公开(公告)号：US20220216451A1

公开(公告)日：2022-07-07

申请号：US17443417

申请日：2021-07-26

Applicant: Samsung Display Co., Ltd.

Inventor： Soyeon JOO ,  Hanho PARK ,  Jeongeun PARK ,  Jeongmin BAN ,  Joongmok LEE ,  Chungseok LEE ,  Seoungbum PYOUN

IPC: H01L51/56

Abstract: An apparatus for manufacturing a display device, includes: a stage; a temperature controlling portion on the stage, and to receive a member seated on the temperature controlling portion; and a jig portion facing the temperature controlling portion, the jig portion to move linearly, and to receive an adhesive member. The jig portion includes: a first support plate; a second support plate facing the first support plate; and a pressurization plate on the first support plate and the second support plate, the pressurization plate to receive the adhesive member thereon. An end of the pressurization plate is spaced further from the member than an end of the first support plate and an end of the second support plate when the member is seated on the temperature controlling portion.

公开(公告)号：US20240361650A1

公开(公告)日：2024-10-31

申请号：US18765292

申请日：2024-07-07

Applicant: Samsung Display Co., Ltd.

Inventor： Sujeong KIM ,  Hanho PARK ,  Sangwon YEO ,  Daegeun LEE ,  Joonsam KIM

IPC: G02F1/1345 ,  G06F3/044 ,  H01L23/00 ,  H05K1/11 ,  H10K59/129 ,  H10K59/131 ,  H10K59/40 ,  H10K77/10 ,  H10K102/00

CPC classification number: G02F1/13458 ,  H01L24/06 ,  H10K59/129 ,  H10K59/131 ,  H10K59/40 ,  H10K77/111 ,  G06F3/044 ,  H01L2224/0217 ,  H01L2224/0603 ,  H01L2224/0605 ,  H01L2224/06132 ,  H01L2924/12044 ,  H05K1/111 ,  H05K2201/09409 ,  H05K2201/10128 ,  H10K2102/311

Abstract: A display device including a display panel including a base layer, a circuit layer disposed on the base layer, and a pad part having a plurality of pads disposed on the base layer; and a driving chip disposed on the pad part and including a plurality of chip pads. The plurality of pads include a first pad having a smaller area than a corresponding chip pad among the plurality of chip pads and a second pad electrically connected to the circuit layer.