Substrate polishing apparatus
    2.
    发明授权

    公开(公告)号:US09969047B2

    公开(公告)日:2018-05-15

    申请号:US15138630

    申请日:2016-04-26

    CPC classification number: B24B37/20 B24B27/0015 B24B27/0076 B24B37/10

    Abstract: A substrate polishing apparatus includes a support part on which at least one substrate is disposed, a plurality of first moving parts disposed at both opposite sides of the support part in a second direction crossing a first direction, and configured to upwardly extend and reciprocate in the first direction, a second moving part disposed between the plurality of first moving parts in the second direction and connected to an upper side of the first moving parts, a plurality of polishing units disposed at a lower portion of the second moving part and configured to contact an upper surface of the substrate, and a plurality of nozzles disposed at the lower portion of the second moving part and configured to spray slurry to the substrate where the polishing units rotate and revolve along a predetermined trajectory.

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