ORGANIC LIGHT-EMITTING DIODE DISPLAY DEVICE

    公开(公告)号:US20210210733A1

    公开(公告)日:2021-07-08

    申请号:US17212003

    申请日:2021-03-25

    Abstract: An display device including a substrate, an organic light-emitting diode, and a thin film encapsulation layer. The organic light-emitting diode is disposed on the substrate. The thin film encapsulation layer is disposed on the organic light-emitting diode. The thin film encapsulation layer includes at least one inorganic layer, at least one organic layer, and a first refractive-index control layer. The at least one organic layer is alternately disposed with the at least one inorganic layer. The first refractive-index layer is disposed between one of the at least one inorganic layer and one of the at least one organic layer disposed adjacent to each other. The first refractive-index control layer has a refractive-index variation ratio per unit length (Δn/nm) from about 0.001/nm to about 0.002/nm along a direction from the organic light-emitting diode toward the thin film encapsulation layer.

    DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20250126939A1

    公开(公告)日:2025-04-17

    申请号:US18908586

    申请日:2024-10-07

    Abstract: A display apparatus includes: a pixel electrode; a conductive bank layer defining a bank opening overlapping the pixel electrode, the conductive layer including a first conductive layer and a second conductive layer; an intermediate layer arranged in the bank opening and overlapping the pixel electrode; an opposite electrode arranged in the bank opening and disposed on the intermediate layer; and a first inorganic encapsulation layer disposed on the opposite electrode, filling the bank opening, and including an inorganic material. The first inorganic encapsulation layer includes a first portion overlapping the bank opening, and a second portion overlapping the conductive bank layer, and an upper surface of the first portion of the first inorganic encapsulation layer and an upper surface of the second portion of the first inorganic encapsulation layer are at a level higher than an upper surface of the conductive bank layer.

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