as the light is irradiated to the local region.

公开(公告)号：US20220093369A1

公开(公告)日：2022-03-24

申请号：US17335659

申请日：2021-06-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jang-Yeob Lee ,  Sungyeol Kim ,  Jinyeong Yun ,  Minsung Kim ,  HoSun Yoo

IPC: H01J37/32

Abstract: A plasma processing apparatus includes a chamber providing a space for processing a substrate, a substrate stage configured to support the substrate within the chamber and including a lower electrode, an upper electrode facing the lower electrode, a focus ring in or on an upper peripheral region of the substrate stage to surround the substrate, and a plasma adjustment assembly in at least one of a first position between the upper electrode and the lower electrode and a second position between the focus ring and the lower electrode, the plasma adjustment assembly including a photoreactive material layer and a plurality of light sources configured to irradiate light onto a local region of the photoreactive material layer. A capacitance of the local region is changed as the light is irradiated to the local region.

公开(公告)号：US12020909B2

公开(公告)日：2024-06-25

申请号：US18188095

申请日：2023-03-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jang-Yeob Lee ,  Sungyeol Kim ,  Jinyeong Yun ,  Minsung Kim ,  HoSun Yoo

IPC: H01J37/32

CPC classification number: H01J37/32642 ,  H01J37/3244 ,  H01J37/32458 ,  H01J37/32541 ,  H01J37/32568 ,  H01J37/32715 ,  H01J37/32743 ,  H01J37/32798

Abstract: A plasma processing apparatus includes a chamber providing a space for processing a substrate, a substrate stage configured to support the substrate within the chamber and including a lower electrode, an upper electrode facing the lower electrode, a focus ring in or on an upper peripheral region of the substrate stage to surround the substrate, and a plasma adjustment assembly in at least one of a first position between the upper electrode and the lower electrode and a second position between the focus ring and the lower electrode, the plasma adjustment assembly including a photoreactive material layer and a plurality of light sources configured to irradiate light onto a local region of the photoreactive material layer. A capacitance of the local region is changed as the light is irradiated to the local region.