公开(公告)号：US20240063077A1

公开(公告)日：2024-02-22

申请号：US18137809

申请日：2023-04-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongbeom PARK ,  Hansung RYU ,  Kangjoon LEE

IPC: H01L23/367 ,  H01L25/18 ,  H10B80/00 ,  H01L23/00 ,  H01L23/427 ,  H01L23/433

CPC classification number: H01L23/367 ,  H01L25/18 ,  H10B80/00 ,  H01L24/06 ,  H01L24/05 ,  H01L24/16 ,  H01L24/17 ,  H01L23/427 ,  H01L23/433 ,  H01L25/0657

Abstract: A semiconductor package includes a package base substrate, a first semiconductor chip on the package base substrate, a second semiconductor chip on the package base substrate, and spaced apart from the first semiconductor chip in a first horizontal direction, a reinforcing structure on the package base substrate, and spaced apart from the second semiconductor chip in a second horizontal direction intersecting the first horizontal direction, and a heat transfer pad between the second semiconductor chip and the reinforcing structure.