公开(公告)号：US10665816B2

公开(公告)日：2020-05-26

申请号：US16396421

申请日：2019-04-26

Applicant: Samsung Display Co. Ltd.

Inventor： Young Eun Oh ,  Jai Ku Shin ,  Han Sun Ryou ,  So Dam Ahn ,  Jang Doo Lee

IPC: H01L27/32 ,  H01L51/52 ,  G09F9/30 ,  H01L51/00 ,  G06F1/16

Abstract: A protection film for an electronic device includes an adhesive layer including a first surface to which an electronic device is attached, and a film layer which contacts a second surface of the adhesive layer and includes at least one member, where a thickness of the adhesive layer satisfies Inequality 1: z≤(5.1x+57.4)·ln(y)−(14.7x+140.5) where z is the thickness of the adhesive layer in terms of micrometers, x is a modulus of a member of the film layer which directly contacts the adhesive layer in terms of gigapascals, and y is a total thickness of the film layer in terms of micrometers.

公开(公告)号：US11974452B2

公开(公告)日：2024-04-30

申请号：US16843458

申请日：2020-04-08

Applicant: Samsung Display Co. Ltd.

Inventor： Young Eun Oh ,  Jai Ku Shin ,  Han Sun Ryou ,  So Dam Ahn ,  Jang Doo Lee

IPC: H10K50/844 ,  G06F1/16 ,  G06F9/30 ,  G09F9/30 ,  H10K50/842 ,  H10K77/10

CPC classification number: H10K50/844 ,  G06F1/1652 ,  G09F9/301 ,  H10K50/8426 ,  H10K77/111 ,  B32B2307/54 ,  B32B2457/206

Abstract: A protection film for an electronic device includes an adhesive layer including a first surface to which an electronic device is attached, and a film layer which contacts a second surface of the adhesive layer and includes at least one member, where a thickness of the adhesive layer satisfies Inequality 1:

z≤(5.1x+57.4)·ln(y)−(14.7x+140.5),



where z is the thickness of the adhesive layer in terms of micrometers, x is a modulus of a member of the film layer which directly contacts the adhesive layer in terms of gigapascals, and y is a total thickness of the film layer in terms of micrometers.

公开(公告)号：US11812635B2

公开(公告)日：2023-11-07

申请号：US17357990

申请日：2021-06-25

Applicant: Samsung Display Co. Ltd.

Inventor： Young Eun Oh ,  Jai Ku Shin ,  Han Sun Ryou ,  So Dam Ahn ,  Jang Doo Lee

IPC: H10K50/844 ,  G06F1/16 ,  G09F9/30 ,  H10K50/842 ,  H10K77/10

CPC classification number: H10K50/844 ,  G06F1/1652 ,  G09F9/301 ,  H10K50/8426 ,  H10K77/111 ,  B32B2307/54 ,  B32B2457/206

Abstract: A protection film for an electronic device includes an adhesive layer including a first surface to which an electronic device is attached, and a film layer which contacts a second surface of the adhesive layer and includes at least one member, where a thickness of the adhesive layer satisfies Inequality 1:

z≤(5.1x+57.4)·ln(y)−(14.7x+140.5),



where z is the thickness of the adhesive layer in terms of micrometers, x is a modulus of a member of the film layer which directly contacts the adhesive layer in terms of gigapascals, and y is a total thickness of the film layer in terms of micrometers.