公开(公告)号：US10355038B2

公开(公告)日：2019-07-16

申请号：US15653819

申请日：2017-07-19

Applicant: Sony Corporation

Inventor： Yoichi Ootsuka ,  Tomoyuki Yamashita ,  Kiyotaka Tabuchi ,  Yoshinori Toumiya ,  Akiko Ogino

IPC: H01L27/00 ,  H01L27/146 ,  H04N5/335

Abstract: A solid-state imaging device includes: a first lens layer; and a second lens layer, wherein the second lens layer is formed at least at a periphery of each first microlens formed based on the first lens layer, and the second lens layer present at a central portion of each of the first microlenses is thinner than the second lens layer present at the periphery of the first microlens or no second lens layer is present at the central portion of each of the first microlenses.

公开(公告)号：US20180019270A1

公开(公告)日：2018-01-18

申请号：US15719015

申请日：2017-09-28

Applicant: Sony Corporation

Inventor： Tomoharu Ogita ,  Atsushi Yamamoto ,  Keiji Tatani ,  Yoichi Ootsuka ,  Kiyotaka Tabuchi

IPC: H01L27/146 ,  H04N9/04 ,  H04N5/378 ,  H01L27/148

Abstract: A solid-state imaging device includes pixels each having a photoelectric conversion element for converting incident light to an electric signal, color filters associated with the pixels and having a plurality of color filter components, microlenses converging the incident light through the color filters to the photoelectric conversion elements, a light shielding film disposed between the color filter components of the color filters, and a nonplanarized adhesive film provided between the color filters and the light shielding film.

公开(公告)号：US09812480B2

公开(公告)日：2017-11-07

申请号：US15431899

申请日：2017-02-14

Applicant: Sony Corporation

Inventor： Tomoharu Ogita ,  Atsushi Yamamoto ,  Keiji Tatani ,  Yoichi Ootsuka ,  Kiyotaka Tabuchi

IPC: H01L27/146 ,  H04N5/378 ,  H04N9/04 ,  H01L27/148

CPC classification number: H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/14868 ,  H04N5/378 ,  H04N9/045

Abstract: A solid-state imaging device includes pixels each having a photoelectric conversion element for converting incident light to an electric signal, color filters associated with the pixels and having a plurality of color filter components, microlenses converging the incident light through the color filters to the photoelectric conversion elements, a light shielding film disposed between the color filter components of the color filters, and a nonplanarized adhesive film provided between the color filters and the light shielding film.

公开(公告)号：US20160111462A1

公开(公告)日：2016-04-21

申请号：US14976905

申请日：2015-12-21

Applicant: Sony Corporation

Inventor： Tomoharu Ogita ,  Atsushi Yamamoto ,  Keiji Tatani ,  Yoichi Ootsuka ,  Kiyotaka Tabuchi

IPC: H01L27/146

CPC classification number: H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/14868 ,  H04N5/378 ,  H04N9/045

Abstract: An imaging device includes a plurality of photoelectric conversion elements, a plurality of color filter components having a first color filter component and a second color filter component; a light shielding portion, at least a part of which is disposed between the first and second color filter components in a cross-section view; and a transparent film, at least a first part of which is disposed between the first color filter component and the light shielding portion in the cross-section view. A surface of the transparent film facing to the first and second color filter components is nonplanar, and a thickness of the transparent film is less than a thickness of the light shielding portion.

Abstract translation: 一种成像装置包括多个光电转换元件，具有第一滤色器部件和第二滤色器部件的多个滤色器部件; 光屏蔽部分，其至少一部分在横截面图中设置在第一和第二滤色器部件之间; 以及透明膜，其截面图中的至少第一部分设置在第一滤色器部件和遮光部之间。 面向第一和第二滤色器部件的透明膜的表面是非平面的，并且透明膜的厚度小于遮光部分的厚度。

公开(公告)号：US11289525B2

公开(公告)日：2022-03-29

申请号：US15559345

申请日：2016-03-11

Applicant: SONY CORPORATION

Inventor： Hajime Yamagishi ,  Kiyotaka Tabuchi ,  Masaki Okamoto ,  Takashi Oinoue ,  Minoru Ishida ,  Shota Hida ,  Kazutaka Yamane

IPC: H01L27/146 ,  H01L27/14 ,  H01L23/522 ,  H01L23/528 ,  H01L23/552 ,  H01L23/48 ,  H04N5/357 ,  H04N5/365 ,  H04N5/376 ,  H04N5/378

Abstract: This technology relates to a solid-state imaging device and an electronic apparatus by which image quality can be enhanced. The solid-state imaging device includes a pixel region in which a plurality of pixels are arranged, a first wiring, a second wiring, and a shield layer. The second wiring is formed in a layer lower than that of the first wiring, and the shield layer is formed in a layer lower at least than that of the first wiring. This technology is applicable to a CMOS image sensor, for example.

公开(公告)号：US11211417B2

公开(公告)日：2021-12-28

申请号：US16440684

申请日：2019-06-13

Applicant: Sony Corporation

Inventor： Yoichi Ootsuka ,  Tomoyuki Yamashita ,  Kiyotaka Tabuchi ,  Yoshinori Toumiya ,  Akiko Ogino

IPC: H01L27/14 ,  H01L27/146 ,  H04N5/335

Abstract: A solid-state imaging device includes: a first lens layer; and a second lens layer, wherein the second lens layer is formed at least at a periphery of each first microlens formed based on the first lens layer, and the second lens layer present at a central portion of each of the first microlenses is thinner than the second lens layer present at the periphery of the first microlens or no second lens layer is present at the central portion of each of the first microlenses.

公开(公告)号：US09508767B2

公开(公告)日：2016-11-29

申请号：US15078146

申请日：2016-03-23

Applicant: Sony Corporation

Inventor： Tomoharu Ogita ,  Atsushi Yamamoto ,  Keiji Tatani ,  Yoichi Ootsuka ,  Kiyotaka Tabuchi

IPC: H01L27/146 ,  H01L27/148 ,  H04N9/04 ,  H04N5/378

CPC classification number: H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/14868 ,  H04N5/378 ,  H04N9/045

Abstract: A solid-state imaging device includes pixels each having a photoelectric conversion element for converting incident light to an electric signal, color filters associated with the pixels and having a plurality of color filter components, microlenses converging the incident light through the color filters to the photoelectric conversion elements, a light shielding film disposed between the color filter components of the color filters, and a nonplanarized adhesive film provided between the color filters and the light shielding film.

公开(公告)号：US20160013234A1

公开(公告)日：2016-01-14

申请号：US14861175

申请日：2015-09-22

Applicant: c/o SONY CORPORATION

Inventor： Yoichi Ootsuka ,  Tomoyuki Yamashita ,  Kiyotaka Tabuchi ,  Yoshinori Toumiya ,  Akiko Ogino

IPC: H01L27/146

CPC classification number: H01L27/14627 ,  H01L27/14612 ,  H01L27/14621 ,  H01L27/14685 ,  H04N5/335

Abstract: A solid-state imaging device includes: a first lens layer; and a second lens layer, wherein the second lens layer is formed at least at a periphery of each first microlens formed based on the first lens layer, and the second lens layer present at a central portion of each of the first microlenses is thinner than the second lens layer present at the periphery of the first microlens or no second lens layer is present at the central portion of each of the first microlenses.

Abstract translation: 固态成像装置包括：第一透镜层; 以及第二透镜层，其中所述第二透镜层至少形成在基于所述第一透镜层形成的每个第一微透镜的周边，并且存在于所述第一微透镜的每一个的中心部分处的所述第二透镜层比 存在于第一微透镜的周边的第二透镜层或者没有第二透镜层存在于每个第一微透镜的中心部分。

公开(公告)号：US20140300785A1

公开(公告)日：2014-10-09

申请号：US14277383

申请日：2014-05-14

Applicant: Sony Corporation

Inventor： Tomoharu Ogita ,  Atsushi Yamamoto ,  Keiji Tatani ,  Yoichi Ootsuka ,  Kiyotaka Tabuchi

IPC: H04N9/04 ,  H01L27/146

CPC classification number: H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/14868 ,  H04N5/378 ,  H04N9/045

Abstract: A solid-state imaging device includes pixels each having a photoelectric conversion element for converting incident light to an electric signal, color filters associated with the pixels and having a plurality of color filter components, microlenses converging the incident light through the color filters to the photoelectric conversion elements, a light shielding film disposed between the color filter components of the color filters, and a nonplanarized adhesive film provided between the color filters and the light shielding film.

Abstract translation: 固态成像装置包括各自具有用于将入射光转换为电信号的光电转换元件的像素，与像素相关联的滤色器和具有多个滤色器组件的微透镜，将入射光通过滤色器会聚到光电 转换元件，设置在滤色器的滤色器组件之间的遮光膜和设置在滤色器和遮光膜之间的非平面化粘合剂膜。

公开(公告)号：US20130207215A1

公开(公告)日：2013-08-15

申请号：US13745101

申请日：2013-01-18

Applicant: Sony Corporation

Inventor： Yoichi Otsuka ,  Yoshiyuki Enomoto ,  Kazunori Nagahata ,  Tadayuki Kimura ,  Toshihiko Hayashi ,  Kenichi Aoyagi ,  Kiyotaka Tabuchi ,  Iwao Sugiura ,  Kensaku Maeda

IPC: H01L27/146

CPC classification number: H01L27/14625 ,  G02B5/201 ,  G02B5/223 ,  H01L27/14621 ,  H01L27/14685

Abstract: A solid-state imaging device has: an imaging region in which a plurality of pixels each having a photoelectric conversion element are arranged, and a color filter. The color filter includes: filter components of a first color (2G), filter components of a second color (2R) formed by self-alignment and each being surrounded by the filter components of the first color (2G), and filter components of a third color (2B) formed by self-alignment and each being surrounded by the filter components of the first color (2G).