公开(公告)号：US20240379480A1

公开(公告)日：2024-11-14

申请号：US18315964

申请日：2023-05-11

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： YongMoo Shin ,  SeongKuk Kim ,  SinJae Kim ,  SeokBeom Heo

IPC: H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/00 ,  H01L23/552

Abstract: A semiconductor device has a substrate. An electrical component is disposed over a first surface of the substrate. A solder paste is disposed over the first surface of the substrate. A conductive pillar is disposed on the solder paste. An encapsulant is deposited over the first surface of the substrate, the electrical component, and the conductive pillar. A solder bump is formed over the conductive pillar.