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公开(公告)号：US20160033550A1
公开(公告)日：2016-02-04
申请号：US14694115
申请日：2015-04-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyun-woo KIM , Woo-seok KO , Young-hwan KIM , Jeong-hoi KIM , Baek-man SUNG , Hyung-su SON , Chae-ho SHIN , Yu-sin YANG , Jae-youn WI , Sang-kil LEE , Chung-sam JUN
IPC: G01Q60/40
Abstract: A conductive atomic force microscope including a plurality of probe structures each including a probe and a cantilever connected thereto, a power supplier applying a bias voltage, a current detector detecting a first current flowing between a sample object and each of the probes and a second current flowing between a measurement object and each of the probes, and calculating representative currents for the sample and measurement objects based on the first and second currents, respectively, and a controller calculating a ratio between representative currents of the sample object measured by each of the probe structures, calculating a scaling factor for scaling the representative current with respect to the measurement object measured by each of the probes, and determine a reproducible current measurement value based on the second measurement current and the scaling factor may be provided.
Abstract translation: 一种导电原子力显微镜，包括多个探针结构，每个探针结构包括探针和连接到其上的悬臂，施加偏置电压的电源，检测在样品物体和每个探针之间流动的第一电流的电流检测器和第二电流 在测量对象和每个探针之间流动，并且基于第一和第二电流分别计算样本和测量对象的代表性电流，以及控制器，计算由每个探针测量的样本对象的代表性电流之间的比率 计算相对于由每个探针测量的测量对象的代表性电流的缩放因子，并且可以提供基于第二测量电流和缩放因子来确定可重现的电流测量值。
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公开(公告)号：US20190214316A1
公开(公告)日：2019-07-11
申请号：US16354735
申请日：2019-03-15
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sung-yoon RYU , Chung-sam JUN , Yu-sin YANG , Yun-jung JEE , Gil-woo SONG
CPC classification number: H01L22/12 , G06K9/00013 , G06K9/00624 , G06K9/2018 , G06K9/4604 , H01L21/77 , H01L22/14 , H01L22/20 , H01L22/26 , H01L22/34
Abstract: Provided are a method of inspecting a surface and a method of manufacturing a semiconductor device. The methods include preparing a substrate, selecting a spatial resolution of a first optical device by setting a magnification of an imaging optical system, emitting multi-wavelength light toward a first measurement area of the substrate and obtaining first wavelength-specific images, generating first spectrum data based on the first wavelength-specific images, generating first spectrum data of respective pixels based on the first wavelength-specific images, and extracting a spectrum of at least one first inspection area having a range of the first measurement area or less from the first spectrum data, and analyzing the spectrum. The first optical device includes a light source, an objective lens, a detector, and an imaging optical system. The obtaining first wavelength-specific images includes using the imaging optical system and the detector.
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公开(公告)号：US20170192052A1
公开(公告)日：2017-07-06
申请号：US15283466
申请日：2016-10-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Young-hoon SOHN , Chung-sam JUN , Yu-sin YANG
IPC: G01R31/302 , G01R31/28
CPC classification number: G01R31/307
Abstract: Provided is a method of inspecting a pattern defect. The method includes: applying a voltage to an object to be inspected and measuring an inspection signal generated in a pattern of the object to be inspected due to the voltage applied to the object to be inspected over time; generating an intensity image showing a relationship between an intensity of the inspection signal measured in the pattern and a time by processing the inspection signal; and detecting a pattern defect position by comparing the intensity image with a comparative intensity image.
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公开(公告)号：US20180061718A1
公开(公告)日：2018-03-01
申请号：US15654899
申请日：2017-07-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sung-yoon RYU , Chung-sam JUN , Yu-sin YANG , Yun-jung JEE , Gil-woo SONG
CPC classification number: H01L22/12 , G06K9/00013 , G06K9/00624 , G06K9/2018 , G06K9/4604 , H01L21/77 , H01L22/14 , H01L22/26 , H01L22/34
Abstract: Provided are a method of inspecting a surface and a method of manufacturing a semiconductor device. The methods include preparing a substrate, selecting a spatial resolution of a first optical device by setting a magnification of an imaging optical system, emitting multi-wavelength light toward a first measurement area of the substrate and obtaining first wavelength-specific images, generating first spectrum data based on the first wavelength-specific images, generating first spectrum data of respective pixels based on the first wavelength-specific images, and extracting a spectrum of at least one first inspection area having a range of the first measurement area or less from the first spectrum data, and analyzing the spectrum. The first optical device includes a light source, an objective lens, a detector, and an imaging optical system. The obtaining first wavelength-specific images includes using the imaging optical system and the detector.
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