Backlight assembly and display device having the same

    公开(公告)号:US09671546B2

    公开(公告)日:2017-06-06

    申请号:US14297283

    申请日:2014-06-05

    Abstract: Provided are a backlight assembly and a display device having the same. A backlight assembly includes a light source unit which emits light, a light guide plate (LGP) including an incident surface upon which light emitted from the light source unit is incident, an opposite surface which faces the incident surface, and an exit surface which connects the incident surface and the opposite surface and from which light incident upon the incident surface exits, a wavelength conversion member which is located on the exit surface and converts a wavelength of light output from the exit surface, and a first reflective member which is located on the opposite surface and reflects light incident upon the opposite surface, wherein the first reflective member includes a plurality of first color patterns which face the opposite surface.

    Display device
    6.
    发明授权
    Display device 有权
    显示设备

    公开(公告)号:US09541783B2

    公开(公告)日:2017-01-10

    申请号:US14751632

    申请日:2015-06-26

    Abstract: A display device includes a bottom chassis on which a light source is disposed, a light guide plate disposed on the bottom chassis and configured to guide light emitted from the light source to a display panel, an optical sheet on the light guide plate, a mold frame coupled to the bottom chassis and including a support unit on which the display panel is disposed, and a light conversion shielding member disposed on a surface of the support unit of the mold frame having a side portion that extends down from the support unit and covers a side surface of the optical sheet.

    Abstract translation: 一种显示装置,包括:底板,配置有光源;导光板,其设置在所述底架上,用于将从所述光源发射的光引导到显示面板,所述导光板上的光学片,模具 框架,其联接到底部底盘并且包括其上布置有显示面板的支撑单元,以及设置在模具框架的支撑单元的表面上的光转换屏蔽构件,其具有从支撑单元向下延伸的侧部 光学片的侧表面。

    Light-emitting diode package and method of manufacturing the same
    7.
    发明授权
    Light-emitting diode package and method of manufacturing the same 有权
    发光二极管封装及其制造方法

    公开(公告)号:US09447932B2

    公开(公告)日:2016-09-20

    申请号:US14306127

    申请日:2014-06-16

    CPC classification number: F21K9/90 H01L33/44 H01L33/502 H01L33/507 H01L33/644

    Abstract: A light-emitting diode (LED) package and a method of manufacturing the same are provided. The LED package includes a package mold, an LED chip located on a surface of the package mold, and a wavelength converter located on the surface of the package mold and separated from the LED chip. The wavelength converter includes a first barrier layer located on the surface of the package mold, a wavelength conversion layer located on the first barrier layer, and a second barrier layer located on the wavelength conversion layer.

    Abstract translation: 提供一种发光二极管(LED)封装及其制造方法。 LED封装包括封装模具,位于封装模具表面上的LED芯片和位于封装模具表面上并与LED芯片分离的波长转换器。 波长转换器包括位于封装模具表面上的第一阻挡层,位于第一阻挡层上的波长转换层和位于波长转换层上的第二阻挡层。

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