公开(公告)号：US20130178016A1

公开(公告)日：2013-07-11

申请号：US13736551

申请日：2013-01-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Choongbin YIM ,  Eunchul AHN ,  Taesung PARK ,  Hak-kyoon BYUN ,  Yongkwan LEE

IPC: H01L25/00

CPC classification number: H01L25/105 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2224/83

Abstract: Methods of fabricating a package-on-package device and package-on-package devices fabricated by the same may be provided. According to inventive concepts, a back-grinding of a semiconductor chip to a target thickness may be performed after the semiconductor chip is molded by a molding layer. Accordingly, the semiconductor chip is relatively thick while forming a molding layer, and thus less susceptible to a warpage phenomenon, which for instance may occur during the forming a molding layer. Thus, relatively thin package-on-package device, which is less susceptible to the warpage phenomenon, may be achieved.

Abstract translation: 可以提供制造封装封装器件和由其制造的封装封装器件的方法。 根据本发明的概念，可以在通过模制层模制半导体芯片之后进行半导体芯片到目标厚度的背面磨削。 因此，半导体芯片在形成模制层的同时相对较厚，因此较不容易发生翘曲现象，例如可能在形成模制层期间发生。 因此，可以实现较不易受翘曲现象影响的较薄的封装封装器件。