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公开(公告)号：US11342487B2
公开(公告)日：2022-05-24
申请号：US16646700
申请日：2018-09-14
发明人： Won Jung Kim , Ki Seok Kim , June O Song , Chang Man Lim
摘要： A light emitting device package according to an embodiment may comprise: a first package body including a first and a second opening; a light emitting device disposed on the first package body and including a first and a second bonding part; and a first resin disposed between the first package body and the light emitting device. The light emitting device may comprise one surface on which the first and second bonding parts are disposed, the first bonding part may comprise a first side surface and a lower surface facing the first package body, and the second bonding part may comprise a second side surface opposite to the first side surface, and a lower surface facing the first package body. The first resin may comprise an upper surface disposed on the one surface of the light emitting device, a third side surface extending from the upper surface to the lower surface of the first bonding part along the first side surface of the first bonding part, and a fourth side surface extending from the upper surface to the lower surface of the second bonding part along the second side surface of the second bonding part.
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公开(公告)号：US11329205B2
公开(公告)日：2022-05-10
申请号：US16768304
申请日：2018-11-30
发明人： Chang Man Lim , June O Song , Ki Seok Kim
摘要： A light emitting device package according to an embodiment may include first and second frames, a body, a light emitting device, first and second conductive parts, and first and second conductors. According to the embodiment, first and second frames may be spaced apart from each other and include first and second openings, respectively. The body may be disposed between the first and second frames. The light emitting device may be disposed on the body and include first and second bonding parts. The first and second conductive parts may be disposed under the first and second bonding parts. The first and second conductors may be disposed in the first and second openings, respectively. According to the embodiment, the first and second conductive parts may extend into the first and second openings from the first and second bonding parts, respectively, and the first and second conductors may be disposed between the first and second conductive parts and the first and second frames, respectively.
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公开(公告)号：US11735702B2
公开(公告)日：2023-08-22
申请号：US17261405
申请日：2019-07-19
发明人： Won Jung Kim , June O Song , Yeong June Lee
CPC分类号： H01L33/62 , H01L25/167 , H01L33/483 , H01L33/60 , H01L33/647 , H01L24/48 , H01L33/32 , H01L2224/48245 , H01L2924/12041
摘要： A light-emitting element package according to an embodiment comprises: a body comprising a cavity; the cavity; a first frame and a second frame arranged on the bottom surface of the cavity; a first metal layer disposed on the first frame; an ultraviolet light-emitting element disposed on the first metal layer; and a second metal layer disposed on the second frame and electrically connected to the second frame, wherein the body comprises a separation portion between the first frame and the second frame, the second metal layer extends over the sloping surface of the cavity and the separation portion of the body, and the second metal layer is spaced apart from the first metal layer in the cavity and surrounds the first metal layer.
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公开(公告)号：US11367809B2
公开(公告)日：2022-06-21
申请号：US16646884
申请日：2018-09-12
发明人： Ki Seok Kim , Won Jung Kim , June O Song , Chang Man Lim
摘要： Embodiments relate to a light emitting device package and a light source device. A light emitting device package according to the embodiment may include a first package body; a second package body disposed on the first package body, and comprising an opening passing through an upper surface and a lower surface of the second package body; and a light emitting device disposed in the opening, and comprising a first bonding part and a second bonding part. The first package body may include a first opening and a second opening that pass through an upper surface and a lower surface of the first package body. The upper surface of the first package body may be coupled with the lower surface of the second package body, the first bonding part may be disposed on the first opening, and the second bonding part may be disposed on the second opening.
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公开(公告)号：US11355679B2
公开(公告)日：2022-06-07
申请号：US16760702
申请日：2018-10-31
发明人： Won Jung Kim , Ki Seok Kim , June O Song , Chang Man Lim
IPC分类号： H01L33/56 , H01L33/22 , H01L33/48 , H01L33/54 , H01L33/60 , H01L33/62 , H01L25/16 , F21K9/00
摘要： The light emitting device package disclosed in the embodiment includes a package body including first and second frames, and a first body disposed between the first and second frames; a second body disposed on the package body and including a cavity and a sub-cavity spaced apart from the cavity; a light emitting device disposed in the cavity and including first and second bonding portions; and a protection device disposed in the sub-cavity, wherein the package body and the second body may be coupled to an adhesive member.
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公开(公告)号：US11322667B2
公开(公告)日：2022-05-03
申请号：US16649553
申请日：2018-09-20
发明人： Chang Man Lim , June O Song , Won Jung Kim
IPC分类号： H01L33/56 , H01L33/38 , H01L33/48 , H01L33/50 , H01L33/54 , H01L33/60 , H01L33/62 , H01L33/46 , H01L33/20
摘要： A semiconductor device package includes a light emitting device disposed on a body, and at least one resin disposed between the body and the light emitting device. The body may include first and second opening parts passing through the body from the upper surface of the body, and at least one recess concavely provided from the upper surface of the body towards the lower surface of the body. The light emitting device may include a first bonding part disposed on the first opening part, and a second bonding part disposed on the second opening part. The at least one recess may be disposed between the first and second opening parts, and along the circumferences of the first and second opening parts. The at least one resin may be provided to the at least one recess. The at least one resin may include a reflective material.
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公开(公告)号：US11302853B2
公开(公告)日：2022-04-12
申请号：US16636457
申请日：2018-07-27
发明人： Ki Seok Kim , Hee Jeong Park , June O Song , Chang Man Lim
摘要： A semiconductor device package provided in an embodiment comprises: first and second frames spaced apart from each other; a body disposed between the first and second frames; and a semiconductor device disposed on the first and the second frame and comprising a semiconductor layer and a first and a second electrode on the semiconductor layer, wherein the first and the second frame comprise a first metal layer having a plurality of pores, and the first metal layer of the first and the second frame may comprise coupling portions in regions where the first metal layer overlaps the first and the second electrode, respectively.
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公开(公告)号：US11205740B2
公开(公告)日：2021-12-21
申请号：US16643279
申请日：2018-08-31
发明人： Chang Man Lim , Ki Seok Kim , Won Jung Kim , June O Song
IPC分类号： H01L33/48 , H01L25/075 , H01L25/16 , H01L29/866 , H01L33/50 , H01L33/56 , H01L33/60 , H01L33/62
摘要： A light emitting device package according to an embodiment has a first frame and a second frame arranged to be spaced apart from each other, a third frame arranged between the first frame and the second frame and spaced apart from the first frame and the second frame, a body supporting the first to third frames, a first light emitting device arranged on the body and electrically connected to the first frame and the third frame, and a second light emitting device arranged on the body and electrically connected to the second frame and the third frame. The body has a first recess in an upper area between the first frame and the third frame, and a second recess in an upper area between the third frame and the second frame. An embodiment may have a first resin part arranged in the first recess, and a second resin part arranged in the second recess. The first light emitting device has a first bonding portion and a second bonding portion, and may be arranged on the first resin part and electrically connected to the first frame and the third frame. The second light emitting device has a third bonding portion and a fourth bonding portion, and may be arranged on the second resin part and electrically connected to the second frame and the third frame.
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公开(公告)号：US11749778B2
公开(公告)日：2023-09-05
申请号：US16641296
申请日：2018-08-24
发明人： Chang Hyeong Lee , June O Song , Tae Sung Lee , Chang Man Lim , Se Yeon Jung , Byung Yeon Choi , Sung Min Hwang
CPC分类号： H01L33/10 , H01L33/405 , H01L33/48 , H01L33/38
摘要： A semiconductor device according to an embodiment may include: a light emitting structure; a light transmitting electrode layer disposed on the light emitting structure; and a reflective layer disposed on the light transmitting electrode layer and including a plurality of first openings and a plurality of second openings. The semiconductor device according to the embodiment may include: a first electrode in contact with a first conductivity type semiconductor layer of the light emitting structure; and a second electrode in contact with the light transmitting electrode layer through the plurality of first openings. The first electrode may include a first sub-electrode and a plurality of first branch electrodes, wherein the plurality of first branch electrodes are arranged extending toward the second electrode from the first sub-electrode; the second electrode may include a second sub-electrode and a plurality of second branch electrodes, wherein the plurality of second branch electrodes are arranged extending toward the first electrode from the second sub-electrode; and the plurality of first branch electrodes and the plurality of second branch electrodes may be alternately disposed on an upper surface of the reflective layer.
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公开(公告)号：US11374153B2
公开(公告)日：2022-06-28
申请号：US16756952
申请日：2018-10-16
发明人： June O Song , Ki Seok Kim , Won Jung Kim
IPC分类号： H01L33/48 , H01L33/62 , H01L25/16 , H01L25/075
摘要： A light emitting device package according to an embodiment may include: a first frame including a first opening passing through upper and lower surfaces, and a second frame spaced apart from the first frame and including a second opening; first and second conductive layers disposed in the first and second openings, respectively; a body disposed between the first and second frames; a first resin disposed on the body; and a light emitting device disposed on the first resin. According to an embodiment, the light emitting device may include a first bonding part electrically connected with the first frame and a second bonding part spaced apart from the first bonding part and electrically connected with the second frame, and the first and second bonding parts may be disposed on the first and second openings, respectively. According to an embodiment, the first and second frames may include first and second metal layers having third and fourth openings passing through upper and lower surfaces around the first and second openings, respectively, and widths of the first and second bonding parts in a horizontal direction may be greater than widths of upper surfaces of the first and second openings in the horizontal direction.
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