Abstract:
An exhausting apparatus includes an exhaust pump configured to extract unreacted precursor in a process chamber and vent the unreacted precursor out of the exhaust pump, and a first material supplier configured to supply a first material into the exhaust pump. The first material is adsorbable on an interior surface of the exhaust pump to prevent the unreacted precursor from being adsorbed on the interior surface of the exhaust pump.
Abstract:
Provided are gas injection apparatuses, thin-film deposition equipment, and methods for manufacturing a semiconductor device. The gas injection apparatus includes: a base plate; a first gas separation region on the base plate; first and second source gas supplying regions disposed on the base plate to either side of the first gas separation region, respectively, and configured to supply a source gas; and a first reaction gas supplying region disposed at a position on the base plate other than between the first gas separation region and the first source gas supplying region and between the first gas separation region and the second source gas supplying region, and configured to supply a reaction gas, wherein the first source gas supplying region and the second source gas supplying region protrude from the base plate, wherein each of the first source gas supplying region and the second source gas supplying region has a fan-shaped upper face, and wherein the first gas separation region is defined by a side wall of the first source gas supplying region and a side wall of the second source gas supplying region, the side walls facing each other and extending in radial directions.