公开(公告)号：US10775698B2

公开(公告)日：2020-09-15

申请号：US15867598

申请日：2018-01-10

Applicant: Samsung Display Co., Ltd.

Inventor： Yuiku Lee ,  Sujeong Kim ,  Inseok Song

IPC: H01L27/32 ,  G03F7/032 ,  G03F7/028 ,  H01L51/52 ,  G03F7/038 ,  G03F7/075 ,  G03F7/00

Abstract: A photosensitive resin composition is provided. The photosensitive resin composition includes a first binder resin and a second binder resin that have a weight average molecular weight of about 7,000 g/mol to about 12,000 g/mol, and an electronic apparatus including a cured product of a pattern-forming composition including the photosensitive resin composition.

公开(公告)号：US20180292750A1

公开(公告)日：2018-10-11

申请号：US15867598

申请日：2018-01-10

Applicant: Samsung Display Co., Ltd.

Inventor： Yuiku Lee ,  Sujeong Kim ,  Inseok Song

IPC: G03F7/032 ,  G03F7/028 ,  H01L27/32 ,  H01L51/52

Abstract: A photosensitive resin composition is provided. The photosensitive resin composition includes a first binder resin and a second binder resin that have a weight average molecular weight of about 7,000 g/mol to about 12,000 g/mol, and an electronic apparatus including a cured product of a pattern-forming composition including the photosensitive resin composition.

公开(公告)号：US10042253B2

公开(公告)日：2018-08-07

申请号：US15394096

申请日：2016-12-29

Applicant: Samsung Display Co., Ltd.

Inventor： Dongki Lee ,  Kyungah Kim ,  Gilrae Kim ,  Dongjin Kim ,  SungChul Kim ,  Hyoengki Kim ,  Junghwan Park ,  Daebeom Shin ,  Yuiku Lee

IPC: G03F7/032 ,  G03F7/004 ,  G03F7/033 ,  H01L27/32 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40

Abstract: A photosensitive resin composition includes a first binder resin represented by Formula 1. The photosensitive resin composition may be cured at a low temperature (e.g., about 0° C. to about 100° C., about 40° C. to about 100° C., or about 70° C. to about 100° C.). A film may be formed from the photosensitive resin composition. An organic light-emitting display (OLED) device may include the film prepared from the photosensitive resin composition.

公开(公告)号：US20170199454A1

公开(公告)日：2017-07-13

申请号：US15394096

申请日：2016-12-29

Applicant: Samsung Display Co., Ltd.

Inventor： Dongki Lee ,  Kyungah Kim ,  Gilrae Kim ,  Dongjin Kim ,  SungChul Kim ,  Hyoengki Kim ,  Junghwan Park ,  Daebeom Shin ,  Yuiku Lee

IPC: G03F7/032 ,  G03F7/033 ,  G03F7/40 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  H01L27/32 ,  G03F7/004

CPC classification number: G03F7/032 ,  G03F7/0045 ,  G03F7/033 ,  G03F7/162 ,  G03F7/168 ,  G03F7/2002 ,  G03F7/327 ,  G03F7/40 ,  H01L27/322

Abstract: A photosensitive resin composition includes a first binder resin represented by Formula 1. The photosensitive resin composition may be cured at a low temperature (e.g., about 0° C. to about 100° C., about 40° C. to about 100° C., or about 70° C. to about 100° C.). A film may be formed from the photosensitive resin composition. An organic light-emitting display (OLED) device may include the film prepared from the photosensitive resin composition.