公开(公告)号：US20250149519A1

公开(公告)日：2025-05-08

申请号：US18769823

申请日：2024-07-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunsoo Chung ,  Jinchan Ahn ,  Chiwoo Lee

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H10B80/00

Abstract: A semiconductor package includes a package substrate, a plurality of stacked structures on the package substrate, each stacked structure including a plurality of core chips stacked on each other, each core chip including a memory cell array including a plurality of memory cells, a buffer chip on the package substrate, and spaced apart from the plurality of stacked structures in a horizontal direction, and a photonics package including an optical integrated circuit chip on the package substrate, an electronic integrated circuit chip on the optical integrated circuit chip, and a first molding layer surrounding side surfaces of the electronic integrated circuit chip, wherein the buffer chip is configured to control the memory cell of the core chip of each of the plurality of stacked structures.

公开(公告)号：US20250079424A1

公开(公告)日：2025-03-06

申请号：US18757933

申请日：2024-06-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunsoo Chung ,  Kwangsoo Kim ,  Chiwoo Lee

IPC: H01L25/16 ,  G02B6/42 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48

Abstract: A semiconductor package includes a redistribution layer, a photonic integrated circuit (PIC) chip on the redistribution layer, a buffer chip on the redistribution layer, an electronic integrated circuit (EIC) chip on the PIC chip and the buffer chip, and a plurality of stacked structures on the buffer chip, each of the plurality of stacked structures including a plurality of stacked semiconductor chips. The plurality of stacked structures are spaced apart from one another in a horizontal direction, and a portion of the EIC chip overlaps the PIC chip in a vertical direction, and another portion of the EIC chip overlaps the buffer chip in a vertical direction.

公开(公告)号：US20250158001A1

公开(公告)日：2025-05-15

申请号：US18780621

申请日：2024-07-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunsoo Chung ,  Kwangsoo Kim ,  Chiwoo Lee

IPC: H01L25/18 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48

Abstract: A chip structure including a semiconductor chip, a photonic integrated circuit chip spaced apart from the semiconductor chip in a horizontal direction, an electronic integrated circuit chip on the semiconductor chip and the photonic integrated circuit chip, a first molding layer surrounding the semiconductor chip and the photonic integrated circuit chip, and a second molding layer on the semiconductor chip, the photonic integrated circuit chip, and the first molding layer and surrounding the electronic integrated circuit chip. A portion of the electronic integrated circuit chip overlaps the photonic integrated circuit chip in a vertical direction, and another portion of the electronic integrated circuit chip overlaps the semiconductor chip in the vertical direction.

公开(公告)号：US20250157996A1

公开(公告)日：2025-05-15

申请号：US18814848

申请日：2024-08-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunsoo Chung ,  Chiwoo Lee

IPC: H01L25/10 ,  H01L23/00 ,  H01L23/15 ,  H01L23/31 ,  H01L23/538

Abstract: A semiconductor package includes an interposer substrate including an inorganic material; a first redistribution layer (RDL) on the interposer substrate; a first redistribution structure in the first RDL; a first bonding layer on the first RDL; a first bonding pad in the first bonding layer; a second bonding layer on the first bonding layer; a second bonding pad in the second bonding layer, wherein the second bonding pad contacts the first bonding pad; first semiconductor chips on the second bonding layer, wherein the first semiconductor chips are spaced apart from each other in a horizontal direction; a second RDL on the first semiconductor chips; a second redistribution structure in the second RDL; and second semiconductor chips on the second RDL, wherein the second semiconductor chips are spaced apart from each other in the horizontal direction, and wherein the second semiconductor chips are electrically connected to the second redistribution structure.

公开(公告)号：US12046589B2

公开(公告)日：2024-07-23

申请号：US17561084

申请日：2021-12-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seonghwan Shin ,  Sungsoo Jung ,  Hyeongik Kim ,  Yonghan Yoon ,  Kwangjae Lee ,  Chiwoo Lee

IPC: H01L25/13 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L25/13 ,  H01L25/0753 ,  H01L33/62 ,  H01L2933/0066

Abstract: Provided is a display module including: a substrate including a mounting surface on which a plurality of inorganic light emitting diodes (LEDs) are mounted, a side surface, and a rear surface disposed opposite to the mounting surface; a front cover bonded to and covering the mounting surface; a metal plate bonded to the rear surface; and a side cover configured to surround the side surface, wherein the front cover extends to an area outside of the mounting surface in a first direction in which the mounting surface extends, and wherein the side cover is provided to extend, in a second direction in which the mounting surface faces, from an upper side of the metal plate to a lower end of a region of the front cover to seal the side surface from an outside.