公开(公告)号：US20220216451A1

公开(公告)日：2022-07-07

申请号：US17443417

申请日：2021-07-26

Applicant: Samsung Display Co., Ltd.

Inventor： Soyeon JOO ,  Hanho PARK ,  Jeongeun PARK ,  Jeongmin BAN ,  Joongmok LEE ,  Chungseok LEE ,  Seoungbum PYOUN

IPC: H01L51/56

Abstract: An apparatus for manufacturing a display device, includes: a stage; a temperature controlling portion on the stage, and to receive a member seated on the temperature controlling portion; and a jig portion facing the temperature controlling portion, the jig portion to move linearly, and to receive an adhesive member. The jig portion includes: a first support plate; a second support plate facing the first support plate; and a pressurization plate on the first support plate and the second support plate, the pressurization plate to receive the adhesive member thereon. An end of the pressurization plate is spaced further from the member than an end of the first support plate and an end of the second support plate when the member is seated on the temperature controlling portion.

公开(公告)号：US20200373276A1

公开(公告)日：2020-11-26

申请号：US16799811

申请日：2020-02-24

Applicant: Samsung Display Co., LTD.

Inventor： Chung-Seok LEE ,  Joongmok LEE ,  Eunjeong JEON

IPC: H01L23/00 ,  H01L27/12

Abstract: A flexible circuit film bonding apparatus includes: a stage configured to support a TFT substrate; a pressing head configured to press and heat a flexible circuit film attached on the TFT substrate with an anisotropic conductive film interposed therebetween; a backup plate configured to support and heat the TFT substrate positioned below the flexible circuit film; and a heating control unit configured to control a temperature of a lower surface of the pressing head and an upper surface of the backup plate, wherein the temperature of the upper surface of the backup plate is less than 170 degrees Celsius.